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http://dx.doi.org/10.7735/ksmte.2012.21.3.408

Deformation Analysis of a Metal Mask for the Screen Printing of Micro Bumps  

Lee, K.Y. (서울과학기술대학교 NID융합기술대학원)
Lee, H.J. (한국생산기술연구원 미래융합연구그룹)
Kim, J.B. (서울과학기술대학교 기계자동차공학과)
Park, K. (서울과학기술대학교 기계시스템디자인공학과)
Publication Information
Journal of the Korean Society of Manufacturing Technology Engineers / v.21, no.3, 2012 , pp. 408-414 More about this Journal
Abstract
Screen printing is a printing method that uses a woven mesh to support an ink-blocking stencil by transferring ink or other printable materials in order to form an image onto a substrate. Recently, the screen printing method has applied to micro-electronic packaging by using solder paste as a printable material. For the screen printing of solder paste, metal masks containing a number of micro-holes are used as a stencil material. The metal mask undergoes deformation when it is installed in the screen printing machine, which results in the deformation of micro-holes. In the present study, finite element (FE) analysis was performed to predict the amount of deformation of a metal mask. For an efficient calculation of the micro-holes of the metal mask, the sub-domain analysis method was applied to perform FE analyses connecting the global domain (the metal mask) and the local domain (micro-holes). The FE analyses were then performed to evaluate the effects of slot designs on the deformation characteristics, from which more uniform and adjustable deformation of the metal mask can be obtained.
Keywords
Metal mask; Screen printing; Micro bumps; Finite element analysis; Sub-domain analysis;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
연도 인용수 순위
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