• Carbon letters
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• v.10 no.3
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• pp.213-216
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• 2009

The electrochemical deposition of Pt nanoparticles on carbon nanotubes (CNTs) supports and their catalytic activities for methanol electro-oxidation were investigated. Pt catalysts of 4~12 nm average crystalline size were grown on supports by potential cycling methods. Electro-plating of 12 min time by potential cycling method was sufficient to obtain small crystalline size 4.5 nm particles, showing a good electrochemical activity. The catalysts' loading contents were enhanced by increasing the deposition time. The crystalline sizes and morphology of the Pt/support catalysts were evaluated using X-ray Diffraction (XRD) and Transmission Electron Microscopy (TEM). The electrochemical behaviors of the Pt/support catalysts were investigated according to their characteristic current-potential curves in a methanol solution. In the result, the electrochemical activity increased with increased plating time, reaching the maximum at 12 min, and then decreased. The enhanced electroactivity for catalysts was correlated to the crystalline size and dispersion state of the catalysts.

• Textile Coloration and Finishing
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• v.10 no.2
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• pp.8-17
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• 1998

In this study we have examined electroless chemical plating on the plasma grafted poly [ethylene terephathalate］(PET) fabric in order to improve the interfacial adhesion between metal and fiber. The vapour phase of acrylic acid introduced on the PET surface and the graft polymerization was carried out by using cold plasma, resulting in the grafting yield of 0.8-1.3 wt％. The carboxyl group of the plasma grafted was identified by FT-IR-ATR spectra. The Interfacial adhesion was related to the carboxyl group. After electroless chemical plating of nickel, it showed that the more the carboxyl, the better the interfacial adhesion. Comparing to the untreated, the plasma grafted fabric showed fairly good interfacial adhesion(5B grade, ASTM D3359) . The shielding effect of electromagnetic wave showed 95dB. The shielding effect depends on the fabric structure, the surface structure, and the cross sectional shape of fibers. The dense fabric structure, the etched surface like a microcrater, and the trigonal cross sectional shape were prefered.

• Journal of Technologic Dentistry
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• v.22 no.1
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• pp.49-55
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• 2000

In manufacturing the all-ceramic crown whick look close to natural teeth, the effectiveness of the improved technique is expectected the technique of the heat treatment of gold plating coating die was experimented of a refractory cast model. The following results were obtainde 1. An advantage of build up on east die with out manufacturing veneer, crown, core, or masking(reduction of technical process, and retrenchment of time and money) 2. Esthetically more close to natural teeth than other technique 3. Easy to remove a refractors cast die 4. In manufacturing ceramo-metal crown the enomous effectiveness was obtainde on applying in the areas of cervical margin, the metal surface, and in the treatment of pinhole.

• Journal of the Korean institute of surface engineering
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• v.37 no.5
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• pp.289-295
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• 2004

A dense palladium-nikel (Pd-Ni) alloy composite membrane has been fabricated on microporous nickel support mixed with submicron/micron nickel powder instead of mesoporous stainless steel support. Plasma treatment process is introduced as pre-treatment process instead of HCI activation. Pd-Ni alloy composite membrane prepared by electro plating was fairly a uniform and dense surface morphology. The membrane was characterized by permeation experiments with hydrogen and nitrogen gases at temperature 773 K and pressure 2.2 psi. The results showed that hydrogen ($H_2$) permeance was 27 ml/$\textrm{cm}^2$ㆍatmㆍmin and hydrogen/ nitrogen ($_H2$$N_2$) selectivity was 8 at 773 K.

• Proceedings of the Membrane Society of Korea Conference
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• 1994.10a
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• pp.8-11
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• 1994

Disposal of hazardous ions in the aqueous streams is a significant industrial waste problem.. Waste streams from electronics, electroplating, and photographic industries contain metal ions such as copper, nickel, zinc, chromium(IV), cadmium, aluminum, silver, and gold, amongst others in various aqueous solutions such as sulfates, chlorides, fluorocarbons, and cyanides. Typical plating solutions having similar compositions are listed in Table 1. Spent process streams in catalyst manufacturing facilities also contain precious metals such as Ag, Pt, and Pd. Developing an effective recovery process of these metal ions for reuse is important.

• Proceedings of the KWS Conference
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• 1999.10a
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• pp.267-269
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• 1999

• Proceedings of the Korean Nuclear Society Conference
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• 2001.10a
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• pp.214.1-214
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• 2001

• Journal of the Korean institute of surface engineering
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• v.1 no.1
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• pp.5-13
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• 1967

Up to this date, numerous methods of analysis of electropling solutions are published. Some, however, need lots of works before reaching final results, or require high technique and special instruments, and also some are unaccurate due to unclearnes of end point. Like our undevelop countries, technicians of electroplating shops are most high school graduates or under, and have not much knowledge on chemistry. Furthermore, those technicians have to control their plating solutions by themselves without having enough analytical laboratory equipment . Therefore, in this paper the simplest, besides accurate method is investigated after comparing numerous methods published. Among the methods of copper determinations from acid and alkaline copper plating baths, EDTA titration method are chosen, due to these methods are the simpest and fastest for the evaluation of metal content, without requirng any special instrument. For acid copper solutions, chelate titrations were accurate enough. Since the end point of titration of chelate method is variable according to the kind of indicators and other metal's coexisitence as well as solution component, many difficulties were encountered from cyanide copper, on the contrary of acid copper bath. PAN , PV, and MX indicators were tried , but it is found that MX is the best. In chyanide solution ,due to cyanide is the masking reagent , elimination of this component is essential , and finally found that elimination CN-by precipitation with AgNO$_3$ solution was the simplest and the most accurate way among others. This method was very accurate for the new plating solutions even coexistence with organic brightners. However used solutions for long months running have to be predetermined the accurate copper value by thiosulfate method form time to time, before chelate titration by means of AgNO$_3$ precipitation. Always some constant deviations will be seen according to the solutions nature. Therefore those deviation values have to be compensated each time.

• Journal of Korean Society of Water and Wastewater
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• v.19 no.2
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• pp.200-208
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• 2005

In this study, a new submerged membrane bioreactor process packed with granular sulfur (MBR-GS) was operated to identify the biological nitrogen removal behaviors with plating wastewater containing high-strength $NO_3{^-}$ concentration. The continuous denitrification was carried out at $20^{\circ}C$ with various nitrogen loading rates using synthetic wastewater, which composed of $NO_3{^-}$ and $HCO_3{^-}$, but also actual plating wastewater, which was collected from the effluent of the H metal plating company. As a result, high-rate denitrification in the range of $0.8kg\;NO_3{^-}-N/m^3\;day$ was accomplished at nitrogen loading rate of $0.9kg\;NO_3{^-}-N/m^3\;day$ using synthetic wastewater. Also, higher-rate denitrification with actual plating wastewater was achieved up to $0.91kg\;NO_3{^-}-N/m^3\;day$ at the loading rate of $1.11kg\;NO_3{^-}-N/m^3\;day$. Additionally, continuous filtration was possible during up to 30 days without chemical cleaning in the range of 20 cmHg of transmembrane pressure. On the basis of the proposed stoichiometry, ${SO_4}^{2-}$ production could be estimated efficiently, while observed alkalinity consumption was somewhat lower than theoretical value. Consequently, a new process, MBR-GS is capable of high-rate autotrophic denitrification by compulsive flux and expected to be utilized as an alternative of renovation techniques for nitrogen removal from not only plating wastewater but also municipal wastewater with low C/N ratio.

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.530-538
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• 2016

There is a close relationship between the performance and the heat generation of the electronic device. Heat generation causes a significant degradation of the durability and/or efficiency of the device. It is necessary to have an effective method to release the generated heat. Based on demands of the printed circuit board (PCB) manufacturing, it is necessary to develop a robust and reliable plating technique for substrates with high thermal conductivity, such as alumina ($Al_2O_3$), aluminium nitride (AlN), and silicon nitride ($Si_3N_4$). In this study, the plating of metal layers on an insulating silicon nitride ($Si_3N_4$) ceramic substrate was developed. We formed a Pd-$TiO_2$ adhesion layer and used APTES(3-Aminopropyltriethoxysilane) to form OH groups on the surface and adhere the metal layer on the insulating $Si_3N_4$ substrate. We used an electroless Ni plating without sensitization/activation process, as Pd particles were nucleated on the $TiO_2$ layer. The electrical resistivity of Ni and Cu layers is $7.27{\times}10^{-5}$ and $1.32{\times}10^{-6}ohm-cm$ by 4 point prober, respectively. The adhesion strength is 2.506 N by scratch test.