A Fracture Mechanics Approach on Delamination and Package Crack in Electronic Packaging(l) -Delamination- (반도체패키지에서의 층간박리 및 패키지균열에 대한 파괴역학적 연구 (1) -층간박리-)
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- Transactions of the Korean Society of Mechanical Engineers
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- v.18 no.8
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- pp.2139-2157
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- 1994