• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 제5회 학술대회 논문집 일렉트렛트 및 응용기술연구회
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• pp.109-112
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• 2003

Recently, CMP (Chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of reused silica slurry in order to reduce the costs of CMP slurry. Also, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• 한국생산제조학회지
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• 제23권3호
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• pp.259-265
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• 2014

When the brakes of a vehicle are applied, large amounts of heat are generated on the surfaces of the brake discs owing to friction between the discs and the brake pads. A high temperature gradient on the disc surfaces leads to thermal deformation and severe disc abrasion. Ultimately, the thermal deformation and disc wear give rise to a thermal judder phenomenon, which has a major effect on the stability of the vehicle. To investigate and propose a solution to these problems, thermoelastic instabilities under applied thermal and mechanical loads were analyzed using the commercial finite element package ANSYS by considering the contact surfaces between the discs and pads. Direct-contact three-dimensional finite elements between the discs and pads were applied to investigate the disc friction temperature, thermal deformation, and contact stress so that the thermal judder phenomenon on the surface of the disc could be predicted.

• 소성∙가공
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• 제22권1호
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• pp.17-22
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• 2013

Tube hydroforming is a technology that utilizes hydraulic pressure to form a tube into desired shapes inside die cavities. Due to its advantages, such as weight reduction, increased strength, improved quality, and reduced tooling cost, single-layered tube hydroforming is widely used in industry. However in some special applications, it is necessary to produce multi-layered tubular components which have corrosion resistance, thermal resistance, conductivity, and abrasion resistance. In this study, a hollow forming process to fabricate a part from multi-layered tubes for structural purposes is proposed. To accomplish a successful hydroforming process, an analytical model that predicts optimal load path for various parameters such as tube material properties, thickness of tubes, diameter of holes and the number of holes was developed. Tubular hydroforming experiments to fabricate a hollow part were performed and the optimal loading path developed by the analytical model was successfully verified. The results show that the proposed hydroforming process can effectively produce hollow parts with multi-layered tube without defects such as wrinkling or fracture.

• 한국기계가공학회지
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• 제16권3호
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• pp.100-106
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• 2017

A universal outer diameter measurement module was developed using a linear variable differential transformer (LVDT). This outer diameter measurement module enables simultaneous measurement of outer diameter, displacement, and perpendicularity of bench-type high-precision products by combining analogue and digital measurement principles with mechanically precise and fine adjustment functions. The developed module showed a performance of 0.001mm in measurement resolution, 0.001mm in measurement accuracy, reference surface abrasion lower than Ra 0.1864, and measurement stability of 0.002mm. Therefore, we have acquired domestic measurement technology to improve productivity by securing technical competitiveness for universal diameter measurement technology, lower production costs through import substitution, and increased quality of products with more precise measurement technology. Furthermore, a substitution effect is expected for expensive import measurement system equipment used in production, research, and inspection sites in industries that produce precision processing products such as automobile and machine components.

• Elastomers and Composites
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• 제48권4호
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• pp.256-262
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• 2013

Sulfuric acid group을 도입하여 열가소성 폴리우레탄을 제조하였으며, sulfuric acid의 함량을 변경하여 acid 함량에 따른 특성 변화를 연구하였다. 그리고 carboxylic acid를 도입한 폴리우레탄을 제조하여 비교 분석했다. 연구 결과 acid group을 도입함으로써 인장강도, 마모 등 기계적 물성 및 그립 특성이 증가하는 것을 확인할 수 있었으며, Acid 함량별로 물성을 측정한 결과, 일정한 함량까지 기계적 물성은 증가하며 일정 함량 이상에서는 기계적 물성이 감소하는 것을 확인할 수 있었다. Wet slip의 경우 또한 acid group 도입에 의해 친수성이 증가함으로 acid 함량이 증가할수록 wet slip은 증가 하는 것을 확인할 수 있었다. Carboxylic acid를 도입한 폴리우레탄과 비교 결과, 수소결합력이 약해 기계적 물성은 낮게 나타났으나 rebounding 특성은 더 높게 나타나는 것을 확인할 수 있었다.

• 한국전기전자재료학회논문지
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• 제29권10호
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• pp.647-651
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• 2016

The power relay can easily control high voltage and high current through metallic contacts. In addition, it has the advantage in reasonable price. So it has been used in many applications. But the power relay has a weak point by mechanical movements. These mechanical movements cause the bouncing phenomenon. Arc and bouncing phenomenon are the main causes of electric abrasion and material erosion. In this study, mechanical repetitive experiments and repetitive experiments in electrically connected state are conducted. Then these two experimental results in terms of bouncing phenomenon and changes in the contact surface are compared. In all number of repetitions, contacts in an electrically connected state cause smaller number of bounce. Also, It has lower contents of silver on eroded surface than the other. The experimental results would be helpful to the further study of contacts life span.

• 대한기계학회논문집A
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• 제24권9호
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• pp.2387-2396
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• 2000

Wear and operation characteristics of Nylon and Acetal pinion against steel gear were studied to gain a better understanding of their tribological and mechanical behavior. Tests were conducted with power circulating gear test rig under unlubricated conditions. Specific wear rates were measured as a function of applied load and total revolution. The worn tooth surfaces were examined with a profile projector and camera. Nylon pinion showed lower specific wear rates than Acetal pinion, but it revealed breakage at high load. Principal wear depths were developed at tooth tip and below the pitch line of pinion. Life estimation for the Nylon pinion was made by taking into account steel gear equivalent Hertz stress and average sliding velocity. The dominant wear mechanisms were adhesion and abrasion.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.370-373
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Chemical-Mechanical Planarization(CMP) of conductors is a key process in Damascene patterning of advanced interconnect structure. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. Electroplated copper depostion is a mature process from a historical point of view, but a very young process from a CMP persperspective. While copper electrodepostion has been used and stuidied for dacades, its application to Cu damascene wafer processing is only now ganing complete accptance in the semiconductor industry. The polishing mechanism of Cu CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. however it is important to understand the effect of oxidizer on copper pasivation layer in order to obtain higher removal rate and non-uniformity during Cu-CMP process. In this paper, we investigated the effects of oxidizer on Cu-CMP process regarding the additional volume of oxidizer.

• Korea-Australia Rheology Journal
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• 제14권2호
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• pp.63-70
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• 2002

Chemical mechanical planarization (CMP) is the polishing process enabled by both chemical and mechanical actions. CMP is used in the fabrication process of the integrated circuits to achieve adequate planarity necessary for stringent photolithography depth of focus requirements. And recently copper is preferred in the metallization process because of its low resistivity. We have studied the effects of chemical reaction on the polishing rate and surface planarity in copper CMP by means of numerical simulation solving Navier-Stokes equation and copper diffusion equation. We have performed pore-scale simulation and integrated the results over all the pores underneath the wafer surface to calculate the macroscopic material removal rate. The mechanical abrasion effect was not included in our study and we concentrated our focus on the transport phenomena occurring in a single pore. We have observed the effects of several parameters such as concentration of chemical additives, relative velocity of the wafer, slurry film thickness or ash)tract ratio of the pore on the copper removal rate and the surface planarity. We observed that when the chemical reaction was rate-limiting step, the results of simulation matched well with the experimental data.

• 한국레이저가공학회지
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• 제12권4호
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• pp.12-16
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• 2009

The engineering ceramic is one of the materials advantageous in various conditions with high strength, endurance at high temperature, abrasion resistance and corrosion resistance, etc. However, due to high strength and high brittleness, ceramic incurs high costs and long time on finishing process required after sintering. So a process for obtaining wanted measurements of them has been studied using the high temperature which makes ceramics softened and heat affected recently. This study makes an estimate of laser-assisted machining (LAM) if an economically practical process for manufacturing precision silicon nitride ceramic parts using laser beam. In this study, mechanical properties of silicon nitride at high temperature were observed. And during the LAM, it was observed that cutting force and tool wear were reduced and oxidation of machined surface was increased according to a increase of laser power.