• 한국레이저가공학회지
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• 제12권4호
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• pp.6-11
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• 2009

The LDS(Laser Direct Structuring) process uses thermoplastic polymers with a additive compound that serves as plating seed after the activation by laser. It can realize industry requirement such as miniaturization of electrical component, design flexibility and reduction of production steps. The purpose of this study is to introduce LDS, and to investigate the fundamental mechanism. Also the characteristics of conductive patterns were investigated with respect to laser fluence and intensity. We have used a pulsed fiber laser (wavelength : 1064nm) and copper electroless plating to fabricate conductive patterns. The result showed that laser induced metal-organic complex was caused metalization by electroless copper plating, the critical laser fluence was $1.41\;J/cm^2$ at a scan speed of 1 m/s.

• Tribology and Lubricants
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• 제5권1호
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• pp.44-50
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• 1989

High strength steel is similar to carbon steel in its composition. This material is developed originally for special uses such as aerospace and automobile due to its high strength and shock-free property in spite of lightness. But the chemical attraction of high strength steel is serious, which includes comminution of formation, metalization and strengthening. Machining results in built-up edge between this material and the tool. Especially the work hardening behavior results in tool life shortening, which was caused by temperature generation during machining. In this study, cooling system was made in which liquid nitrogen is supplied to circulate in order to make up for these weaknesses. Machining of high strength steels, which is recognized as difficult to machine materials, was conducted after tool is cooled at -195$\circ$C. Experimental results showed that the tool was cooled down rapidly below -195$\circ$C in about 200 seconds. The tool temperature of machining with cooling system was lowered by 60~95$\circ$C than that of machining in room temperature. The hardness of the surface of chip is decreased by machining with cooling system. And the machining using the cooling system made it possible to increase shear angle, to retain smooth surface on chip without built-up-edge and to get a better roughness.

• 한국레이저가공학회지
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• 제12권1호
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• pp.7-13
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• 2009

Engineering ceramics as sapphire are widely used in industry owing to their superior mechanical and corrosion properties. However, micromachining of sapphire is a considerable challenge due to its transparency. Recently, direct ablation of sapphire has been demonstrated with a visible laser pulse at sufficiently high laser intensity. In this work, the theoretical model for pulsed laser ablation of sapphire is suggested and numerical analysis is carried out using the model. Sapphire ablation begins with plasma generation by the laser interaction with surface defects, impurities and contaminations in the initial stage of machining. Subsequent absorption of the visible laser beam can be explained by three mechanisms: metalization of sapphire surface due to the EUV radiation from the hot plasma, increments of surface roughness and temperature-dependent absorption coefficient. Comparison of the computation results with experimental observation indicates that the proposed model of sapphire is reasonable.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2004년도 정기학술대회
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• pp.147-151
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• 2004

In this study, an optical fiber assembly directly coupled with a laser diode or a photo diode is designed to confirm high reliable optical coupling efficiency of optical transmitter(Tx) and receiver(Rx). The optical fiber assembly is fabricated by soldering an optical fiber and a Kovar ferrule using a glass solder after inserting an optical fiber through a Kovar ferrule. The Kovar which has good welding characteristics is applied to introduce laser welding technique. The glass solder has excellent thermal characteristics such as thermal shift delamination compared with PbSn, AuSn solder previously used usually. Furthermore, the glass solder doesn't need fiber metalization and this enables low cost fabrication. However, the glass soldering is high temperature process over 35$0^{\circ}C$ and the convex shape after solidification due to surface tension causes the stress concentration on optical fiber. The stress concentration on the optical fiber increases the optical insertion loss and possibility of crack formation. The shape of glass solder was designed referring to 2-D Axi-symmetric FEM simulation. To test the mechanical reliability, mechanical vibration test and shock test were done according to Telcorida GR-468-Core protocol. After each test, the optical loss of the stress distributed fiber assembly didn't exceed 0.5 dB, which passes the test.

• 한국세라믹학회지
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• 제52권5호
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• pp.389-394
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• 2015

Direct reduced iron was made using an electric furnace. The reduction ratio of direct reduced iron varied depending on the grade of iron ore. Coal played an important role as a reducing agent in making the direct reduced iron. The coal must contain a suitable amount of volatile components having high calorie values and low impurity content. In this study, oxidized pellets were directly reduced using anthracite as a reductant in an electric furnace. Direct reduction behaviors of hematite and magnetite pellets were confirmed in a coal-based experiment. Reduction behaviors were demonstrated by analyzing the chemical compositions, measuring the reducibility, and observing the phase changes and microstructure. The superior reducibility of hematite pellets can be ascribed to their high effective diffusivity, which is due to their high porosity. The quickly after reducing for 40min and achieves a high value at the end of the reduction.

• 한국전기전자재료학회논문지
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• 제29권6호
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• pp.370-375
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• 2016

In this paper, we investigated the electrical properties of crystalline silicon solar cell fabricated with Ni/Cu/Ag plating. The laser process was used to ablate silicon nitride layer as well as to form the selective emitter. Phosphoric acid layer was spin-coated to prevent damage caused by laser and formed selective emitter during laser process. As a result, the contact resistance was decreased by lower sheet resistance in electrode region. Low sheet resistance was obtained by increasing laser current, but efficiency and open circuit voltage were decreased by damage on the wafer surface. KOH treatment was used to remove the laser damage on the silicon surface prior to metalization of the front electrode by Ni/Cu/Ag plating. Ni and Cu were plated for each 4 minutes and 16 minutes and very thin layer of Ag with $1{\mu}m$ thickness was plated onto Ni/Cu electrode for 30 seconds to prevent oxidation of the electrode. The silicon solar cells with KOH treatment showed the 0.2% improved efficiency compared to those without treatment.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.174-175
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• 2007

A programmable metallization cell (PMC) memory structure with copper-saturated GeTe solid electrolyte films doped by nitrogen was prepared on a TiW bottom electrode by a co-sputtering technique at room temperature. The $Ge_{45}Te_{55}$ solid electrolyte films deposited with various $N_2$/Ar flow ratios showed an increase of crystallization temperature and especially, the electrolyte films deposited at $N_2$/Ar ratios above 30% showed a crystallization temperature above $400^{\circ}C$, resulting in surviving in a back-end process in semiconductor memory devices. The device with a 200 nm thick $Cu_{1-x}(Ge_{45}Te_{55})_x$ electrolyte switches at 1 V from an "off " state resistance, $R_{off}$, close to $10^5$ to an "on" resistance state, Ron, more than 20rders of magnitude lower for this programming current.

• 한국진공학회지
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• 제20권3호
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• pp.189-194
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• 2011

실리콘 태양전지는 KOH 에칭 용액을 이용하여 texturing 시간을 다르게 하는 방법으로 표면의 texturing 상태를 다양하게 제작하였다. 그리고 $POCl_3$ 공정을 이용하여 n형 불순물을 도핑하여 pn접합을 만들었으며, 알루미늄 후면전극과 은 전면전극을 이용하여 Si-cell을 제작하였다. 피라미드 구조가 가장 크고 표면에 고르게 형성된 태양전지 셀에서 F.F. 계수가 높게 나타났으며, 효율도 높게 나타났다. texturing 형성이 잘 이루어진 셀인 경우 빛을 많이 흡수할 수 있고 회로 내부적으로는 직렬저항성분이 감소하여 단락전류성분이 현저히 증가하게 되어 최종적으로 효율이 증가되는 것을 확인하였다.

• Current Photovoltaic Research
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• 제7권1호
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• pp.15-20
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• 2019

Most high-efficiency n-type silicon solar cells are based on the high quality surface passivation and ohmic contact between the emitter and the metal. Currently, various metalization methods such as screen printing using metal paste and physical vapor deposition are being used in forming electrodes of n-type silicon solar cell. In this paper, we analyzed the degradation factors induced by the front electrode formation process using e-beam evaporation of double passivation structure of p-type emitter and $Al_2O_3/SiN_x$ for high efficiency solar cell using n-type bulk silicon. In order to confirm the cause of the degradation, the passivation characteristics of each electrode region were determined through a quasi-steady-state photo-conductance (QSSPC).

• 전기화학회지
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• 제4권4호
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• pp.160-165
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• 2001

황산원자를 포함하는 mercapto화합물은 도금시 전착속도를 증가시키는 첨가제로 알려져 있는데, 이 중 4가지의 mercapto 화합물을 선정하여 농도를 변화시켜가며 Hull cell test, Haring-Blum cell test, cathodic polarization, EQCM(Electrochemical Quartz Crystal Microbalance)등을 이용하여 도금특성 및 throwing power를 알아보았다. Cathode polarization 및 EQCM을 통한 구리 전착량을 알아본 결과 4가지의 mercapto 화합물 중 3-mercapto-1-propanesulfonic acid가 activator로서 가장 적당하였으며, 그 농도가 20 ppm에서 throwing power를 증가시키고, 농도 및 활성 과전압이 오직 $Cl^-$만 포함되었을 때보다 cathodic scan시 100 mV 만큼 shift되어 증착속도를 증가시킴을 알 수 있었다.