• The Journal of the Acoustical Society of Korea
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• v.31 no.7
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• pp.480-486
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• 2012

In the design of electro acoustic transducer, power factor improvement circuit is more required rather than impedance matching if the driving power amplifier has little inner resistance. Many research results have been focused on the power matching circuit designing for transferring maximum power in the wideband. There are few results in the designing study on the power factor improvement for the wide band electro acoustic transducer. In this paper, we propose a new design method on the power factor improvement for the wide band electro acoustic transducer. The proposed method consists of two steps, the chebyschev matching method and the constrained optimization, respectively.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.32 no.1A
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• pp.115-124
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• 2007

In this paper, the I/Q mismatch problem between the transmission line and antenna switch is solved by a new CPW matching circuit for a VoWLAN terminal with 54 Mbps communication speed through the IEEE 802.11 b/g CCK/OFDM. I/Q performances with the new matching circuit are analyzed and improved by the output spectrum mask, the characteristics of the EVM(Error Vector Magnitude) due to the nonlinear CCK/OFDM demodulation data, and receiver's sensitivity.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.3
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• pp.891-895
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• 2010

A dual-band (UHF: 470-862 MHz, L: 1452-1492 MHz) digital video broadcasting-handheld (DVB-H) antenna is presented. The proposed antenna is composed of a planar inverted F-shape antenna (PIFA) with an input impedance matching circuit. The matching circuit improves antenna performance in the broad UHF bands (470-862 MHz: 63%). The proposed antenna has omni-directional patterns and sufficient gain (Ave. peak gain is about 1.70 dBi over 470-862 MHz) for the PMP applications. The antenna is contact with a PMP case (${\varepsilon}_r=3.2$) which is used as a substrate for the size reduction and compact design.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.1
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• pp.102-106
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• 2009

This paper presents the design and optimization of output matching network according to envelope for class F power amplifier(PA) which is to apply to envelope elimination and restoration(EER) transmitter. In this paper, to increase the PAE of class F power amplifier which applies to EER transmitter, the varactor diode has been used on output matching network. As envelope changes, it optimizes constitution of harmonic trap that is short circuit in 2nd-harmonic and is open circuit in 3rd-harmonic. When drain voltage changes from 25 V to 30 V, some percentage is improved in the PAE.put the abstract of paper here.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.8 no.4
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• pp.323-331
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• 1997

In this paper, the high efficiency balanced amplifier is presented as high efficiency power amplifier. This amplifier is basically composed of two FETs, an input power divider, output power combiner, input matching circuits, output matching circuits, second harmonic interconnection circuit and lowpass filter. The second harmonic interconnection circuit is composed of second harmonic frequency bandpass filter and transmission line. This circuit is inserted between the output terminals of the two FEF's output matching circuit, there is a second harmonic standing wave generated between two FET outputs. The electric wall termination is equivalent to the short circuit termination. As a result, the FET output termination condition needed to attain high efficiency is realized. Experimental high efficiency balanced amplifier is constructed to determine its practically attainable efficiency. The input VSWR is 1.27, and the output VSWR is 1.18. Power added efficiency of 75% is attained at 1.75 GHz band about 3W to balanced amplifier.

• Journal of IKEEE
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• v.22 no.3
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• pp.882-885
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• 2018

Recently, signal integrity on PCB (printed circuit board) becomes very important as the system operation speed increases. So far, PCB is customarily designed to minimize area and cost. However, ultra-high-speed PCB often fail to operate properly, unless it is precisely and carefully designed considering dielectric characteristics, line width, line spacing, and impedance matching. This paper surveys many problems in ultra-high-speed PCB and various design methods to mitigate them.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.6
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• pp.263-267
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• 2004

A new type of interaction circuitry for a broadband gyro-TWT is presented in this paper. A method for the analysis of dispersion characteristics of a periodic structure, which is composed of conducting posts in a rectangular waveguide, is presented. This method utilizes a mode matching technique and equivalent circuit model. The calculated and measured results demonstrate that this periodic structure could be utilized for the interaction circuit of a wide band Gyro-TWT.

• 한국정보통신설비학회:학술대회논문집
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• 2008.08a
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• pp.35-38
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• 2008

In this paper, study noise performance of LNA to enhance Q-factor of input circuit by patterned ground shield is inserted inductor using TSMC 0.18um. Applied LNA technology is cascode method. The input matching circuit was constituted on-chip and wirebonding inductor. Taguchi's method is used for the best suited structure of PGS. We confirmed enhancement of Q-factor by inserted PGS into inductor. The input matching circuit enhanced Q-factor by inductor with PGS improve noise figure of LNA.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.19-25
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• 2008

In this paper, the front end module (FEM) was proposed for 2.4GHz WLAN band by LTCC multilayer application. The FEM was composed of power amplifier IC, switch IC, and LTCC module. LTCC module consists of output matching circuit and lowpass filter as Tx part, bandpass filter as Rx part. Design of output matching circuit for LTCC was used matching parameter from output matching circuit based on lumped circuit on the PCB board. The dielectric constant of LTCC substrate is 9. The substrate was composed of total 26 layers with each 30um thickness. Ag paste was used for the internal pattern as the conductor material. The size of the module is $4.5mm{\times}3.2mm{\times}1.4mm$. The fabricated FEM showed the gain of 21dB, ACPR of less than -31dBc first side lobe and Less than -59dBc second side lobe and the output power of 23Bm at P1dB.

• Journal of the Korean Society for Nondestructive Testing
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• v.37 no.1
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• pp.37-43
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• 2017

Ultrasonic transducers with high resolution and resonant frequency are required to detect small defects (less than hundreds of ${\mu}m$) by ultrasonic testing. The resonance frequency and resolution of an ultrasonic transducer are closely related to the thickness of piezo-electric materials, backing materials, and the electric impedance matching technique. Among these factors, electrical impedance matching plays an important role because it can reduce the loss and reflection of ultrasonic energy differences in electrical impedance between an ultrasonic transducer and an ultrasonic defects detecting system. An LC matching circuit is the most frequently used electric matching method. It is necessary for the electrical impedance of an ultrasonic transducer to correspond to approximately $50{\Omega}$ to compensate the difference in electrical impedance between both connections. In this study, a 15 MHz immersion ultrasonic transducer was fabricated and an LC electrical impedance circuit was applied to that for having broad-band frequency characteristic.