• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.12
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• pp.1060-1064
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• 2002

We have studied the effect of crystallization temperature, composition and film thickness, which are the fundamental processing parameters of lead zirconate titanate(PZT) thin film fabrication, in the respect of the piezoelectric properties by our pneumatic loading method(PLM). A great deal of research has been done in the field of characterization for piezoelectric thin films after the first report on the measurement for the piezoelectric coefficient of thin films in 1990. Even though the piezoelectric properties of thin films are very critical factors in the micro-electro mechanical system(MEMS) and thin film sensor devices, a few reports for the piezoelectric characterization are provided for the last decade unlikely the bulk piezoelectric devices. We have found that the piezoelectric properties of thin films are improved as the increase of crystallization temperature up to 750$\^{C}$ and this behavior can be also explained by the analysis of dielectric polarization hysteresis loop, X-ray diffraction and scanning electron microscopy. The effect of Zr/Ti composition has been also studied. This gives us the fact that the maximum piezoelectricity is found near Morphotropic Phase Boundary(MPB) as bulk PZT system does.

• Journal of the Korean Magnetics Society
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• v.5 no.1
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• pp.21-26
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• 1995

The systematic variation of complex permeability and complex permittivity and their relationship with micro-wave absorbing properties are investigated in sintered Ni-Zn ferrites of non-stoichiometric composition. The specirrens of ${(Ni_{0.5}Zn_{0.5}O)}_{1-x}(Fe_{2}O_{3})_{1+x}$ spinels were prepared by a conventional ceramic processing technique. In the present study. complex permeability and permittivity can be controlled by the variation of ${\alpha}-Fe_{2}O_{3}$ contents in the spinel lattice. The primary effect of the excess ${\alpha}-Fe_{2}O_{3}$ is to increase the dielectric constant. while the notable decrease of magnetic loss is observed in the iron-deficient ferrites. The results suggest that the matching fre-queocyand matching thickness could be controlled by the variation of ${\alpha}-Fe_{2}O_{3}$ contents in the Ni-Zn ferrite.

• Proceedings of the KIEE Conference
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• 1998.07g
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• pp.2501-2503
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• 1998

In this paper, the silicon-nitride membrane structure for IR sensor was fabricated through the etching and the direct bonding. The PTO layer as a IR detection layer was deposited on the membrane and its characteristics were measured. The attack of PTO layer during the etching of silicon wafer as well as the thermal isolation of the IR detection layer can be solved through the method of bonding/etching of silicon wafer. Because the PTO layer of c-axial orientation raised thermal polarization without polling, the more integration capability can be achieved. The surface roughness of the membrane was measured by AFM, the micro voids and the non-contacted area were inspected by IR detector, and the bonding interface was observed by SEM. The polarization characteristics and the dielectric characteristics of the PTO layer were measured, too.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.119-120
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• 2008

ILD CMP process has been well accepted for the planarization of the dielectric oxide film and becomes a critical process in ULSI manufacturing due to the rapid shrinkage of the design rule for the device. In total manufacturing process steps for a device, the proportion of ILD CMP process has been gradually increased. Ever since ILD CMP has been introduced, the scratches have been a major defects on polished surfaces which cause the electrical shorts between vias or metal lines [1,2]. It was reported that micro-scratches are caused by large, irregularly shaped particles during CMP process. Therefore, most of the CMP users have used < 5 m POU filter to remove and reduce the scratch source from the slurry. However, the scratch has always been the biggest concern in ILD polishing whatever preventive actions are taken. Silica and ceria slurries are widely used for ILD CMP process. There are not much differences in generated scratches and their formation mechanism. In this study, the scratches were investigated as a function of polishing conditions with possible explanation on formation mechanism in ILD CMP.

• Smart Structures and Systems
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• v.12 no.5
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• pp.579-594
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• 2013

A new enthalpy - based procedure for the homogenization of the electromechanical material parameters of composite piezoelectric modules with integrated electrodes is presented. It is based on a finite element (FE) modeling of the latter's representative volume element (RVE). In contrast to most previously published homogenization approaches that are based on averaged quantities, the presented method uses a direct evaluation of the electromechanical enthalpy. Hence, for the linear orthotropic piezoelectric composite behavior full set of elastic, piezoelectric, and dielectric material parameters, 17 load cases (LC) are used where each load case leads directly to one material parameter. This gives the possibility to elaborate a very strict and easy to program processing. In conjunction with the 17 LC, the enthalpy - based homogenization is particularly suitable for laminated composite piezoelectric modules with integrated electrodes. In this case, the electric load has to be given at the electrodes rather than at the RVE FE model boundaries. The proposed procedure is validated through its comparison to literature available results on a classical 1-3 piezoelectric micro fiber (longitudinally polarized) reinforced composite and a $d_{15}$ shear piezoelectric macro-fiber (transversely polarized) composite module.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.21-26
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• 2002

Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.20-23
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing(CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Chemical-Mechanical polishing(CMP) of conductors is a key process in Damascene patterning of advanced interconnect structure. The effect of alternative commercial slurries pads, and post-CMP cleaning alternatives are discuss, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. Electroplated copper deposition is a mature process from a historical point of view, but a very young process from a CMP perspective. While copper electro deposition has been used and studied for decades, its application to Cu damascene wafer processing is only now gaining complete acceptance in the semiconductor industry. The polishing mechanism of Cu-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. however it is important to understand the effect of oxidizer on copper passivation layer in order to obtain higher removal rate and non-uniformity during Cu-CMP process. In this paper, we investigated the effects of oxidizer on Cu-CMP process regarding the additional volume of oxidizer.

• Journal of Sensor Science and Technology
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• v.31 no.4
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• pp.218-227
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• 2022

Triboelectric nanogenerators (TENGs), a new green energy, that have various potential applications, such as energy harvesters and self-powered sensors. The output performance of TENGs has been improving rapidly, and their output power significantly increased since they were first reported owing to improved triboelectrification materials and interfacial material engineering. Because the operation of a TENG is based on contact electrification in which electric charges are exchanged at the interface between two materials, its output can be increased by increasing the contact area and charge density. Material surface modification with microstructures or nanostructures has increased the output performance of TENGs significantly because not only does the sharp micro/nano morphology increases the contact area during friction, but it also increases the charge density. Chemical treatment in which ions or functional groups are added has also been used to improve the performance of TENGS by modifying the work functions, charge densities, and dielectric constants of the triboelectric materials. In addition, ultrahigh output power from TENGs without using new materials or treatments has been obtained in many studies in which special structures were designed to control the current release or to collect the charge current directly. In this review, we discuss physical and chemical treatments, bulk modifications, and interfacial engineering for enhancing TENG performance by improving contact electrification and electrostatic induction.

• Journal of Sensor Science and Technology
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• v.8 no.2
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• pp.115-123
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• 1999

A micro-gas sensor with heater and sensing electrode on the same plane was fabricated on phosphosilicate glass(PSG, 800nm)/$Si_3N_4$ (150nm) dielectric membrane. PSG film was provided by atmospheric pressure chemical vapor deposition(APCVD), and $Si_3N_4$ film by low pressure chemical vapor deposition (LPCVD). Total area of the fabricated device was $3.78{\times}3.78mm^2$. The area of diaphragm was $1.5{\times}1.5mm^2$, and that of the sensing layer was $0.24{\times}0.24mm^2$. Finite-element simulation was employed to estimate temperature distribution for a square-shaped diaphragm. The power consumption of Pt heater was about 85mW at $350^{\circ}C$. Tin thin films were deposited on the silicon substrate by thermal evaporation at room temperature and $232^{\circ}C$, and tin oxide films($SnO_2$) were prepared by thermal oxidation of the metallic tin films at $650^{\circ}C$ for 3 hours in oxygen ambient. The film analyses were carried out by SEM and XRD techniques. Effects of humidity and ambient temperature on the resistance of the sensing layer were found to be negligible. The fabricated micro-gas sensor exhibited high sensitivity to butane gas.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.6
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• pp.278-282
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• 2010

The doping effect of thulium on electrical properties and degradation behavior in barium titanate ceramics ($BaTiO_3$) was investigated in terms of generations of core-shell structure and micro-chemical changes through highly accelerated degradation test. The dielectric specimens of pellet type and multi-layered sheets were prepared by using $BaTiO_3$ with undoped and doped with 1 mol% $Tm_2O_3$. The $BaTiO_3$ ceramics doped with 1 mol% $Tm_2O_3$ had 40% higher dielectric constant (${\varepsilon}$ = 2700) than that of the undoped $BaTiO_3$ specimen at curie temperature and met X7R specification. According to the result of highly accelerated degradation test conducted at $150^{\circ}C$, 70 V, and 24 hr, the oxygen diffusion was declined in dielectrics doped with 1 mol% $Tm_2O_3$. The $Tm^{3+}$ ion substituted selectively Ba site and Ti site and contributed to the generation of the core-shell structure. Oxygen vacancies occurred by substitution for Ti site could reduce excess oxygen that reacted to the Ni electrode.