• Title/Summary/Keyword: mechanical device

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Development of Two-Finger Force Measuring System to Measure Two-Finger Gripping Force and Its Characteristic Evaluation (단축 힘센서를 이용한 두 손가락 잡기 힘측정장치 개발 및 특성평가)

  • Kim, Hyeon-Min;Shin, Hi-Suk;Yoon, Joung-Won;Kim, Gab-Soon
    • Journal of Sensor Science and Technology
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    • v.20 no.3
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    • pp.172-177
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    • 2011
  • Finger patients can't use their hands because of the paralysis their fingers. Their fingers are recovered by rehabilitating training, and the rehabilitating extent can be judged by measuring the pressing force to be contacted with two fingers(thumb and first finger, thumb and middle finger, thumb and ring finger, thumb and little finger). At present, most hospitals have used a thin plastic-plate for measuring the two-finger grasping force, and we can only judge that they can grasp the plate with their two-finger through it, because the plate can't measure the two-finger grasping force. But, recently, the force measuring system for measuring two-finger grasping force was developed using three-axis force sensor, but it is very expensive, because it has a three-axis force sensor. In this paper, two-finger force measuring system with a one-axis force sensor which can measure two-finger grasping force was developed. The one-axis force sensor was designed and fabricated, and the force measuring device was designed and manufactured using DSP(Digital Signal Processing). Also, the grasping force test of men was performed using the developed two-finger force measuring system, it was confirmed that the grasping forces of men were different according to grasping methods, and the system can be used for measuring two-finger grasping force.

A Clinical Anatomic Study of Internal Mammary Perforators as Recipient Vessels for Breast Reconstruction

  • Baek, In-Soo;You, Jae-Pil;Rhee, Sung-Mi;Son, Gil-Su;Kim, Deok-Woo;Dhong, Eun-Sang;Park, Seung-Ha;Yoon, Eul-Sik
    • Archives of Plastic Surgery
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    • v.40 no.6
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    • pp.761-765
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    • 2013
  • Background Partially resecting ribs of the recipient site to facilitate easy anastomosis of the internal mammary vessels to free flaps during breast reconstruction can cause chest wall pain or deformities. To avoid this, the intercostal perforating branches of the internal mammary vessels can be used for anastomosis. The purpose of this study was to investigate the location and size of the internal mammary perforator vessels based on clinical intraoperative findings and to determine their reliability as recipient vessels for breast reconstruction with microsurgical free tissue transfer. Methods Twelve patients were preoperatively screened for the presence of internal mammary perforators using Doppler tracing. After modified radical mastectomy was performed by a general surgeon, the location and size of the internal mammary perforator vessels were microscopically investigated. The external diameter was examined using a vessel-measuring gauge from a mechanical coupling device, and the distance from the mid-sternal line to the perforator was also measured. Results The largest arterial perforator averaged 1.5 mm, and the largest venous perforator averaged 2.2 mm. Perforators emerging from the second intercostal space had the largest average external diameter; the second intercostal space also had the largest number of perforators arising from it. The average distance from the mid-sternal line to the perforator was 20.2 mm. Conclusions Internal mammary perforators presented consistent and reliable anatomy in this study. Based on these results, the internal mammary perforators appear to have a suitable diameter for microvascular anastomosis and should be considered as an alternative recipient vessel to the internal mammary vessel.

Study of Focusing Characteristics of Ultrasound for Designing Acoustic Lens in Ultrasonic Moxibustion Device (뜸 자극용 초음파 치료기기의 음향렌즈 설계를 위한 초음파 집속 특성 연구)

  • Bae, Jae-Hyun;Song, Sung-Jin;Kim, Hak-Joon;Kim, Ki-Bok
    • Journal of the Korean Society for Nondestructive Testing
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    • v.35 no.2
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    • pp.134-140
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    • 2015
  • Traditional moxibustion therapy can cause severe pain and leave scarring burns at the moxibustion site as it relies on the practitioner's subjective and qualitative treatment. Recently, ultrasound therapy has received attention as an alternative to moxibustion therapy owing to its objectiveness and quantitative nature. However, in order to convert ultrasound energy into heat energy, there is a need to precisely understand the ultrasound-focusing characteristics of the acoustic lens. Therefore, in this study, an FEM simulation was performed for acoustic lenses with different geometries a concave lens and zone lens as the geometry critically influences ultrasound focusing. The acoustic pressure field, amplitude, and focal point were also calculated. Furthermore, the performance of the fabricated acoustic lens was verified by a sound pressure measurement experiment.

A Study on the Measurement of Foreign Material in Dissimilar Metal Contact Using Pulse Laser and Confocal Fabry-Perot Interferometer (펄스 레이저와 CFPI를 이용한 이종금속 접촉부의 이물질 측정에 관한 연구)

  • Hong, Kyung-Min;Kang, Young-June;Park, Nak-Kyu
    • Journal of the Korean Society for Nondestructive Testing
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    • v.33 no.2
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    • pp.160-164
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    • 2013
  • A laser ultrasonic inspection system is a non-contact inspection device which generates and measures ultrasonics by using laser beam. A laser ultrasonic inspection system provides a high measurement resolution because the ultrasonic signal generated by a pulse laser beam has a wide-band spectrum and the ultrasonic signal is measured from a small focused spot of a measuring laser beam. In this study, galvanic corrosion phenomenon was measured by non-destructive and non-contact method using the laser. The case of mixed foreign material on the part of corrosion was assumed and laser ultrasonic experiment was conducted. Ultrasonic was generated by pulse laser from the back side of the specimen and ultrasonic signal was acquired from the same location of the front side using continuous wave laser and Confocal Fabry-Perot Interferometer(CFPI). The characteristic of the ultrasonic signal of exist foreign material part was analyzed and the location and size of foreign material was measured.

Critical Cleaning Requirements for Flip Chip Packages

  • Bixenman, Mike;Miller, Erik
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2000.04a
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    • pp.43-55
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    • 2000
  • In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

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A RF MEMS Transmitter Based on Flexible Printed Circuit Boards (연성 인쇄 회로 기판을 이용한 초고주파 MEMS 송신기 연구)

  • Myoung, Seong-Sik;Kim, Seon-Il;Jung, Joo-Yong;Yook, Jong-Gwan
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.19 no.1
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    • pp.61-70
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    • 2008
  • This paper presents the flexible MEMS transmitter based on flexible printed circuit board or FPCB, which can be transformed to arbitrary shape. The FPCB is suitable to fabricate light weight and small size modules with the help of its thin thickness. Moreover a module based on FPCB can be attached on the arbitrary curved surface due to its flexible enough to be lolled up like paper. In this paper, the flexible MEMS transmitter integrated on FPCB for a short-distance sensor network which is based on orthogonal frequency division multiplexing(OFDM) communication system is proposed. The active device of the proposed flexible MEMS transmitter is fabricated on InGaP/GaAs HBT process which has been used for power amplifier design to take advantages of high linear and high efficient characteristics. Moreover, the passive devices such as the filter and signal lines are integrated and fabricated on the FPCB board. The performance of the fabricated flexible MEMS transmitter is analyzed with EVM characteristics of the output signal.

Characterization of Optical Design for Optical MEMS (Optical MEMS 응용을 위한 광학 설계)

  • Eom, Yong-Sung;Park, Heung-Woo;Park, Jun-Hee;Choi, Byung-Seok;Lee, Jong-Hyun;Yun, Ho-Kyung;Choi, Kwang-Seung;Moon, Jong-Tae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.04a
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    • pp.193-197
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    • 2003
  • As one of the core technologies in the field of the optical communication with WDM, the optical cross connector with movements of micro mirrors is getting important day by day. The packaging structure of 2-dimensional NxN MOEMS switch should be determined by the harmonization of the following items such as the geometrical compatability between optical and structural components, the characteristics of optical input and output parts with device, and the electrical performance for the operation of micro mirrors. Therefore, the packaging process could be defined as the integrated technology completed by the optical and electrical science and the material science for the understanding of its thermo-mechanical properties with packaging materials. In the present study, the harmonization between the optical and structural components as well as the optical characteristics of lens system used will be investigated.

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Property Prediction of Rupture Disc by Using Finite Element Analysis (유한요소해석을 이용한 파열판의 특성 예측)

  • Han, Chang-Yong;Lee, Seong-Beom;Jung, Hee-Suk;Kim, Tae-Gu
    • Journal of the Korean Institute of Gas
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    • v.13 no.3
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    • pp.1-6
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    • 2009
  • High pressure devices are used widely. Interest in rupture disc to people is the increases in protect of facilities and people. A rupture disc consists of mainly three parts: holder, plate and vacuum support. Rupture discs are rusted or destroyed by diverse environments. Rupture discs are made from STS 316L stainless steel because of its high corrosion resistance and yield strength. In this study, modeling of a rupture disc by CATIA V5 and finite element analysis by ANSYS were carried out. The finite element analysis results executed to predict properties of the rupture disc with thickness and height.

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A Study on Stress Assessment of Standing Gas Pipeline Subjected to Ground-Subsidence (지반 침하를 고려한 도시가스 입상배관의 응력평가)

  • Kil, Seong-Hee;Kim, Byung-Duk;Kwon, Jeong-Rock;Yoon, Kee-Bong
    • Journal of the Korean Institute of Gas
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    • v.17 no.2
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    • pp.1-8
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    • 2013
  • In this study, 120 cases of damage due to ground subsidence of city gas pipeline which is hanging on apartment outer wall were investigated. From the survey results, it was determined to be approximately 100m~200mm ground subsidence occurred and at severe damage, pipeline was cut and the gap was about 50mm between two cut pipeline. Device for measuring the amount of deformation of standing gas pipeline was designed and fabricated. And installed it on apartment outer wall for measuring the deformation due to ground subsidence, after 5 months measurement the amount of ground subsidence was measured to 1.3mm. Stress assessment was conducted based on results of ground subsidence occurred on standing gas pipeline.

Study to Application of Controlled Switching HVAC Circuit Breaker in KEPCO Grid (개폐제어형 초고압차단기의 해외적용사례와 한전계통 적용검토)

  • Oh, Seung-Ryle;Kwak, Joo-Sik;Jeong, Moon-Gyu;Han, Ki-Seon;Goo, Sun-Geun;Ju, Hyoung-Jun;Park, Min-Hae;Kim, Hyun-Seok
    • Proceedings of the KIEE Conference
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    • 2015.07a
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    • pp.433-434
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    • 2015
  • Dictionary meaning of circuit-breaker is a mechanical switching device, capable of making, carrying and breaking currents under normal circuit conditions and also making, carrying for a specified time and breaking currents under specified abnormal circuit conditions such as those of short circuit. and it had been recognized as being operated simultaneously. Controlled Switching System(CSS), which is technology for individual pole operation, are widely used to reduce transient phenomenon, for example switching surges, inrush current, for a all switching cases and nowadays it have become and economical solution for a switching place. The conventional solution to these problem is the use of pre-insertion resistors of $520{\Omega}$. However, it is recognised that the cost for products and maintenance are expensive and this apparatus makes more complex the circuit-breaker mechanism. Korea Electric Power Cooperation (KEPCO) has been study for relevant CCS technology since pilot application in substation in 2003 and plan to apply the actual power grid in 2017. This paper deals with the investigation of international CCS operation status and preview for application in KEPCO power grid.

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