• Applied Chemistry for Engineering
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• v.24 no.3
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• pp.239-246
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• 2013

Principle of foamed glass manufacturing process first starts with putting vitreous material powder into a mold. After the foaming calcination, foamed body should be annealed after separation from the mold. For this reason, existing manufacturing process could not be a continuous type process. In this study, in order to develop a continuous production process of foamed glass, the possibility of new foam glass manufacturing process was investigated by foaming calcination of the compact body obtained from compression-molding of vitreous raw materials in stead of using a mold. Through the experimental results of the foaming calcination of the compact body with adding various foaming agents such as $Na_2CO_3$, $CaCO_3$ and petroleum coke, into hydrated soda-lime vitreous raw materials, it was shown that developing a continuous process without using any molds for manufacturing foamed glass would be possible.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.3
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• pp.15-20
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• 2015

After the US government declared 3D printing technology a next-generation manufacturing technology, there have been many practical studies conducted to expand 3D printing technology to manufacturing technologies, called AMERICA MAKES. In particular, the Keck Center, located at the University of Texas at El Paso, has studied techniques for easily combing the 3D stacking process with space mobility and expanded these techniques to simultaneous staking techniques for multiple materials. Additionally, it developed convergence manufacturing techniques, such as direct inking techniques, in order to produce a module structure that combines electronic circuits and components, such as CUBESET. However, in these studies, it is impossible to develop a unified system using traditional independent through simple sequencing connections. This is because there are many problems in the integration between the stacking modeling of 3D printers and post-machining, such as thermal deformations, the precision accuracy of 3D printers, and independently driven coordinate problems among process systems. Therefore, in this paper, the integration method is suggested, which combines these 3D printers and subsequent machining process systems through an Internet-based cloud. Additionally, the sequential integrated system of a 3D printer, an NC milling machine, machine vision, and direct inking are realized.

• The Journal of Bigdata
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• v.1 no.1
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• pp.41-51
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• 2016

Big data is an emerging issue as large data which was impossible to be processed in the past is possible to be handled with the development of information and communication technology. Manufacturing is the most promising field that big data is applied such that there are abundant data available. It is important to improve an efficiency of manufacturing process for quality control and production efficiency because the processes from production design, sales, productions and so on are mixed intricately. This study proposes big data cloud service for manufacturing analysis using a big data technology and a process mining technique. It is expected for manufacturing corporations to improve a manufacturing process and reduced the cost by applying the proposed service. The service provides various analyses including manufacturing analysis and manufacturing duration analysis. Big data cloud service has been implemented and it has been validated by conducting a case study.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.32 no.2
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• pp.132-139
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• 2009

Yield is a very important measure that can expresses simply for productivity and performance of company. So, yield is used widely in many industries nowadays. With the development of the information technology and online based real-time process monitoring technology, many industries operate the production lines that are developed into automation system. In these production lines, the product structures are very complexity and variety. So, there are many multi-variate processes that need to be monitored with many quality characteristics and associated process variables at the same time. These situations have made it possible to obtain super-large manufacturing process data sets. However, there are many difficulties with finding the cause of process variation or useful information in the high capacity database. In order to solve this problem, neural networks technique is a favorite technique that predicts the yield of process for process control. This paper uses a neural networks technique for improvement and maintenance of yield in manufacturing process. The purpose of this paper is to model the prediction of a sub process that has much effect to improve yields in total manufacturing process and the prediction of adjustment values of this sub process. These informations feedback into the process and the process is adjusted. Also, we show that the proposed model is useful to the manufacturing process through the case study.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.79-80
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• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing (CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical planarization/polishing (ECMP) or electro-chemical mechanical planarization was introduced to solve the. technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.9
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• pp.875-880
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• 2015

Traditional semiconductor process control has been performed through statistical process control techniques in a constant process-recipe conditions. However, the complexity of the interior of the etching apparatus plasma physics, quantitative modeling of process conditions due to the many difficult features constraints apply simple SISO control scheme. The introduction of the Advanced Process Control (APC) as a way to overcome the limits has been using the APC process control methodology run-to-run, wafer-to-wafer, or the yield of the semiconductor manufacturing process to the real-time process control, performance, it is possible to improve production. In addition, it is possible to establish a hierarchical structure of the process control made by the process control unit and associated algorithms and etching apparatus, the process unit, the overall process. In this study, the research focused on the methodology and monitoring improvements in performance needed to consider the process management of future developments in the semiconductor manufacturing process in accordance with the age of the APC analysis in real applications of the semiconductor manufacturing process and process fault diagnosis and control techniques in progress.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.2
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• pp.80-86
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• 2000

Although polishing process take 30-50% of whole process of manufacturing die and mold it has not been fully automat-ed yet. Considering current trend of manufacturing it is necessary to study on polishing automation. To accomplish automation reliable database must be developed. For developing it polishing mechanism should be defined and a general empirical formula that can be applied widely should be created. In this paper it is found that polishing process must be separated into 2 process such as removing cusp and getting fine surface process and the polishing parameter which is com-posed of major machining parameters and normalization of data can be applied efficiently in making reliable database.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1248-1252
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• 2005

Mold-manufacturing process consists of machining and finishing process that are strongly related in each other. But there are few studies about mold-manufacturing process to control those two processes simultaneously. Especially, runout distorts the machined surface from expected so it changes the finishing process and mold-manufacturing time. In this work, basic analyses and experiments were carried out to study RVAS variation according to runout in HSM. To perform those analyses, firstly surface generation analysis was done including runout in ball end milling and then the RVAS that could relate machining and finishing process was proposed. And the optimal finishing process in HSM according to RVAS was also proposed. Through experiment runout occurrence and above analyses were verified.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.114-117
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• 2005

An expert system is a system that employs human knowledge captured in a computer to solve problem that ordinarily require human expertise. Well-designed expert systems imitate the reasoning processes experts use to solve specific problem. Specially, expert systems are used to the engineer in manufacturing industry for the process control, production management and system management. In this paper, we propose the design process expert system for product design process in manufacturing industry and we present introduction and contents of design process expert system methodology and software for the air purifier design system. This system will be helpful to improvement of design process for the air purifier production.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.21 no.48
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• pp.269-277
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• 1998

In this study, a traditional concept of sampling inspection plan for the quality assurance system is extended to a consideration of economic aspects in total production system by representing and analyzing the effects between proceding/succeeding production process including inspection. This approach recognizes that the decision to be made at one manufacturing process (or assembly process) determine not only the cost and the average outgoing quality level of that process but also the input parameters of the cost and the incoming quality to the succeeding process. By analyzing the effects of the average incoming and outgoing quality, manufacturing/assembly quality level and sampling inspection plan on the production system, mathematical models and solution technique to minimize the total production cost for a single product manufacturing system with specified average outgoing quality limit (AOQL) are suggested.