• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.7 no.4
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• pp.79-88
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• 1998

This study deals with the development of CAM system which can machine and measure any shape of mold and die by machining center and coordinate measureing machine . The overall goal of the CAM system is to achieve the mold and die machining , from digitizing through to final cutting. The hardware of the system comprises PC and machining center. CMM. There are three steps in the mold and die machining. (1) measuring of physical model by the CMM, (2) geometric modeling by the CAD system, (3) generation of NC code by the tool path compensated for tool radius. It is developed a software package, with which can conduct a micro CAM system in the PC without economical burden.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.438-442
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• 1997

The pupose of this study is the development of CAM system which can cut any shape by CNC lathe.. The overall goal of the CAM system is to achieve the CNC lathe machining, form roughing through to final measuring. The hardware of the system comprises PC and CNC lathe. There are three steps in the CNC lathe machining, (1) geometric modeling by the shape patterns, (2) NC commands generation by the tool path compensated for tool nose radius,(3) machining and workpiece measuring on the lathe. It is developed a software package, with which can conduct a micro CAM system in the PC without economical burden.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.554-559
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• 1999

The purpose of this study is the machining of texture shapes by the contour fitting data. The hardware of the system comprises PC and scanning system, CO2 laser machine. There are four steps, (1) text image loading using scanning shapes or 2D image files, (2) generation of contour fitting data by the line and arc, cubic Bezier curve, (3) generation of NC code from the contouring fitting data, (4) machining by the DNC system. It is developed a software package, with which can conduct a micro CAM system of CNC laser machine in the PC without economical burden.

• Journal of Sensor Science and Technology
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• v.14 no.4
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• pp.265-271
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• 2005

In this study, a variable capacitive pressure sensor is fabricated for TPMS (Tire Pressure Monitoring System). This study is for developing sensors which consecutively measure the tire pressure given as 30 psi from the industrial standard. For improving non-linearity of the prior capacitive pressure sensors, it is suggested that touch mode capacitive pressure sensor be applied. In addition, initial capacitance is designed as small as possible for the conformity to the wireless sensor. ANSYS, commercial FEA package, is used for designing and simulating the sensor. The device is progressed by MEMS (Micro Electro Mechanical Systems) fabrication and packaged with PDMS. The result is obtained sensitivity, 1 pF/psi, through a pressure test. The simulation result is discrepant from experiment one. Wafer's uniformity is presumed as the main reason of discrepancy.

• Fire Science and Engineering
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• v.6 no.2
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• pp.33-39
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• 1992

This work presents an expert system for the classification of a given substance and thus enabling one to select the proper container in consultation with the computer. The system consists of 34 rules and uses Micro Expert as a shell program based on backward chaining method. The prototype system will have to be under extensive test. However, its use is bound to have advantages over conventional methods, e.g. looking up in a reference book or using conventional programs with a database. Since the expert system determines the group of the given substance not by its name but by its physical and chemical properties, it is not necessary to add data items even for newly synthesized substances. The system also provides reasoning for its determination and therefore it can be used as a good package for the training of unskilled operators.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.11-15
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• 2017

As the heat dissipation problem is increased in 3D multi flip chip packages, an improvement of thermal conductivity in bonding interfaces is required. In this study, the effect of alumina filler addition was investigated in non-conductive paste(NCP). The fine alumina filler having average particles size of 400 nm for the fine pitch interconnection was used. As the alumina filler content was increased from 0 to 60 wt%, the thermal conductivity of the cured product was increased up to 0.654 W/mK at 60 wt%. It was higher value than 0.501 W/mK which was reported for the same amount of silica. It was also found out that the addition of fine sized alumina filler resulted in the smaller decrease in thermal conductivity than the larger sized particles. The viscosity of NCP with alumina addition was increased sharply at the level of 40 wt%. It was due to the increase of the interaction between the filler particles according to the finer particle size. In order to achieve the appropriate viscosity and excellent thermal conductivity with fine alumina fillers, the highly efficient dispersion process was considered to be important.

• Publications of The Korean Astronomical Society
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• v.15 no.spc2
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• pp.45-52
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• 2000

Four plasma instruments are currently under development for KAISTSAT-4 (K-4) which is scheduled for launch in 2002. They are the Solid-State Telescope, Electro-Static Analyzer, Langmuir Probe, and the Scientific Magnetometer, that will respectively allow in-situ detection of high energy and low energy components of auroral particles, ionospheric thermal electrons, and magnetic field disturbances. These instruments, together with the Far-ultraviolet IMaging Spectrograph, will provide micro-scale physics of Earth's polar ionosphere with detailed spectral information that has not been previously achieved with other space missions. In this paper, we review the concept of the four space plasma instruments as well as the anticipated results from the instruments.

• Imaging Science in Dentistry
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• v.50 no.2
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• pp.161-168
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• 2020

Purpose: The aim of this study was to evaluate the influence of voxel size and different post-processing algorithms on the analysis of dental materials using micro-computed tomography (micro-CT). Materials and Methods: Root-end cavities were prepared in extracted maxillary premolars, filled with mineral trioxide aggregate (MTA), Biodentine, and Intermediate Restorative Material (IRM), and scanned using micro-CT. The volume and porosity of materials were evaluated and compared using voxel sizes of 5, 10, and 20 ㎛, as well as different software tools(post-processing algorithms). The CTAn or MeVisLab/Materialise 3-matic software package was used to perform volume and morphological analyses, and the CTAn or MeVisLab/Amira software was used to evaluate porosity. Data were analyzed using 1-way ANOVA and the Tukey test(P<0.05). Results: Using MeVisLab/Materialise 3-matic, a consistent tendency was observed for volume to increase at larger voxel sizes. CTAn showed higher volumes for MTA and IRM at 20 ㎛. Using CTAn, porosity values decreased as voxel size increased, with statistically significant differences for all materials. MeVisLab/Amira showed a difference for MTA and IRM at 5 ㎛, and for Biodentine at 20 ㎛. Significant differences in volume and porosity were observed in all software packages for Biodentine across all voxel sizes. Conclusion: Some differences in volume and porosity were found according to voxel size, image-processing software, and the radiopacity of the material. Consistent protocols are needed for research evaluating dental materials.

• Journal of Biomedical Engineering Research
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• v.38 no.6
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• pp.277-284
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• 2017

This paper presents an implantable pH measurement electrode for wireless gastroesophageal reflux measurement. Usually, gastroesophageal reflux is diagnosed by a catheter-type wire connection between the esophagus and the diagnostic device which brings many side effects such as restriction of daily living, pain, and discomfort in the nasal cavity and pharynx of patients. In order to solve these issues, researchers have been studied a wireless measurement method and a micro-sized pH electrode for human body insertion is necessary. Commercial glass packaged pH meter is formed by a sensing and a reference electrodes in a KCl solution. However, if the glass meter is inserted into the human body, there are risks of leakage of the solution, breakage of the glass package, injury of the body elements. Therefore, the solution should be solidified on the micro-sized noble metal wire which has a characteristic of biocompatible. After solidified wire fabrication, the designed meter was tested for feasibility of measurement and the result was well agreed with pH values of commercial pH meter. Potentials in pH 1 to 12 solution was measured to obtain the sensitivity of the sensor with linearity. And we have designed a simulation of gastroesophageal reflux with symptom frequency, interval, and duration time in pH 2 solution. The proposed sensor has capable to get the same potential for 24 measurements in 3 days, and it has sensed same pH values of 2 for one hour with every 10 minutes. Furthermore, the sensor was survived for 48 hours with reasonable potentials in the acid solution.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.59-64
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• 2013

In-situ annealing tests of Cu/Ni/Au/Sn-Ag/Cu micro-bump for 3D IC package were performed in an scanning electron microscope chamber at $135-170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). The IMC growth behaviors of both $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ follow linear relationship with the square root of the annealing time, which could be understood by the dominant diffusion mechanism. Two IMC phases with slightly different compositions, that is, $(Cu,Au^a)_6Sn_5$ and $(Cu,Au^b)_6Sn_5$ formed at Cu/solder interface after bonding and grew with increased annealing time. By the way, $Cu_3Sn$ and $(Cu,Au^b)_6Sn_5$ phases formed at the interfaces between $(Cu,Ni,Au)_6Sn_5$ and Ni/Sn, respectively, and both grew with increased annealing time. The activation energies for $Cu_3Sn$ and $(Cu,Ni,Au)_6Sn_5$ IMC growths during annealing were 0.69 and 0.84 eV, respectively, where Ni layer seems to serve as diffusion barrier for extensive Cu-Sn IMC formation which is expected to contribute to the improvement of electrical reliability of micro-bump.