• 품질경영학회지
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• 제26권2호
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• pp.106-117
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• 1998

The following study has been undertaken to build QIP (Quality Improvement Process) of an inner-layer process in a PCB (Printed Circuit Board) manufacturing plant. The objective of the study is stabilization and optimization of the process through quality improvement. To do that, defective factors in process are gathered by the cause and effect analysis and classified by PFD (Process Flow Diagram), key factors are found out by PFMECA (Process Failure Mode and Effect Criticalty Analisis), DOE(Design of Experiments) is a, pp.ied to those key factors to optimize the process, SPC (Statistical Process Control) chart is used to maintain the optimal conditions of the process and to improve quality continuously, and a quality management system is developed to improve quality mind and quality system for the PCB jmanufacturing plant. Overall, QIP is established to improve quality for the PCB manufacturing plant in the study.

• Transactions on Electrical and Electronic Materials
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• 제13권3호
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• pp.129-135
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• 2012

A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.

• 한국주거학회논문집
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• 제27권6호
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• pp.137-144
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• 2016

In modular architecture, manufacturing drawing which includes whole information for modular unit production is essential since works for modular unit have to be performed in manufacturing factory not construction field. Although the manufacturing drawing is important as known it is insufficient to utilize the manufacturing drawing in modular architecture project and this makes modular unit low-quality with re-work and work time delay. To prevent low-quality modular unit caused by insufficient manufacturing drawing, in this research firstly manufacturing drawing's current situation and error cases in manufacturing phase of past modular housing project were analyzed, and correlation between reduction of errors occurance frequency and improving manufacturing drawing was verified. Secondly manufacturing drawing improvement factors were deducted in interior, furniture, mechanical work phase which errors' occurance rate is high and the way of deducting manufacturing drawing lists and contents were suggested with light-weight work as an example in case of new type of errors occurance. A series of research process can contribute to good-quality modular unit by errors reduction. As a result of research, about half of errors occurance can be reduced with suggested manufacturing drawing improvement factors. And the manufacturing drawing process can contribute to modular production which have uniform quality.

• 한국정밀공학회지
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• 제23권8호
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• pp.195-202
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• 2006

High-speed machining (HSM) with excellent quality and dimensional accuracy has been widely used to create 3D structures of metal and plastics. However, the high-speed machining process is not suitable for the rapid realization of 3D thin-walled product because it consumes considerably long time in fixturing process of a work piece. In this paper, an effective rapid manufacturing process is proposed to fabricate 3D thin-walled products directly using HSM, phase change filling and ultrasonic welding. The filling process is useful to hold the thin-walled product during the machining step. The ultrasonic welding process is introduced to make one piece product from two piece parts that are machined by HSM and filling process. The proposed rapid manufacturing (RM) process has been shown that the RM process enables to fabricate the 3D thin-walled products using ABS plastics and aluminum metals from 3D CAD data to functional parts.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.787-788
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• 2007

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.28-31
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• 2001

Recently, in order to satisfy the consumer's demand the life cycle and the lead-time of a product is to be shortened. It is thus important to reduce the time and cost in manufacturing trial products. Several techniques have been developed and successfully commercialized in the market RPM(Rapid Prototyping and Manufacturing). However, most commercial systems currently use resins or waxes as the raw materials. So, the limited mechanical strength for functional testing is regarded as an obstacle towards broader application of rapid prototyping techniques. To overcome this problems, high-speed machining technology is being investigated worldwide for rapid manufacturing and even for direct rapid tooling application. In this paper, some fundamental experiments and analyses are carried out to obtain the filling time, materials, method, and process parameters for HisRP process. HisRP is a combination process using high-speed machining technology with automatic filling. In filling process, Bi58-Sn alloy is chosen because of the properties of los-melting point, low coefficient of thermal expansion and enviromental friendship. Also the use of filling wire is of advantage in term of simple and flexible mechanism. Then the rapid manufacturing product, for example a skull, is machined for aluminum material by HisRP process with an automatic set-up device of 4-faces machining.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.908-910
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• 2007

Thin Film Transistor (TFT) manufacturing process is complicated. Electrostatic discharge (ESD) occurs during every process step. This paper describes ESD phenomena in terms of TFT design and processing flow. The abnormal contact between equipment and glass is found out to be the key reason causing ESD.

• 한국정보통신학회논문지
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• 제25권3호
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• pp.471-477
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• 2021

디스플레이 분야에 스마트 팩토리란 작업 자동화 뿐만 아니라 기존의 공정관리, 이동설비, 공정이상, 결함 분류 등에 AI/BIG DATA 기술을 이용한 보다 효율적인 디스플레이 제조를 의미한다. 과거 디스플레이 제조 과정에서 불량이 나오면 결함 분류, 공정 이상에 대한 대처가 시시각각 달랐기 때문에 이에 대한 많은 시간 소모가 발생했었다. 하지만 디스플레이 제조 분야는 고도화된 공정 장비를 이용해야 하고 불량 원인을 신속하게 파악해 수율을 올리는 것이 디스플레이 제조 산업의 경쟁력이다. 본 논문에는 스마트 팩토리 AI/BIG DATA 기술을 디스플레이 제조에 접목한 사례들에 대해 정리해 보고 기존 방법 대비 어떤 장점이 도출 되어질 수 있는지에 대해 처음으로 분석해 보고자 한다. 이를 통해 향후 AI/BIG DATA를 이용한 디스플레이 제조 분야에 보다 향상된 스마트 팩토리 개발을 위한 사전지식으로 활용하고자 한다.

• 한국전기전자재료학회논문지
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• 제35권1호
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• pp.58-65
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• 2022

The field of liquid crystal display (LCD) is constantly in the spotlight and the process of depositing an alignment layer in the LCD manufacturing process is very important to obtain excellent performance such as low-power driving and high-speed response to improve LCD performance. Therefore, research on liquid crystal (LC) alignment is being actively conducted. When manufacturing LCD, it is necessary to consider the effect of the alignment layer thickness as one of the factors affecting various LCD performances. In addition, previous studies confirmed the LC alignment characteristics correlate with the rotation speed in the spin coating process. Therefore, the electro-optical properties of the LCD were investigated by manufacturing a polyimide alignment layer by varying the rotation speed in the spin coating process in this study. It was confirmed that the thickness of the polyimide alignment layer was controlled according to the spin coating conditions. The average transmittances of anti-parallel LC cells at the spin coating speed of 2,500 rpm and 3,000 rpm are about 60%, which indicates that the LC cell has relatively higher performance. At the spin coating speed of 3,000 rpm, the voltage-transmittance curve of twisted nematic (TN) LC cell was below 1.5 V, which means that the TN LC cell operated at a low power. In addition, high-speed operating characteristics were confirmed with a response time of less than 30 ms. From these derived data, we confirmed that the ideal spin coating speed is 3,000 rpm. And these results provide an optimized polyimide alignment layer process when considering enhanced future LCD manufacturing.

• 한국기계가공학회지
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• 제18권5호
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• pp.37-47
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• 2019

Recently, as demand for various paper containers has rapidly grown, it is inevitable that paper cup-forming machines have increased their manufacturing speed. However, the faster manufacturing speed naturally brings more frequent manufacturing failures, which decreases manufacturing efficiency. As such, it is necessary to develop a system that monitors the failures in real time and diagnoses the failure progress in advance. In this research, a paper cup-forming machine diagnosis system was developed. Three major failure targets, paper deviation, temperature failure, and abnormal vibration, which dominantly affect the manufacturing process when they occur, were monitored and diagnosed. To evaluate the developed diagnosis system, extensive experiments were performed with the actual data gathered from the paper cup-forming machine. Furthermore, the desired system validation was obtained. The proposed system is expected to anticipate and prevent serious promising failures in advance and lower the final defect rate considerably.