• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2009년도 춘계학술발표대회
• /
• pp.22.2-22.2
• /
• 2009

Currently, metal silicides become increasingly more essential part as a contact material in complimentary metal-oxide-semiconductor (CMOS). Among various silicides, NiSi has several advantages such as low resistivity against narrow line width and low Si consumption. Generally, metal silicides are formed through physical vapor deposition (PVD) of metal film, followed by annealing. Nanoscale devices require formation of contact in the inside of deep contact holes, especially for memory device. However, PVD may suffer from poor conformality in deep contact holes. Therefore, Atomic layer deposition (ALD) can be a promising method since it can produce thin films with excellent conformality and atomic scale thickness controllability through the self-saturated surface reaction. In this study, Ni thin films were deposited by thermal ALD using bis(dimethylamino-2-methyl-2-butoxo)nickel [Ni(dmamb)2] as a precursor and NH3 gas as a reactant. The Ni ALD produced pure metallic Ni films with low resistivity of 25 $\mu{\Omega}cm$. In addition, it showed the excellent conformality in nanoscale contact holes as well as on Si nanowires. Meanwhile, the Ni ALD was applied to area-selective ALD using octadecyltrichlorosilane (OTS) self-assembled monolayer as a blocking layer. Due to the differences of the nucleation on OTS modified surfaces toward ALD reaction, ALD Ni films were selectively deposited on un-coated OTS region, producing 3 ${\mu}m$-width Ni line patterns without expensive patterning process.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
• /
• pp.1413-1415
• /
• 2005

The OTFT performance depends strongly on the interfacial properties between an organic semiconductor and ${\alpha}$ metal electrode. The contact resistance is critical to the current flow in the device. The contact resistance arises mainly from the Schottky barrier formation due to the work function difference between the semiconductor and electrodes. We doped pentacene/source-drain interfaces with $F_4TCNQ$ (2,3,5,6-Tetrafluoro-7,7,8,8-tetracyanoquinodimethane), resulting in p-doped region at the SD contacts, in order to solve this problem. We found that the mobility increased and the threshold voltage decreased.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2010년도 제39회 하계학술대회 초록집
• /
• pp.169-169
• /
• 2010

As display industry requires various applications for future display technology, which can guarantees high level of flexibility and transparency on display panel, oxide semiconductor materials are regarded as one of the best candidates. $InGaZnO_4$(IGZO) has gathered much attention as a post-transition metal oxide used in active layer in thin-film transistor. Due to its high mobility fabricated at low temperature fabrication process, which is proper for application to display backplanes and use in flexible and/or transparent electronics. Electrical performance of amorphous oxide semiconductors depends on the resistance of the interface between source/drain metal contact and active layer. It is also affected by sheet resistance on IGZO thin film. Controlling contact/sheet resistance has been a hot issue for improving electrical properties of AOS(Amorphous oxide semiconductor). To overcome this problem, post-annealing has been introduced. In other words, through post-annealing process, saturation mobility, on/off ratio, drain current of the device all increase. In this research, we studied on the relation between device's resistance and post-annealing temperature. So far as many post-annealing effects have been reported, this research especially analyzed the change of electrical properties by increasing post-annealing temperature. We fabricated 6 main samples. After a-IGZO deposition, Samples were post-annealed in 5 different temperatures; as-deposited, $100^{\circ}C$, $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$ and $500^{\circ}C$. Metal deposition was done on these samples by using Mo through E-beam evaporation. For analysis, three analysis methods were used; IV-characteristics by probe station, surface roughness by AFM, metal oxidation by FE-SEM. Experimental results say that contact resistance increased because of the metal oxidation on metal contact and rough surface of a-IGZO layer. we can suggest some of the possible solutions to overcome resistance effect for the improvement of TFT electrical performances.

• Transactions on Electrical and Electronic Materials
• /
• 제18권3호
• /
• pp.125-128
• /
• 2017

This study is on how ohmic area etching affects the buffer breakdown voltage of AlGaN/GaN HEMT. The surface morphology of the ohmic metal can be improved by whole etching on the ohmic area. The buffer breakdown voltages of the samples with whole etching on the ohmic area were improved by the suppression of the metal spikes formed under the ohmic contact regions during high-temperature annealing. The samples with selective etching on the ohmic area were investigated for comparison. In addition, the buffer leakage currents were measured on the different radii of the wafer, and the uniformity of the buffer leakage currents on the wafer were investigated by PL mapping measurement.

• 한국철도학회:학술대회논문집
• /
• 한국철도학회 2009년도 춘계학술대회 논문집
• /
• pp.900-904
• /
• 2009

The measurement of contact wire uplift in electric railway is one of the most test method to accept the maximum permitted speed of new vehicles or pantographs. The contact wire uplift can be measured for shot periods when pantograph is running in monitoring station. This paper describes the development of two different methods for contact uplift measurement using vision-based system and wireless online monitoring system. Our vision-based system employs a high-speed CMOS (Complementary Metal Oxide Semiconductor) camera with gigabit ethernet LAN. The development of a real-time remote monitoring system that acquires data from any kind of sensor to be transmitted by wireless communication from overhead line and structure at 25 kV to a computer in catenary system. The proposed two kind of different measurement systems to evaluation for dynamic uplift of overhead contact wire shows promising on-field applications for high speed train such as Korea Tilting Train (TTX) and Korea Train eXpress (KTX).

• 대한전기학회논문지
• /
• 제32권7호
• /
• pp.234-238
• /
• 1983

이 논문은 단일 전하로 전달되는 이중(금속-반도체-금속) 접착 소자에서 일차원적인 수송 방정식을 정상 상태에서 마이크로 컴퓨터로 해를 구하였다. 수송방정식을 해석적으로 풀이 하기 위해 일반적으로 행하여왔던 대부분의 가정과 개략치는 본 논문에서는 배제하였다. 결과는 에너지 상태, 밀도상태, 전류-전압 특성등에 관하여 중점을 두엇다. 인가 전압의 함수로 나타낸 미분 정전 용얄의 컴퓨터에 의한 해를 제시히고 영상전하 효과로 수정법도 제시 하였다.

• 한국반도체및디스플레이장비학회:학술대회논문집
• /
• 한국반도체및디스플레이장비학회 2005년도 춘계 학술대회
• /
• pp.173-179
• /
• 2005

본 연구에서는 Nickel-Metal Induced Lateral crystallization(Ni-MILC)에 depart에 따른 영향을 관찰함에 있어 Nickel에 Palladium Metal을 인접시켜(Pd assisted Ni-MILC) 그 결정화 속도를 향상시키는 방법을 제안하였다. a-Si에 Phosphorous가 doping 되어 있는 경우 Ni-MILC의 성장은 intrinsic에 비해 2.5배 감소되는 반면, Boron을 doping한 경우 Ni-MILC의 성장은 intrinsic의 경우보다 5배 이상의 성장을 보이게 되는데, well type의 Pd을 인접시킨 경우 Pd에 의해 유도된 tensile stress가 각 doping에 따른 성장 속도를 더욱 증대시키는 것을 확인할 수 있었으며, 이와 같은 현상을 MILC mechanism으로 설명하였다. 이는 Ni-MILC를 이용하여 다결정 실리콘 TFT 제작 시 결정화 속도로 인하여 문제가 되었던 N-type에서의 적용이 가능함과 동시에 contact MILC 등의 방법에도 이용가능성을 의미한다.

• 반도체디스플레이기술학회지
• /
• 제13권3호
• /
• pp.13-19
• /
• 2014

Phosphoric acid was used as etching agent instead of conventional peroxide - based chemicals for forming pattern of ultra definition display. Etchant was synthesized by mixing etching agent, oxidation agent, buffer solution, and additive into solvent, deionized water. Thicknesses of copper, main metal of ultra definition display, for etching, were 10,000 and $30,000{{\AA}}$. Etch stop of good low skew for proper pattern formation has been occurred at the content ratio of phosphoric acid 60 - 64%, nitric acid 4 - 5%, additive(potassium acetate) 1 - 3%. Buffer solution(acetic acid) decreased the metal contact angle $63.07^{\circ}$ to $42.49^{\circ}$ for benefiting pattern formation. Content variations on four components (phosphoric acid, nitric acid, acetic acid, potassium acetic acid) of the etchant with storage time were within 3 wt% after 24 hrs of etching work.

• Transactions on Electrical and Electronic Materials
• /
• 제13권1호
• /
• pp.35-38
• /
• 2012

In this study, we have attempted to characterize the photovoltaic effect in real-time measurement of photoinduced current in a poly-Si-based solar cell using photoconductive atomic force microscopy (PC-AFM). However, the high contact resistance that originates from the metal-semiconductor Schottky contact disturbs the current flow and makes it difficult to measure the photoinduced current. To solve this problem, a thin metallic film has been coated on the surface of the device, which successfully decreases the contact resistance. In the PC-AFM analysis, we used a metal-coated conducting cantilever tip as the top electrode of the solar cell and light from a halogen lamp was irradiated on the PC-AFM scanning region. As the light intensity becomes stronger, the current value increases up to $200{\mu}A$ at 80 W, as more electrons and hole carriers are generated because of the photovoltaic effect. The ratio of the conducting area at different conditions was calculated, and it showed a behavior similar to that generated by a photoinduced current. On analyzing the PC-AFM measurement results, we have verified the correlation between the light intensity and photoinduced current of the poly-Si-based solar cell in nanometer scale.

• 한국정밀공학회지
• /
• 제31권11호
• /
• pp.969-974
• /
• 2014

Previously fabricated electronic devices were used for vacuum manufacturing processes such as conventional semiconductor manufacturing. However, they are difficult to apply to continuous processes such as roll-to-roll printing, which results in very high device manufacturing and processing costs. Therefore, many developers have been interested in applying continuous processes to contact printing or noncontact printing technologies and they proposed various continuous printing techniques instead of conventional batch coating. In this paper, we proposed improved gravure offset printing process as one of the contact printing technique. We used etching pattern geometry with soft core blanket roll for printing of ultra fine line below the 10um.Using this technique we obtained flexible metal grid mesh film as transparent conductive film.