1 |
Kim, M., Ahn, B., and Jung, J., 2001, "A study on Melting Phenomena of Solder Paste," J. Microelecton Packag. Soc., Vol. 8, No. 1, p. 5-11.
과학기술학회마을
|
2 |
Evans, J. W., and Beddow, J. K., 1987, "Characterization of Particle Morphology and Rheological Behavior in Solder Paste," IEEE Trans. Compon., Hybrids, Manuf. Technol., Vol. 10, No. 2, pp. 224-231.
DOI
|
3 |
Loomanm, D., 2007, "Submodeling in ANSYS Workbench," ANSYS Advantage, Vol. 1, No. 2, pp. 34-36.
|
4 |
Crawford, G. P., 2005, Flexible flat panel display, John Wiley & Sons, New York.
|
5 |
Pardo, D. A., Jabbour, G. E., and Peyghambarian, N., 2000, "Application of Screen Printing in the Fabrication of Organic Light-emitting Devices," J. Adv. Mater., Vol. 12, No. 17, pp. 1249-1252.
DOI
ScienceOn
|
6 |
Seo, W. S., Min, B. W., Park, K., Lee, H. J., and Kim, J. B., 2012, "Improvement of Filling Characteristics of Micro-bumps in the Stencil Printing Process," Jour. of KSMTE, Vol. 21, No. 1, pp. 26-32.
|
7 |
Krebs, F. C., Fyenbo, J., and Jorgensen, M., 2010, "Product Integration of Compact Roll-to-roll Processed Polymer Solar Cell Modules: Methods and Manufacture using Flexographic Printing," J. Mater. Chem., Vol. 20, No. 41, pp. 8994-9001.
DOI
ScienceOn
|
8 |
Lee, J., Cho, S., Lee, Y., Kim, K., Cheon, C., and Jung, J., 2005, "Aging Characteristics of Sn-1.8 Bi 0.7-Cu0.6 in Solder," J. Microelecton Packag. Soc., Vol. 12, No. 4, pp. 301-306.
과학기술학회마을
|
9 |
Ko, Y. K., Shin, Y. S., Yoo, S., and Lee, C. W., 2009, "Via Filling Technique with Molten Solder and Low Temperature Solder Bump for 3D Packaging," Proc. 2009 Fall Conf. Kor. Soc. Prec. Engng., pp. 699-700.
과학기술학회마을
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