• IE interfaces
• /
• v.10 no.3
• /
• pp.189-196
• /
• 1997

This paper presents a cell formation approach for a cellular manufacturing system to minimize the inter-cell moves considering operation sequences. Two new factors are introduced: (1)flow-similarity(FS) for integrating direct/indirect inter-machine flow and similarity (2)machine cell-part moves (CPM) for exactly computing inter-cell moves. FS is used for combining machines and CPM is used for assigning the parts to the preliminary machine cells. In addition, we develop an aggregated heuristic algorithm to form manufacturing machine cells and assign the parts to those cells based on these concepts. We use performance criterion called total inter-cell moves(TICM), which is the total material flow between internal cells and external cells. Results of computational tests on a number of randomly generated test problems show that the suggested heuristic is superior to existing methods.

• The Journal of Information Systems
• /
• v.23 no.2
• /
• pp.25-47
• /
• 2014

Based on the levels of inter-organizational information flow and the degrees of suppliers' power, this study aims to develop a framework useful for classifying four types of the buyer's e-commerce strategies in manufacturing firms: e-marketplace, e-partnership, e-procurement and supplier's e-marketplace (e-distribution). We adopted a multi-methodological approach by mixing both qualitative and quantitative methods. After developing a framework, through the cases of Cisco, JAL, Toyota Motor, KIST, AMP, and 3M, this paper aims to confirm the actual existence of the four forms of e-commerce. The results from the cases supported the four types of e-commerce strategies in manufacturing firms. With the empirical data, we also demonstrated the configuration of the framework and the four types of e-commerce strategies, and identified the characteristics (i.e., size, age, actual adoption rate of the each type of e-commerce, and supply-chain performance) of the organizations employing each strategy.

• Journal of the Semiconductor & Display Technology
• /
• v.10 no.2
• /
• pp.1-5
• /
• 2011

In recent years, worldwide production of solar wafers increased rapidly. Therefore, the solar wafer technology in the developed countries already has become an industry, and related industries such as solar wafer manufacturing equipment have developed rapidly. In this paper we propose the color classification method of the polycrystalline solar wafer that needed in manufacturing equipment. The solar wafer produced in the manufacturing process does not have a uniform color. Therefore, the solar wafer panels made with insensitive color uniformity will fall off the aesthetics. Gaussian mixture models (GMM) are among the most statistically mature methods for clustering and we use the Gaussian mixture models for the classification of the polycrystalline solar wafers. In addition, we compare the performance of the color feature vector from various color space for color classification. Experimental results show that the feature vector from YCbCr color space has the most efficient performance and the correct classification rate is 97.4%.

• IE interfaces
• /
• v.11 no.2
• /
• pp.119-124
• /
• 1998

This paper proposes a new part family classification system (IPFACS: Image Processing and Fuzzy ART based Clustering System), which incorporates image processing techniques and a modified fuzzy ART neural network algorithm. IPFACS can classify parts based on geometrical shape and manufacturing attributes, simultaneously. With a proper reduction and normalization of an image data through the image processing methods and adding method in the modified Fuzzy ART, different types of geometrical shape data and manufacturing attribute data can be simultaneously classified in the same system. IPFACS has been tested for an example set of hypothetical parts. The results show that IPFACS provides a good feasible approach to form families based on both geometrical shape and manufacturing attributes.

• Current Optics and Photonics
• /
• v.6 no.3
• /
• pp.304-312
• /
• 2022

Digital images of cultural relics captured using line scan cameras present limitations due to uneven intensity and low contrast. To address this issue, this report proposes a colour linear array image enhancement method that can maintain a constant colour. First, the colour linear array image is converted from the red-green-blue (RGB) colour space into the hue-saturation-intensity colour space, and the three components of hue, saturation, and intensity are separated. Subsequently, the hue and saturation components are held constant while the intensity component is processed using the established intensity compensation model to eliminate the uneven intensity of the image. On this basis, the contrast of the intensity component is enhanced using an improved local contrast enhancement method. Finally, the processed image is converted into the RGB colour space. The experimental results indicate that the proposed method can significantly improve the visual effect of colour linear array images. Moreover, the objective quality evaluation parameters are improved compared to those determined using existing methods.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
• /
• 2022.10a
• /
• pp.210-212
• /
• 2022

In the manufacturing industry, various sensors are attached to monitor the status of production facility. In many cases, the data obtained through these sensors is time series data. In order to determine whether the status of the production facility is abnormal, the process of extracting patterns from time series data must be preceded. Also various methods for extracting patterns from time series data are studied. In this paper, we use matrix profile algorithm to extract patterns from the collected multivariate time series data. Through this, the pattern of multi sensor data currently being collected from the CNC machine is extracted.

• Journal of Industrial Technology
• /
• v.43 no.1
• /
• pp.49-55
• /
• 2023

Cluster tools are extensively employed in various wafer fabrication processes within the semiconductor manufacturing industry, including photo lithography, etching, and chemical vapor deposition. Contemporary fabrication facilities encounter customer orders with technical specifications that are similar yet slightly varied. Consequently, modern fabrications concurrently manufacture two or three different wafer types using a cluster tool to maximize chamber utilization and streamline the flow of wafer lots between different process stages. In this review, we introduce two methods of concurrent processing of multiple wafer types: 1) concurrent processing of multiple wafer types with different job flows, 2) concurrent processing of multiple wafer types with identical job flows. We describe relevant research trends and achievements and discuss future research directions.

• Proceedings of the KWS Conference
• /
• 2003.05a
• /
• pp.228-230
• /
• 2003

Recently, lots of joining methods of thin metal sheets are being developed in order to improve joint quality and productivity in manufacturing area. Current existing welding methods are continuously challenged as new materials and smaller thickness of metal sheets are required. In this study, laser plug brazing process was investigated as a new joining method of thin metal sheets. A CO2 laser system with automatic feeding of filler metal wire and flux was developed, and laser plug brazing experiments were conducted. The brazed joints were analyzed using various methods.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.520-523
• /
• 2009

The drive towards lowering costs and increasing frame rates results in new panel designs and thereby new photomasks designs. One common way to reduce cost is to reduce the number of production steps. For this multi tone photomasks (MTM) are needed. MTMs contain more information and increases photomask placement requirements. Increasing frame rates lead to shrinking geometries. The combination of HTM and shrinking geometries drastically increases the requirements imposed on the pattern generators used to print the photomasks. New methods are therefore needed to enable future photomask manufacturing. This paper introduces three advanced image quality enhancing methods.

• The Journal of Korean Academy of Prosthodontics
• /
• v.58 no.3
• /
• pp.177-184
• /
• 2020

Purpose: The purpose of this study was to compare and evaluate the tensile bond strength of chairside reline resin to denture base resin fabricated by different methods (subtractive manufacturing, additive manufacturing, and conventional heat-curing). Materials and methods: Denture base specimens were fabricated as cuboid specimens with a width of 25 mm × length 25 mm × height 3 mm by subtractive manufacturing (VITA VIONIC BASE), additive manufacturing (NextDent Base) and conventional heat-curing (Lucitone 199). After storing the specimens in distilled water at 37℃ for 30 days and drying them, they were relined with polyethyl methacrylate (PEMA) chairside reline resin (REBASE II Normal). The subtractive and additive manufacturing groups were set as the experimental group, and the heat-curing group was set as the control group. Ten specimens were prepared for each group. After storing all bound specimens in distilled water at 37℃ for 24 hours, the tensile bond strength between denture bases and chairside reline resin was measured by a universal testing machine at a crosshead speed of 10 mm/min. The fracture pattern of each specimen was analyzed and classified into adhesive failure, cohesive failure, and mixed failure. Tensile bond strength, according to the fabrication method, was analyzed by 1-way ANOVA and Bonferroni's method (α=.05). Results: Mean tensile bond strength of the heat-curing group (2.45 ± 0.39 MPa) and subtractive manufacturing group (2.33 ± 0.39 MPa) had no significant difference (P>.999). The additive manufacturing group showed significantly lower tensile bond strength (1.23 ± 0.36 MPa) compared to the other groups (P<.001). Most specimens of heat-curing and subtractive manufacturing groups had mixed failure, but mixed failure and adhesive failure showed the same frequency in additive manufacturing group. Conclusion: The mean tensile bond strength of the subtractive manufacturing group was not significantly different from the heat-curing group. The additive manufacturing group showed significantly lower mean tensile bond strength than the other two groups.