Effects of chemical reaction on the polishing rate and surface planarity in the copper CMP |
Kim, Do-Hyun
(Center for Ultramicrochemical Process Systems, Department of Chemical and Biomolecular Engineering Korea Advanced Institute of Science and Technology)
Bae, Sun-Hyuk (Center for Ultramicrochemical Process Systems, Department of Chemical and Biomolecular Engineering Korea Advanced Institute of Science and Technology) Yang, Seung-Man (Center for Ultramicrochemical Process Systems, Department of Chemical and Biomolecular Engineering Korea Advanced Institute of Science and Technology) |
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Mechanisms of chemical-mechanical polishing of SiO2 dielectric on integrated circuits
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Transport phenomena in chemical mechanical polishing
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DOI |
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Frontal solution program for unsymmetric matrices
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Feature-scale fluid based erosion modeling for chemical-mechanical polishing
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The theory and design of plate glass polishing machine
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Eletrochemical effects in the chemicalmechanical polishing of copper for integrated circuits
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Advances in physically based erosion simulators for CMP
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Migration in concentrated suspension of spherical particles dispersed in polymer solution
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과학기술학회마을 |
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A masstransfer model for the autocatalytic dissolution of a rotating copper disk in oxygen saturated ammonia solutions
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DOI |
13 |
Chemicalmechanical polishing in semidirect contact mode
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Shear-induced microstructure and rheology of cetylpyridinium chloride/sodium salicylate micellar solutions
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Chemical Processes in Glass Polishing
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