1 |
Y. K. Ko, S. S. Cho, H. Huh, S. Y. Lee, H. T. Park, and I. S. Oh, Proc. ISIE (2009) p. 169.
|
2 |
J. M. Ryu, S. H. Choi, K. H. Park, and C. S. Huh, Proc. KIIEE, 27, 383 (2014).
|
3 |
P. G. Slade, Electric Contacts: Principles and Application (Marcel Dekkerm, 1999) p. 464.
|
4 |
Z. K. Chen and K. Sawa, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 21, 311 (1998). [DOI : http://dx.doi.org/10.1109/TCPMC.1998.7102529]
DOI
|
5 |
S. H. Choi, K. S. Kim, J. M. Ryu, and C. S. Huh, Proc. KIIEE, 28, 117 (2015).
|
6 |
P. G. Slade, Electric Contacts: Principles and Application, (Marcel Dekkerm, 1999) p. 591.
|