• Title/Summary/Keyword: memory semiconductor

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A Study on the Circuit Design Method of CNTFET SRAM Considering Carbon Nanotube Density (탄소나노튜브 밀도를 고려한 CNTFET SRAM 디자인 방법에 관한 연구)

  • Cho, Geunho
    • Journal of IKEEE
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    • v.25 no.3
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    • pp.473-478
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    • 2021
  • Although CNTFETs have attracted great attention due to their ability to increase semiconductor device performance by about 13 times, the commercialization of CNTFETs has been challenging because of the immature deposition process of CNTs. To overcome these difficulties, circuit design method considering the known limitations of the CNTFET manufacturing process is receiving increasing attention. SRAM is a major element constituting microprocessor and is regularly and repeatedly positioned in the cache memory; so, it has the advantage that CNTs can be more easily and densely deposited in SRAM than other circuit blocks. In order to take these advantages, this paper presents a circuit design method for SRAM cells considering CNT density and then evaluates its performance improvement using HSPICE simulation. As a result of simulation, it is found that when CNTFET is applied to SRAM, the gate width can be reduced by about 1.7 times and the read speed also can be improved by about 2 times when the CNT density was increased in the same gate width.

Theoretical Insights into Oxygen Vacancies in Reduced Bulk TiO2: A Mini Review (벌크 TiO2 산소 공공 결함에 대한 이론적 이해)

  • Jaehyuk Choi;Junho Lee;Taehun Lee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.37 no.3
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    • pp.231-240
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    • 2024
  • Titanium dioxide (TiO2) holds significant scientific and technological relevance as a key photocatalyst and resistive random-access memory, demonstrating unique physicochemical properties and serving as an n-type semiconductor. Understanding the density and arrangement of oxygen vacancies (VOs) is crucial for tailoring TiO2's properties to diverse technological needs, driving increased interest in exploring oxygen vacancy complexes and superstructures. In this mini review, we summarize the recent understandings of the fundamental properties of oxygen vacancies in bulk rutile (R-TiO2) and anatase (A-TiO2) based on DFT and beyond method. We specifically focus on the excess electrons and their spatial arrangement of disordered single VO in bulk R and A-TiO2, aligned with the experimental findings. We also highlight the theoretical works on investigating the geometries and stabilities of ordered VOs complexes in bulk TiO2. This comprehensive review provides insights into the fundamental properties of excess electrons in reduced TiO2, offering valuable perspectives for future research and technological advancements in TiO2-based devices.

A Low-pass filter design for suppressing the harmonics of 2.4GHz RFID tag (2.4GHz RFID 태그용 고조파 억제를 위한 저역통과필터의 설계)

  • Cho, Young Bin;Kim, Byung-Soo;Kim, Jang-Kwon
    • Journal of the Institute of Electronics Engineers of Korea TE
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    • v.39 no.3
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    • pp.59-64
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    • 2002
  • In the RFID system using ISM-band, The tag mounted at the object has used the DC power by rectifying the RF signals of the small antenna for operating the micro-controller and memory. The performance of the tag would be reduced because of the second harmonics generated by the nonlinearity of the semiconductor and the spurious signal excited the high order mode of the antenna. This paper has realized the novel type low-pass filter with "the Stub-I type DGS slot structure" to improve the efficiency of the tag by suppressing the harmonics. The optimized frequency character at the pass-band/stop-band has obtained by tuning the stub width and slit width of I type slot. The measured result of the LPF has the cutoff frequency 3.25 GHz, the insertion loss about -0.29~-0.3 dB at pass-band 2.4 GHz~2.5 GHz, the return loss about -27.688~-33.665 dB at pass-band with a good performance, and the suppression character is about -19.367 dB at second harmonics frequency 4.9 GHz. This DGS LPF may be applied the various application as the RFID, WLAN to improve the efficiency of the system by suppressing the harmonics and spurious signals. 

Implementation of Massive FDTD Simulation Computing Model Based on MPI Cluster for Semi-conductor Process (반도체 검증을 위한 MPI 기반 클러스터에서의 대용량 FDTD 시뮬레이션 연산환경 구축)

  • Lee, Seung-Il;Kim, Yeon-Il;Lee, Sang-Gil;Lee, Cheol-Hoon
    • The Journal of the Korea Contents Association
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    • v.15 no.9
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    • pp.21-28
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    • 2015
  • In the semi-conductor process, a simulation process is performed to detect defects by analyzing the behavior of the impurity through the physical quantity calculation of the inner element. In order to perform the simulation, Finite-Difference Time-Domain(FDTD) algorithm is used. The improvement of semiconductor which is composed of nanoscale elements, the size of simulation is getting bigger. Problems that a processor such as CPU or GPU cannot perform the simulation due to the massive size of matrix or a computer consist of multiple processors cannot handle a massive FDTD may come up. For those problems, studies are performed with parallel/distributed computing. However, in the past, only single type of processor was used. In GPU's case, it performs fast, but at the same time, it has limited memory. On the other hand, in CPU, it performs slower than that of GPU. To solve the problem, we implemented a computing model that can handle any FDTD simulation regardless of size on the cluster which consist of heterogeneous processors. We tested the simulation on processors using MPI libraries which is based on 'point to point' communication and verified that it operates correctly regardless of the number of node and type. Also, we analyzed the performance by measuring the total execution time and specific time for the simulation on each test.

Developing the Electrode Board for Bio Phase Change Template (바이오 상변화 Template 위한 전극기판 개발)

  • Li, Xue Zhe;Yoon, Junglim;Lee, Dongbok;Kim, Sookyung;Kim, Ki-Bum;Park, Young June
    • Korean Chemical Engineering Research
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    • v.47 no.6
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    • pp.715-719
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    • 2009
  • The phase change electrode board for the bio-information detection through electrical property response of phase change material was developed in this study. We manufactured the electrode board using Aluminum first that is widely used in conventional semiconductor device process. Without further treatment, these aluminum electrodes tend to contain voids in PETEOS(plasma enhanced tetraethyoxysilane) material that are easily detected by cross-sectional SEM(Scanning Electron Microscope). The voids can be easily attacked and transformed into holes in between PETEOS and electrodes after etch back and washing process. In order to resolve this issue of Al electrode board, we developed a electrode board manufacturing method using low resistivity TiN, which has advantages in terms of the step-coverage of phase change($Ge_2Sb_2Te_5$, GST) thin film as well as thermodynamic stability, without etch back and washing process. This TiN material serves as the top and bottom electrode in PRAM(Phase-change Random Access Memory). The good connection between the TiN electrode and GST thin film was confirmed by observing the cross-section of TiN electrode board using SEM. The resistances of amorphous and crystalline GST thin film on TiN electrodes were also measured, and 1000 times difference between the amorphous and crystalline resistance of GST thin film was obtained, which is well enough for the signal detection.

Recent Research Trends of Process Monitoring Technology: State-of-the Art (공정 모니터링 기술의 최근 연구 동향)

  • Yoo, ChangKyoo;Choi, Sang Wook;Lee, In-Beum
    • Korean Chemical Engineering Research
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    • v.46 no.2
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    • pp.233-247
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    • 2008
  • Process monitoring technology is able to detect the faults and the process changes which occur in a process unpredictably, which makes it possible to find the reasons of the faults and get rid of them, resulting in a stable process operation, high-quality product. Statistical process monitoring method based on data set has a main merit to be a tool which can easily supervise a process with the statistics and can be used in the analysis of process data if a high quality of data is given. Because a real process has the inherent characteristics of nonlinearity, non-Gaussianity, multiple operation modes, sensor faults and process changes, however, the conventional multivariate statistical process monitoring method results in inefficient results, the degradation of the supervision performances, or often unreliable monitoring results. Because the conventional methods are not easy to properly supervise the process due to their disadvantages, several advanced monitoring methods are developed recently. This review introduces the theories and application results of several remarkable monitoring methods, which are a nonlinear monitoring with kernel principle component analysis (KPCA), an adaptive model for process change, a mixture model for multiple operation modes and a sensor fault detection and reconstruction, in order to tackle the weak points of the conventional methods.

ZnO nanostructures for e-paper and field emission display applications

  • Sun, X.W.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.993-994
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    • 2008
  • Electrochromic (EC) devices are capable of reversibly changing their optical properties upon charge injection and extraction induced by the external voltage. The characteristics of the EC device, such as low power consumption, high coloration efficiency, and memory effects under open circuit status, make them suitable for use in a variety of applications including smart windows and electronic papers. Coloration due to reduction or oxidation of redox chromophores can be used for EC devices (e-paper), but the switching time is slow (second level). Recently, with increasing demand for the low cost, lightweight flat panel display with paper-like readability (electronic paper), an EC display technology based on dye-modified $TiO_2$ nanoparticle electrode was developed. A well known organic dye molecule, viologen, was adsorbed on the surface of a mesoporous $TiO_2$ nanoparticle film to form the EC electrode. On the other hand, ZnO is a wide bandgap II-VI semiconductor which has been applied in many fields such as UV lasers, field effect transistors and transparent conductors. The bandgap of the bulk ZnO is about 3.37 eV, which is close to that of the $TiO_2$ (3.4 eV). As a traditional transparent conductor, ZnO has excellent electron transport properties, even in ZnO nanoparticle films. In the past few years, one-dimension (1D) nanostructures of ZnO have attracted extensive research interest. In particular, 1D ZnO nanowires renders much better electron transportation capability by providing a direct conduction path for electron transport and greatly reducing the number of grain boundaries. These unique advantages make ZnO nanowires a promising matrix electrode for EC dye molecule loading. ZnO nanowires grow vertically from the substrate and form a dense array (Fig. 1). The ZnO nanowires show regular hexagonal cross section and the average diameter of the ZnO nanowires is about 100 nm. The cross-section image of the ZnO nanowires array (Fig. 1) indicates that the length of the ZnO nanowires is about $6\;{\mu}m$. From one on/off cycle of the ZnO EC cell (Fig. 2). We can see that, the switching time of a ZnO nanowire electrode EC cell with an active area of $1\;{\times}\;1\;cm^2$ is 170 ms and 142 ms for coloration and bleaching, respectively. The coloration and bleaching time is faster compared to the $TiO_2$ mesoporous EC devices with both coloration and bleaching time of about 250 ms for a device with an active area of $2.5\;cm^2$. With further optimization, it is possible that the response time can reach ten(s) of millisecond, i.e. capable of displaying video. Fig. 3 shows a prototype with two different transmittance states. It can be seen that good contrast was obtained. The retention was at least a few hours for these prototypes. Being an oxide, ZnO is oxidation resistant, i.e. it is more durable for field emission cathode. ZnO nanotetropods were also applied to realize the first prototype triode field emission device, making use of scattered surface-conduction electrons for field emission (Fig. 4). The device has a high efficiency (field emitted electron to total electron ratio) of about 60%. With this high efficiency, we were able to fabricate some prototype displays (Fig. 5 showing some alphanumerical symbols). ZnO tetrapods have four legs, which guarantees that there is one leg always pointing upward, even using screen printing method to fabricate the cathode.

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A study on Etch Characteristics of {Y-2}{O_3}$ Thin Films in Inductively Coupled Plasma (유도 결합 플라즈마를 이용한 {Y-2}{O_3}$ 박막의 식각 특성 연구)

  • Kim, Yeong-Chan;Kim, Chang-Il
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.38 no.9
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    • pp.611-615
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    • 2001
  • Y$_2$O$_3$ thin films have been proposed as a buffering insulator of metal/ferroelectric/insulator/semiconductor field effect transistor(MFISFET)-type ferroelectric random access memory (FRAM). In this study, $Y_2$O$_3$ thin films were etched with inductively coupled plasma(ICP). The etch rates of $Y_2$O$_3$ and YMnO$_3$, and the selectivity of $Y_2$O$_3$ to YMnO$_3$ were investigated by varying Cl$_2$/(Cl$_2$+Ar) gas mixing ratio. The maximum etch rate of $Y_2$O$_3$, and the selectivity of $Y_2$O$_3$ to YMnO$_3$ were 302$\AA$/min, and 2.4 at Cl$_2$/(Cl$_2$+Ar) gas mixing ratio of 0.2 respectively. Optical emission spectroscopy(OES) was used to understand the effects of gas combination on the etch rate of $Y_2$O$_3$ thin film. The surface reaction of the etched $Y_2$O$_3$ thin films was investigated by x-ray photoelectron spectroscopy (XPS). XPS analysis confirmed that there was chemical reaction between Y and Cl. This result was confirmed by secondary ion mass spectroscopy(SIMS) analysis.

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Characteristics of $Ta_{2}O_{5}$ Films by RF Reactive Sputtering (RF 반응성 스펏터링으로 제조한 $Ta_{2}O_{5}$ 막의 특성)

  • Park, Wug-Dong;Keum, Dong-Yeal;Kim, Ki-Wan;Choi, Kyu-Man
    • Journal of Sensor Science and Technology
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    • v.1 no.2
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    • pp.173-181
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    • 1992
  • Tantalum pentoxide($Ta_{2}O_{5}$) thin films on p-type (100) silicon wafer were fabricated by RF reactive sputtering. Physical properties and structure of the specimens were examined by XRD and AES. From the C-V analysis, the dielectric constant of $Ta_{2}O_{5}$ films was in the range of 10-12 in the reactive gas atmosphere in which 10% of oxygen gas is mixed. The ratio of Ta : 0 was 1 : 2 and 1 : 2.49 by AES and RBS examination, respectively. The heat-treatment at $700^{\circ}C$ in $O_{2}$ ambient led to induce crystallization. When the heat-treatment temperature was $1000^{\circ}C$, the dielectric constant was 20.5 in $O_{2}$ ambient and 23 in $N_{2}$ ambient, respectively. The crystal structure of $Ta_{2}O_{5}$ film was pseudo hexagonal of ${\delta}-Ta_{2}O_{5}$. The flat band voltage shift(${\Delta}V_{FB}$) of the specimens and the leakage current density were decreased for higher oxygen mixing ratio. The maximum breakdown field was 2.4MV/cm at the oxygen mixing ratio of 10%. The $Ta_{2}O_{5}$ films will be applicable to hydrogen ion sensitive film and gate oxide material for memory device.

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Electrical Properties of ReMnO3(Re:Y, Ho, Er) Thin Film Prepared by MOCVD Method (화학 기상 증착법으로 제조한 ReMnO3(Re:Y, Ho, Er) 박막의 전기적 특성)

  • Kim, Eung-Soo;Chae, Jung-Hoon;Kang, Seung-Gu
    • Journal of the Korean Ceramic Society
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    • v.39 no.12
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    • pp.1128-1132
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    • 2002
  • $ReMnO_3$(Re:Y, Ho, Er) thin films were prepared by MOCVD method available to non-volatile memory device with MFS-FET structure. $ReMnO_3$ thin films were deposited on the Si(100) substrate at 700${\circ}C$ for 2h. When the films were post-annealed at 900${\circ}C$ for 1h in air, the single phase of hexagonal $ReMnO_3$ thin films were detected. Ferroelectric properties of $ReMnO_3$ thin films were dependent on the degree of c-axis orientation in the single phase of hexagonal structure and remnant polarization (Pr) of $YMnO_3$ thin films with high degree of c-axis orientation was 105 nC/$cm^2$. Leakage current density was dependent on the grain size of microstructure and that of $YMnO_3$ thin films with grain size of 100∼150 nm was $10^{-8}$ A/$cm^2$ at applied voltage of 0.5 V.