• Textile Coloration and Finishing
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• v.2 no.1
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• pp.31-36
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• 1990

The electrically conducting cellulose acetate/polypyrrole composite films were synthesized by exposing cellulose acetate film containing oxidizing agent to pyrrole vapour and the formation of polypyrrole is confirmed by IR and electron microscopic studies. The morphologies of polypyrrole in the composites are different depending on the oxidizing agent. Ferric chloride is most effective among several metallic chlorides to synthesize the composites with high electrical conductivity. The conductivity of composite films synthesized with 50 wt.% of ferric chloride reaches upto $10^{-2}S/cm$.

• Journal of the Korean Ceramic Society
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• v.31 no.12
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• pp.1529-1535
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• 1994

Electrical conduction mechanisms of RuO2-based thick film resistors were investigated with frequency depandence on AC conductivity. Electrical conduction mechanisms of lower resistivity system (100{{{{ OMEGA }}/sq) sintered at 600~90$0^{\circ}C$ were all metallic conduction mechanism. In case of higher resistivity (10K{{{{ OMEGA }}/sq) system, the electrical conduction mechanisms were very depenent on sintering temperature. When sintering temperature was $600^{\circ}C$, the electrical conduction mechamism was ionic, and as increasing the sintering temperature, the electrical conduction mechanism was changed from ionic to hopping conduction mechanism.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.234-234
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• 2015

Metallic microwires are a promising material for use as a filler in various conductive composite structures. Because of their high anisotropy in shape, a low percolation threshold could be achieved, which is beneficial to a low-cost fabrication and better electrical conductivity even under an extremely low solid content. Here we developed a facile method to fabricate the Cu (core)-Ni (shell) microwires.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.111-113
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• 2007

Thermal conductivities of copper thin films on silicon wafer was obtained from temperature distribution on the surface of wafer measured by radiation thermometry, when sample was heated with constant temperature ate the both ends in a vacuum and dissipate heat by radiation heat transfer into an environment.

• Journal of Powder Materials
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• v.20 no.4
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• pp.285-290
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• 2013

$Ti_2AlN$ composites are a laminated compounds that posses unique combination of typical ceramic properties and typical metallic(Ti alloy) properties. In this paper, the powder synthesis, SPS sintering, composite characteristics and machinability evaluation were systematically conducted. The random orientation characteristics and good crystallization of the $Ti_2AlN$ phase are observed. The electrical and thermal conductivity of $Ti_2AlN$ is higher than that of Ti6242 alloy. A machining test was carried out to compare the effect of material properties on micro electrical discharge drilling for $Ti_2AlN$ composite and Ti6242 alloy. Also, mixture table as a kind of tables of orthogonal arrays was used to know how parameter is main effective at experimental design. Consequently, hybrid $Ti_2AlN$ ceramic composites showed good machining time and electrode wear shape under micro ED-drilling process. This conclusion proves the feasibility in the industrial applications.

• Advances in nano research
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• v.10 no.4
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• pp.339-347
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• 2021

In the framework of the density functional theory combined with the method of non-equilibrium Green functions (DFT + NEGF), the electric transport properties of a one-dimensional nanodevice consisting of telescoping polyprismanes with various types of electrical conductivity were studied. Its transmission spectra, density of state, current-voltage characteristic, and differential conductivity are determined. It was shown that C_[14,17], C_[14,11], C_[14,16], C_[14,10] show a metallic nature, and polyprismanes C_[14,5], C_[14,4] possess semiconductor properties and has a band gap of 0.4 eV and 0.6 eV, respectively. It was found that, when metal C_[14,11], C_[14,10] and semiconductor C_[14,5], C_[14,4] polyprismanes are coaxially connected, a Schottky barrier is formed and a weak diode effect is observed, i.e., manifested valve (rectifying) property of telescoping polyprismanes. The enhancement of this effect occurs in the nanodevices C_[14,17] - C_[14,11] - C_[14,5] and C_[14,16] - C_[14,10] - C_[14,4], which have the properties of nanodiode and back nanodiode, respectively. The simulation results can be useful in creating promising active one-dimensional elements of nanoelectronics.

• Advances in nano research
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• v.10 no.5
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• pp.471-479
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• 2021

In the framework of the density functional theory combined with the method of non-equilibrium Green functions (DFT + NEGF), the electric transport properties of a one-dimensional nanodevice consisting of telescoping polyprismanes with various types of electrical conductivity were studied. Its transmission spectra, density of state, current-voltage characteristic, and differential conductivity are determined. It was shown that C_[14,17], C_[14,11], C_[14,16], C_[14,10] show a metallic nature, and polyprismanes C_[14,5], C_[14,4] possess semiconductor properties and has a band gap of 0.4 eV and 0.6 eV, respectively. It was found that, when metal C_[14,11], C_[14,10] and semiconductor C_[14,5], C_[14,4] polyprismanes are coaxially connected, a Schottky barrier is formed and a weak diode effect is observed, i.e., manifested valve (rectifying) property of telescoping polyprismanes. The enhancement of this effect occurs in the nanodevices C_[14,17] - C_[14,11] - C_[14,5] and C_[14,16] - C_[14,10] - C_[14,4], which have the properties of nanodiode and back nanodiode, respectively. The simulation results can be useful in creating promising active one-dimensional elements of nanoelectronics.

• Progress in Superconductivity and Cryogenics
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• v.26 no.2
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• pp.24-30
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• 2024

Metal 3D printing is utilized in various industrial fields due to its advantages, such as fewer restrictions on production shape and reduced production time and cost. Existing research on 3D printing metal materials focused on changes in material properties depending on manufacturing conditions and was mainly conducted in a room temperature environment. In order to apply metal 3D printing products to cryogenic applications, research on the properties of materials in cryogenic environments is necessary but still insufficient. In this study, we evaluate the properties of stainless steel (STS) 316L and CuCr1Zr manufactured by Laser Powder Bed Fusion (LPBF) in a cryogenic environment. CuCr1Zr is a precipitation hardening alloy, and changes in material properties were compared by applying various heat treatment conditions. The mechanical properties of materials manufactured using the LBPF method are evaluated through tensile tests at room temperature and cryogenic temperature (77 K), and the thermal properties are evaluated by deriving the thermal conductivity of CuCr1Zr according to various heat treatment conditions. In a cryogenic environment, the mechanical strength of STS 316L and CuCr1Zr increased by about 150% compared to room temperature, and the thermal conductivity of CuCr1Zr after heat treatment increased by about 6 to 10 times compared to before heat treatment at 40 K.

• 한국신재생에너지학회:학술대회논문집
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• 2006.11a
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• pp.352-355
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• 2006

As the stainless steel has good corrosion resistance, mechanical property and ease of manufacture, it has been studied as the candidate material of metallic bipolar plate for automotive PIMFC. But, metal is dissolved under fuel cell operating conditions Dissolved ions contaminate a membrane electrode assembly (MEA) and, decrease the fuel cell performance. In addition, metal oxide formation on the surface of stainless steel increases the contact resistance in the fuel cell. These problems have been acted as an obstacle in the application of stainless steel to bipolar plate. Therefore, many kinds of coating technologies have been examined in order to solve these problems. In this study, stainless steel was coated in order to achieve high conductivity and corrosion resistance by several methods. Contact resistance was measured by using a tensile tester and impedance analyzer Corrosion characteristics of coated stainless steel were examined by Tafel-extrapolation method from the polarization curves in a solution simulating the anodic and cathodic environment of PEMFC. Fuel cell performance was also evaluated by single cell test. We tested various coated metal bipolar plate and conventional and graphite were also tested as comparative samples. In the result, coated stainless steel bipolar plate exhibited better cell performance than graphite to bipolar plate.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.