• Title/Summary/Keyword: low-temperature oxide

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Effects of Film Formation Conditions on the Chemical Composition and the Semiconducting Properties of the Passive Film on Alloy 690

  • Jang, HeeJin;Kwon, HyukSang
    • Corrosion Science and Technology
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    • v.5 no.4
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    • pp.141-148
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    • 2006
  • The chemical composition and the semiconducting properties of the passive films formed on Alloy 690 in various film formation conditions were investigated by XPS, photocurrent measurement, and Mott-Schottky analysis. The XPS and photocurrent spectra showed that the passive films formed on Alloy 690 in pH 8.5 buffer solution at ambient temperature, in air at $400^{\circ}C$, and in PWR condition comprise $Cr_2O_3$, $Cr(OH)_3$, ${\gamma}-Fe_2O_3$, NiO, and $Ni(OH)_2$. The thermally grown oxide in air and the passive film formed at high potential (0.3 $V_{SCE}$) in pH 8.5 buffer solution were highly Cr-enriched, whereas the films formed in PWR condition and that formed at low potential (-0.3 $V_{SCE}$) in pH 8.5 buffer solution showed relatively high Ni content and low Cr content. The Mott-Schottky plots exhibited n-type semiconductivity, inferring that the semiconducting properties of the passive films formed on Alloy 690 in various film formation conditions are dominated by Cr-substituted ${\gamma}-Fe_2O_3$. The donor density, i.e., concentration of oxygen vacancy, was measured to be $1.2{\times}10^{21}{\sim}4.6{\times}10^{21}cm^{-3}$ and lowered with increase in the Cr content in the passive film.

Effects of Ga Composition Ratio and Annealing Temperature on the Electrical Characteristics of Solution-processed IGZO Thin-film Transistors

  • Lee, Dong-Hee;Park, Sung-Min;Kim, Dae-Kuk;Lim, Yoo-Sung;Yi, Moonsuk
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.2
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    • pp.163-168
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    • 2014
  • Bottom gate thin-film transistors were fabricated using solution processed IGZO channel layers with various gallium composition ratios that were annealed on a hot plate. Increasing the gallium ratio from 0.1 to 0.6 induced a threshold voltage shift in the electrical characteristics, whereas the molar ratio of In:Zn was fixed to 1:1. Among the devices, the IGZO-TFTs with gallium ratios of 0.4 and 0.5 exhibited suitable switching characteristics with low off-current and low SS values. The IGZO-TFTs prepared from IGZO films with a gallium ratio of 0.4 showed a mobility, on/off current ratio, threshold voltage, and subthreshold swing value of $0.1135cm^2/V{\cdot}s$, ${\sim}10^6$, 0.8 V, and 0.69 V/dec, respectively. IGZO-TFTs annealed at $300^{\circ}C$, $350^{\circ}C$, and $400^{\circ}C$ were also fabricated. Annealing at lower temperatures induced a positive shift in the threshold voltage and produced inferior electrical properties.

A thermoelastic microactuator with planar latch-up operation (Latch-up 특성을 갖는 평면형의 열구동 마이크로 액츄에이터)

  • 이종현;권호남;전진철;이선규;이명래;장원익;최창억;김윤태
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.865-868
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    • 2001
  • We designed and fabricated a planner-type thermoelastic microactuator with a latch-up operation for optical switching. Latch-up actuation is prerequisite to implement an optical switch with low power consumption and high reliability. The proposed microactuator consists of four cantilever-shaped thermal actuators, four displacement linkages, two shallow arch-shaped leaf springs, a mobile shuttle mass with a micromirror, and four elastic boundaries. The structural layer of the planar microactuator is phosphorous-doped 12$\mu\textrm{m}$-thick polysilicon, and the sacrificial layer is LTO(Low Temperature Oxide) of 3$\mu\textrm{m}$thickness. The displacement of actuator is as large as 3$\mu\textrm{m}$when the length of actuation bar is 100$\mu\textrm{m}$in length at 5V input voltage. The proposed microactuators have advantages of easy assembly with other optical component by way of fiber alignment in the substrate plane, and its fabrication process features simplicity while retaining batch-fabrication economy.

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Selective fabrication and etching of vertically aligned Si nanowires for MEMS

  • Kar, Jyoti Prakash;Moon, Kyeong-Ju;Das, Sachindra Nath;Kim, Sung-Yeon;Xiong, Junjie;Choi, Ji-Hyuk;Lee, Tae-Il;Myoung, Jae-Min
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2010.05a
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    • pp.27.2-27.2
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    • 2010
  • In recent years, there is a strong requirement of low cost, stable microelectro mechanical systems (MEMS) for resonators, microswitches and sensors. Most of these devices consist of freely suspended microcantilevers, which are usually made by the etching of some sacrificial materials. Herein, we have attempted to use Si nanowires, inherited from the parent Si wafer, as a sacrificial material due to its porosity, low cost and ease of fabrication. Prior to the fabrication of the Si nanowires silver nanoparticles were continuously formed on the surface of Si wafer. Vertically aligned Si nanowires were fabricated from the parent Si wafers by aqueous chemical route at $50^{\circ}C$. Afterwards, the morphological and structural characteristics of the Si nanowires were investigated. The morphology of nanowires was strongly modulated by the resistivity of the parent wafer. The 3-step etching of nanowires in diluted KOH solution was carried out at room temperature in order to control the fast etching. A layer of $Si_3N_4$ (300 nm) was used for the selective fabrication of nanowires. Finally, a freely suspended bridge of zinc oxide (ZnO) was fabricated after the removal of nanowires from the parent wafer. At present, we believe that this technique may provide a platform for the inexpensive fabrication of futuristic MEMS.

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Electrical Properties of Tape-Cast Zirconia Thin Plates with the Mixing Ratios of $3Y-ZrO_2$ and $8Y-ZrO_2$ Powders ($3Y-ZrO_2$$8Y-ZrO_2$ 분말의 혼합비율에 따른 테이프 캐스트된 지르코니아 박판의 전기적 성질의 변화)

  • 김선재;강대갑;김경호;정충환;박지연
    • Journal of the Korean Ceramic Society
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    • v.31 no.9
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    • pp.969-974
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    • 1994
  • After adding 8Y-ZrO2 powders to 3Y-ZrO2 powders at ratios of 0, 33, 50, 67, and 100% by weight, the mixed yttria-stabilized zirconia specimens were fabricated into thin plate using tape~casting method and then sintered at 150$0^{\circ}C$ for 4h in air. The crystalline structure, microstructure and electrical properties of the sintered zirconia thin plates were investigated by using X-ray diffractometer, scanning electron microscope and impedance analyser, respectively. At the temperatures higher than 75$0^{\circ}C$, the sintered thin plate with 33% 8Y-ZrO2 content shows higher mechanical properties and lower electrical resistivity than 8Y-ZrO2 thin plate which is generally used as an electrolyte for solid oxide fuel cells. This is due to the fact that the zirconia thin plates with low 8Y-ZrO2 content maintain the slope of low temperature region up to high temperatures, whereas at temperatures higher than 50$0^{\circ}C$ the slope decrease in the zirconia thin plates with high 8Y-ZrO2 content.

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Fabrication of Anode-Supported SOFC Single Cells via Tape-Casting of Thin Tapes and Co-Firing (박막 테이프캐스팅과 동시소성에 의한 연료극 지지형 SOFC 단전지 제조)

  • Moon, Hwan;Kim, Sun-Dong;Hyun, Sang-Hoon;Kim, Ho-Sung
    • Journal of the Korean Ceramic Society
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    • v.43 no.12 s.295
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    • pp.788-797
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    • 2006
  • An anode-supported SOFC single cell having $5{\mu}m$ thin electrolyte was fabricated cost-effectively by tape casting, laminating, and co-filing of anode (NiO-YSZ), cathode (LSM-YSZ), and electrolyte (YSZ) components. The optimal slurry compositions of the green tapes for SOFC components were determined by an analysis of the mean diameter, the slurry viscosity, the tensile strength/strain of the green tapes, and their green microstructures. The single cells with a dense electrolyte and porous electrodes could be co-fired successfully at $1325\sim1350^{\circ}C$ by controlling the contents of pore former and the ratio of coarse YSZ and fine YSZ in the anode and the cathode. The single cell co-fired at $1350^{\circ}C$ showed $100.2mWcm^{-2}$ of maximum power density at $800^{\circ}C$ but it was impossible to apply it to operate at low temperature because of low performance and high ASR, which were attributed to formation of the secondary phases in the cathode and the interface between the electrolyte and the cathode.

Low Temperature Deposition of the $In_2O_3-SnO_2$, $SnO_2$ and $SiO_2$ on the Plastic Substrate by DC Magnetron Sputtering

  • Kim, Jin-Yeol;Kim, Eung-Ryeol;Lee, Jae-Ho;Kim, Soon-Sik
    • Journal of Information Display
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    • v.2 no.1
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    • pp.38-42
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    • 2001
  • Thin films of $In_2O_3-SnO_2$(ITO), $SnO_2$, and $SiO_2$ were prepared on the PET substrate by DC magnetron roll sputtering. 135 nm thick ITO film on $SiO_2$/PET substrate has sheet resistance as low as 55 ${\Omega}/square$ and transmittance as high as 85%. $H_2O$gas permeation through the film was 0.35 g/$m^2$ in a day. These properties are enough on optical film for the plastic LCD substrate or touch panel. Both refractive index and sheet resistance of ITO was found to be very sensitive to $O_2$ flow rate. Oxygen flow conditions have been optimized from 4 to 5 SCCM at $10^{-3}$torr. It is also shown that both thickness of $SnO_2$ and refractive index of $SiO_2$ decrease as $O_2$ flow rate increases.

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A Study on NOx Emission Characteristics of An Industrial Gas Turbine (산업용 가스터빈의 NOx 배출 특성에 관한 연구)

  • Jeong, Jai-Mo;Park, Jung-Kyu
    • Journal of the Korean Society of Combustion
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    • v.9 no.1
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    • pp.11-17
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    • 2004
  • The purposes of this study are to analyze nitrogen oxides(NOx) formation mechanism and to reduce abnormal NOx emissions in gas turbines. Industrial gas turbines emissions have potential to negative affect to the atmosphere in many different ways such as photochemical smog, acid rain and global warming. In conventional gas turbine combustors, one of the main pollutants such as nitrogen oxide(NOx) species, are principally formed from combustion process of fuel with oxygen in the primary combustion zone, and their emission levels are highly depend on peak temperatures in the combustor. In order to examine the characteristics and the effect of NOx formation, we used gas turbine of which commercial operating in Korea. From the examination, it has been found that NOx emissions are relatively high at low load(output) and during combustion mode change. Also, the effect of Air/Fuel ratio was considered. As the Air/Fuel ratio was increased in Lean-Lean mode, the NOx emission was decreased. The results of this study indicated that NOx emission levels are highly depend on peak temperature and pressure of combustion process in the combustor.

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Gate Electrode Dependence of MFSFETs using $LiNbO_3$ Thin Film ($LiNbO_3$ 박막을 이용한 MFSFET의 게이트 전극 의존성)

  • 정순원;김용성;김채규;이남열;김광호
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.25-28
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    • 1999
  • Metal ferroelectric semiconductor Field Effect- Transistors(MFSFET) with various gate electrodes, that are aluminum, platinum and poly -Si, using LiNbO$_3$/Si(100) structures were fabricated and the properties of the FETs have been discussed. The drain current of the state of FET with Pt electrode was more than 3 orders of magnitude larger than the state current at the same gate voltage of 1.5 V, 7.rich means the memory operation of the MFSFET. A write voltage as low as about $\pm$4 V, which is applicable to low power integrated circuits, was used for polarization reversal. The retention properties of the FET using Al electrode were quite good up to about 10$^3$s and using Pt electrode remained almost the same value of its initial value over 2 days at room temperature.

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Electrical characteristics of poly-Si NVM by using the MIC as the active layer

  • Cho, Jae-Hyun;Nguyen, Thanh Nga;Jung, Sung-Wook;Yi, Jun-Sin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.151-151
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    • 2010
  • In this paper, the electrically properties of nonvolatile memory (NVM) using multi-stacks gate insulators of oxide-nitride-oxynitride (ONOn) and active layer of the low temperature polycrystalline silicon (LTPS) were investigated. From hydrogenated amorphous silicon (a-Si:H), the LTPS thin films with high crystalline fraction of 96% and low surface's roughness of 1.28 nm were fabricated by the metal induced crystallization (MIC) with annealing conditions of $650^{\circ}C$ for 5 hours on glass substrates. The LTPS thin film transistor (TFT) or the NVM obtains a field effect mobility of ($\mu_{FE}$) $10\;cm^2/V{\cdot}s$, threshold voltage ($V_{TH}$) of -3.5V. The results demonstrated that the NVM has a memory window of 1.6 V with a programming and erasing (P/E) voltage of -14 V and 14 V in 1 ms. Moreover, retention properties of the memory was determined exceed 80% after 10 years. Therefore, the LTPS fabricated by the MIC became a potential material for NVM application which employed for the system integration of the panel display.

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