• 박물관보존과학
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• 제23권
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• pp.91-108
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• 2020

본 연구는 천안, 공주, 서산, 익산, 나주, 합천에서 출토된 금동관 7점을 중심으로 비파괴 분석법을 활용하여 재질 특성을 조사하였다. 금동관은 고깔 모양의 모관을 기본으로 하며, 전·후입식, 대롱, 수발, 영락 등의 장식을 가감하여 부착된다. 문양은 용문, 봉황문, 초화문, 타출문 등을 조금기법, 투조기법, 인각기법 등으로 시문하였다. 형태적 특징은 제작시기 및 출토 지역에 따라 차이를 보인다. 소지 금속은 순동과 소량의 납이 포함된 동으로 구분된다. 표면 도금은 아말감기법을 사용하였으며, 순금과 소량의 은이 함유된 금으로 분류된다. 옥전 23호 출토품의 은 함량이 높아 지역적인 차이를 보인다. 도금 두께는 백제 금동관에 비해 백제계 금동관인 옥전 23호분이 두꺼운 것으로 평가된다. 도금횟수는 1~2회인 반면 백제계 금동관인 합천 옥전 23호분 금동관은 최대 3회로 평가되며, 차이를 보이는 것을 알 수 있다.

• Nuclear Engineering and Technology
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• 제40권6호
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• pp.459-466
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• 2008

The KSTAR Magnet Power Supply (MPS) was dedicated to the SC coil commissioning and $1^{st}$ plasma experiment as a part of the system commissioning. Although many efforts to develop large-current power supplies that are useful for high power electronic devices have been made in various application fields, such as for large metal-plating devices, there were clear discrepancies between conventional power supply technologies and that for the SC coils due to the special SC coil load conditions. Therefore, most of the power supply technologies for the SC coils were a challenge in the domestic research area due to their limited application. However, the MPS commissioning result showed that all of the hardware and controlling software operated well, and this result finally led to the success of SC coil commissioning and the KSTAR $1^{st}$ plasma experiment. This paper will describe key features of KSTAR MPS for the $1^{st}$ plasma experiment, and will also report the commissioning results of the magnet power supplies.

• 멤브레인
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• 제8권3호
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• pp.148-156
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• 1998

이온교환막을 이용하는 확산투석은 농도차가 구동력인 막공정으로서 철강 산업, 금속 제련 산업, 전기 도금 산업 등으로부터 발생되어지는 폐산으로부터 염산 및 기타 산들을 회수하는데 사용된다. 이론적으로는 초기산 농도가 증가함에 따라 구동력인 농도차가 커지므로 선형적으로 산의 투과속도가 증가하게 된다. 그러나 염산의 경우 약 3 N 이상의 고농도 범위에서는 투과속도 증가율이 농도차가 커짐에 따라 감소하였다. 본 연구에서는 막흡수 실험과 확산투석조 실험을 통해 염산을 회수하기 위한 확산투석에 산의 농도가 미치는 영향과 농도 범위에 따른 음이온 교환막 내부에서의 산의 이동 기작을 고찰하였다. 실험 결과 저농도(<2 N)산의 경우에는 산의 분자확산, 그리고 고농도 (>2 N)산의 경우에는 수소이온 투과현상 (proton leakage)이 막에서의 지배적인 이동 기작임을 알 수 있었다. 또한 고농도 범위에서는 삼투압에 의한 물분자의 이동과 막의 탈수현상이 수소이온의 이동을 방해하므로 막에서의 산 플럭스 증가율이 감소하였다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2013년도 춘계학술대회 논문집
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• pp.62-62
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• 2013

Magnesium alloys exhibit many attractive properties such as low density, high strength/weight ratio, high thermal conductivity, very good electromagnetic features and good recyclability. However, most commercial magnesium alloys require protective coatings because of their poor corrosion resistance. Attempts have been made to improve the corrosion resistance of the Mg alloys by surface treatments, such as chemical conversion coatings, anodizing, plating and metal coatings. Among them, chemical conversion coatings are regarded as one of the most effective and cheapest ways to prevent corrosion of Mg alloys. In this study, the effects of various $Zn^{2+}$ concentrations and pH levels on the formation of zinc phosphate conversion coatings (ZPCCs) on AZ31 magnesium alloy were investigated, and corrosion resistances of the coated samples were evaluated by immersion test and potentiodynamic polarization experiment. The corrosion resistance of the coated AZ31 samples was found to increase with increasing $Zn^{2+}$ concentration and the lowest corrosion rate was obtained for the samples coated at pH of 3.07, independent of $Zn^{2+}$ concentration. The best coatings on AZ31 were obtained at [$Zn^{2+}$] = 0.068 M and pH 3.07. At the conditions of [$Zn^{2+}$] = 0.068 M and pH 3.07, the formation and growth processes of ZPCCs on AZ31 Mg alloy are divided into four stages: formation of a dense layer, precipitation of fine crystals on the dense layer, growths of the inner and outer layers, and reorganization of outer crystalline layer.

• 마이크로전자및패키징학회지
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• 제14권1호
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• pp.55-60
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• 2007

니켈-다이아몬드 복합 도금은 회전전극을 이용하여 미세 다이아몬드 입자가 공침된 니켈 복합도금층에 대하여 연구하였다. 복합층의 도금시에 인가한 전류밀도와 전류형태(직류, 펄스)가 도금층의 경도와 표면형상에 미치는 영향에 대하여 알아보았으며 첨가제의 영향에 대하여도 연구하였다. 표면조직을 FESEM을 이용하여 관찰하였으며 Micro Victors를 사용하여 도금층의 경도를 측정하였다. 복합도금층에 다이아몬드가 들어감에 따라 경도는 100%, 마찰저항은 27%까지 증가하였다. 또한 다이아몬드 함량이 20gpl 이상인 경우 경도값이 완만하게 증가하였다.

• 한국주조공학회지
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• 제25권6호
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• 방사선산업학회지
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• 제8권3호
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• pp.141-146
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• 2014

Nickel (Ni) electroplating was implemented by using a metal Ni powder in order to establish a $^{63}Ni$ plating condition on the PN junction semiconductor needed for production of beta-voltaic battery. PN junction semiconductors with a Ni seed layer of 500 and $1000{\AA}$ were coated with Ni at current density from 10 to $50mA\;cm^{-2}$. The surface roughness and average grain size of Ni deposits were investigated by XRD and SEM techniques. The roughness of Ni deposit was increased as the current density was increased, and decreased as the thickness of Ni seed layer was increased. The results showed that the optimum surface shape was obtained at a current density of $10mA\;cm^{-2}$ in seed layer with thickness of $500{\AA}$, $20mA\;cm^{-2}$ of $1000{\AA}$. Also, pure Ni deposit was well coated on a PN junction semiconductor without any oxide forms. Using the line width of (111) in XRD peak, the average grain size of the Ni thick firm was measured. The results showed that the average grain size was increased as the thickness of seed layer was increased.

• 대한금속재료학회지
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• 제48권7호
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• pp.667-673
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• 2010

Copper filling into TSV (through-silicon-via) and reduction of the filling time for the three dimensional chip stacking were investigated in this study. A Si wafer with straight vias - $30\;{\mu}m$ in diameter and $60\;{\mu}m$ in depth with $200\;{\mu}m$ pitch - where the vias were drilled by DRIE (Deep Reactive Ion Etching) process, was prepared as a substrate. $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. In order to reduce the time required complete the Cu filling into the TSV, the PPR (periodic pulse reverse) wave current was applied to the cathode of a Si chip during electroplating, and the PR (pulse-reverse) wave current was also applied for a comparison. The experimental results showed 100% filling rate into the TSV in one hour was achieved by the PPR electroplating process. At the interface between the Cu filling and Ti/ Au functional layers, no defect, such as a void, was found. Meanwhile, the electroplating by the PR current showed maximum 43% filling ratio into the TSV in an hour. The applied PPR wave form was confirmed to be effective to fill the TSV in a short time.

• 공업화학
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• 제22권1호
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• pp.98-103
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• 2011

DSSC의 광전 효율 증대와 Pt 상대전극의 접착성 향상을 위하여 FTO (Fluorine-doped Tin Oxide) 유리면에 Ni underlayer를 전기 도금 후 Pt 층을 전기 도금하였다. Ni underlayer는 $10mA/cm^2$에서 2 min 동안 도금한 경우 Ni 층과 FTO 면사이의 접착성이 가장 우수하게 나타났으며, Ni underlayer를 $10mA/cm^2$에서 2 min, Pt 층을 $5mA/cm^2$에서 1 min 동안 전기 도금한 상대전극의 XRD 분석 결과 Ni 및 Pt의 금속 회절 peak들을 관찰 할 수 있었다. 이렇게 제조한 상대전극을 사용하여 DSSC의 impedance 측정 결과 75 ohm의 가장 낮은 저항을 나타냈으며, 광전 효율은 5.6%로서 가장 높은 값을 나타내었다.

• Journal of Electrochemical Science and Technology
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• 제14권2호
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• pp.162-173
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• 2023

Aqueous zinc-ion batteries are considered as promising alternatives to lithium-ion batteries for energy storage owing to their safety and cost efficiency. However, their lifespan is limited by the irreversibility of Zn anodes because of Zn dendrite growth and side reactions such as the hydrogen evolution reaction and corrosion during cycling. Herein, we present a strategy to restrict direct contact between the Zn anode and aqueous electrolyte by fabricating a protective layer on the surface of Zn foil via phosphidation method. The Zn₃(PO₄)₂ protective layer effectively suppresses Zn dendrite growth and side reactions in aqueous electrolytes. The electrochemical properties of the Zn₃(PO₄)₂@Zn anode, such as the overpotential, linear polarization resistance, and hydrogen generation reaction, indicate that the protective layer can suppress interfacial corrosion and improve the electrochemical stability compared to that of bare Zn by preventing direct contact between the electrolyte and the active sites of Zn. Remarkably, MnO₂ Zn₃(PO₄)₂@Zn exhibited enhanced reversibility owing to the formation a stable porous layer, which effectively inhibited vertical dendrite growth by inducing the uniform plating of Zn²⁺ ions underneath the formed layer.