• 대한환경공학회지
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• 제38권11호
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• pp.627-634
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• 2016

본 연구에서는 탄소폼 흡착소재를 이용하여 산업도금폐수로부터 중금속을 흡착 제거한 후 탈착용액을 이용하여 제거된 중금속을 용출하고 회수하는 과정의 특성을 평가해 보고자 하였다. 용액의 조성에 따른 복합 중금속의 탈착 특성을 살펴본 결과 증류수 조건에서는 용출이 관측되지 않았으며, 탈착용액으로 HCl과 $H_2SO_4 $를 이용한 경우 높은 중금속 농도를 나타내었다. 탈착 용액을 이용함과 더불어 물리적 기술인 초음파 처리를 이용한 경우 중금속의 용출이 증진되는 것을 확인하였으며, 초음파 장치의 출력이 높고 반응 시간이 길수록 효율도 증가하는 것으로 나타났다. 탄소폼 흡착소재를 구리도금 세척수 처리에 적용시켜본 결과 200 반응기부피(Bed volume) 동안 안정적인 제거 성능을 나타내었으며, 흡착된 구리는 탈착용액을 이용하여 용출시킨 후 직류 전원 장치를 이용하여 회수할 수 있었다. 또한 구리가 회수된 탈착용액은 재이용 효율은 84.2%로 나타났다.

• 공업화학
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• 제10권1호
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• pp.67-72
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• 1999

Nylon-inorganic filler alloy의 도금에 있어 최적 전처리 공정에 관하여 연구하였다. Nylon-inorganic filler alloy는 etching 공정만으로도 무정형층을 제거하여 요구되는 충분한 밀착력을 얻을 수 있었다. SEM과 표면조도 측정으로부터 etching 공정이 수지표면을 매우 거칠고 접착력을 우수하게 만든다는 결과를 얻었으며, 도금물질의 표면상태와 접착력은 Nylon-inorganic filler alloy 수지의 성형조건에 의존한다는 것을 확인하였다. EDS 분석으로 전처리 후 수지표면의 잔류금속의 종류와 양을 측정한 결과 Cr은 Sn과 Pd의 흡착에 크게 영향을 미치지 않는 것으로 나타났다.

• 한국표면공학회지
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• 제50권3호
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• pp.155-163
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• 2017

In this study, the effects of the concentration of metal ions and the applied current density in the Sn-Ag plating solutions were examined in regards to the resulting composition and morphology of the solder bumps' surface. Furthermore the effect of any impurities present in the methanesulfonic acid used as a base acid in the Sn-Ag solder plating solution on the stability of plating solution as well as the characteristics of the Sn-Ag alloys films was also explored. As expected, the uniform bump was obtained by means of removing impurities in the plating solution. Consequently the resultant solder bump was obtained in an optimal current density of the range of $1A/dm^2$ to $15A/dm^2$, which has acceptable bump shape and surface roughness with 12inch wafer trial results.

• 한국표면공학회지
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• 제38권6호
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• pp.216-226
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• 2005

Pb-Free Technology was born with environmental problems of electronic component, Being connected by big and small project of every country. Also, in each country environment is connected and various standards of IEC, ISO, MIL, JIS, KS, JEDEC, EIAJ etc. All products can divide at solder part and finishing part These can tested each and synthetically divide. This research is reliability evaluation for three kind of ph-free SnCu solder plating solution and it's deposit. First, executed analysis about Pure Sn, SnCu solutions and plating surface by way similar to other plating solution analysis. Next, executed reliability about test method and equipment for reliable analyzer system construction. Next, data comparison and estimation, main estimation test method and item's choice. In this paper the systematic surface analysis and reliability for plating solutions and it's deposit in metal surface finishing processes could be shown.

• 한국표면공학회지
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• 제10권2호
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• pp.1-18
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• 1977

In decorative chromium plating, highly concentrated conventionl baths ($CrO_3$ 150~400g/l) have been used. Because of the problems of heavy metal pollution and the saving of raw materials, chromium plating from dilute bath has been developed recently. The present study was performed to determine the effects of all the variables in the low concentrated chromium plating bath, such as brightness, appearence, current efficiency, and plating rate with regard to the bath composition and plating conditions.

• 한국표면공학회지
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• 제47권5호
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• pp.269-274
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• 2014

Electroless plating process as a solution deposition method is a viable means of preparing conductive metal films on non-conducting substrates through chemical reactions. In the present study, the preparation and properties of electroless Ni-plating on flexible silicone rubber are described. The process has been performed using a conventional Ni(P) chemical bath. Additives and complexing agents such as ammonium chloride and glycine were added and the reaction pH was controlled by NaOH aqueous solution. Ni deposition rate and crystallinity have been found to vary with pH and temperature of the plating bath. It was shown that Ni-films having the high crystallinity, enhanced adhesion and optimum electric conductivity were formed uniformly on silicone rubber substrates under pH 7 at $70^{\circ}C$. The conductive Ni-plated silicone rubber showed a high electromagnetic interference shielding effect in the 400 MHz-1 GHz range.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.37.1-37
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• 2001

Electric plating is used in various industry field. Specially, pulse plating is able to deposit material at high current density compared to conventional DC plating. For example, pulse plating can get more fine grain, can improve adhesion and metal distribution and current efficiency, can reduce internal stress and crack. Therefore, we developed bidirection pulse power supply(BPPS) which has high speed pulse current and high current density and improve deposition quality and increase plating speed in this paper. BPPS(Bidirection pulse power supply) needs high speed rising time, falling time and output current accuracy. BPPS consists of rectifier part, chopper part, invertor part, and control part. Rectifier part changes outprt current direction.

• Journal of Advanced Marine Engineering and Technology
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• 제19권3호
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• pp.50-61
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• 1995

In recent years, many ceramic researchers have discoved various methods of joining ceramic to metal. However, most of these joining methods are perfomed under vacuum and pressured circumstances. So, when we join ceramic to metal,the proceedings are very complicated and require a very high cost. The purpose of this study is to develop a new joining method of an alumina ceramic to an aluminum metal in air atmosphere. The joining condition, such as copper metallizing, nickel plating, brazing, etc. was investigated through the shear strength test of the trial joint. The results obtained from the above experimenta are summarized as follows : 1) In the case of the $Al_2O_3$/$Al_2O_3$joint, the shear strength of the joint was affected by the various foctor such as kaolin content, copper metallizing thickness, firing temperature, firing time. 2) The better shear strength of the $Al_2O_3$/Al joint was obtained when Ni plating was conducted under higher current density than existing plating condition. 3) The shear strength of the $Al_2O_3$/Al joint increases with the Ni plating thickness is confined to the range of this paper. 4) The shear strength of the thermal-shocked specimen($Al_2O_3$/Al joint) was far more deteriorated than that of the as-bonded specimen.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 추계학술발표대회
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• pp.25.2-25.2
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• 2011

Recently, thin film capacitors used for vehicle inverters are small size, high capacitance, fast response, and large capacitance. But its applications were made up of liquid as electrolyte, so its capacitors are limited to low operating temperature range and the polarity. This research proposes using Ni-P alloys by electroless plating as the electrode instead of liquid electrode. Our substrate has a high aspect ratio and complicated shape because of anodic aluminum oxide (AAO). We used AAO because film thickness and effective surface area are depended on for high capacitance. As the metal electrode instead of electrolyte is injected into AAO, the film capacitor has advantages high voltage, wide operating temperature, and excellent frequency property. However, thin film capacitor made by electroless-plated Ni on AAO for full-filling into etched tunnel was limited from optimizing the deposition process so as to prevent open-through pore structures at the electroless plating owing to complicated morphological structure. In this paper, the electroless plating parameters are controlled by temperature in electroless Ni plating for reducing reaction rate. The Electrical properties with I-V and capacitance density were measured. By using nickel electrode, the capacitance density for the etched and Ni electroless plated films was 100 nFcm-2 while that for a film without any etch tunnel was 12.5 nFcm-2. Breakdown voltage and leakage current are improved, as the properties of metal deposition by electroless plating. The synthesized final nanostructures were characterized by scanning electron microscopy (SEM).

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.51-54
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• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.