• Title/Summary/Keyword: low-temperature bonding

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Numerical Study on the Production of Methane Hydrate by Depressurization Method (감압법을 이용한 메탄하이드레이트 생산에 대한 수치적 연구)

  • Kim, Jin-Hong;Chun, Won-Gee;Kim, Nam-Jin
    • 한국신재생에너지학회:학술대회논문집
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    • 2007.06a
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    • pp.519-523
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    • 2007
  • Gas(or methane) hydrates are solid solutions when water molecules are linked through hydrogen bonding and create host lattice cavities that can enclose a large variety of guest gas molecules. The natural gas hydrate crystal may exist at low temperature above the normal freezing point of water and high pressure greater than about 30 bars. A lot of quantities of natural gas hydrates exists in the earth and many production schemes are being studied. In the present investigation, depressurization method was considered to predict the production of gas and the simulation of the two phase flow - gas and water - in porous media is being carried out. The simulation show about the fluid flow in porous media have a variety of applications in industry. Results provide the appearance of gas and water production, the pressure profile, the saturation of gas/ water/ hydrates profiles and the location of the pressure front.

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A Study on Magnetic Abrasive (자기 연마재에 관한 연구)

  • Kim, Hee-Nam
    • Journal of the Speleological Society of Korea
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    • no.81
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    • pp.1-5
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    • 2007
  • The magnetic polishing is the useful method to finish some machinery fabrications by using magnetic power This method is one of the precision techniques and has an aim for clean technology in the transportation of the pure gas in the clean pipes. The magnetic abrasive polishing method is not so common in the field of machine that it is not known to widely. There are rarely researcher in this feilld because of non-effectiveness of magnetic abrasive. Therefore, in this paper we deals with the development of the magnetic abrasive with the fse of Sr-Ferrite. In this development, abrasive grain A has been made by using the resin bond fabricated at low temperature. And magnetic abrasive powder was fabricated from the Sr-Ferrite which was crushed into 200 mesh. The XRD analysis result shows that only A abrasive and Sr-Ferrite crystal peaks were detected, explaining that resin bond was not any more to contribute chemical reaction. From SEM analysis, we found that A abrasive and Sr-Ferrite were strongly bonding with each other.

Characteristics of Cladding Process with High Viscosity Mixing Powder Using $CO_2$ Laser ($CO_2$ 레이저를 이용한 고점성 혼합분말의 클래딩 가공 특성)

  • 이영곤;전병철;오동수;서병권;김재도
    • Proceedings of the KWS Conference
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    • 2000.10a
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    • pp.256-259
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    • 2000
  • High viscosity mixing powder is a very useful material for laser cladding. This material has a high viscosity so that it can be sticked to substrate. Therefore, Laser cladding can be performed on a curved or slope surface. Laser cladding can be easily performed with the material instead of wire that is difficult to be manufactured in some case. In this experiment, it was used a high viscosity mixing powder which consists of a high temperature flux and a bronze powder. And AC2B alloy material was used as a substrate. Flux prevents the clad layer from being oxidized and increases bonding property between substrate and cladding material. It makes possible to laser cladding at low level energy.

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Effects of Intermediate Layer in DLC Thin Film on Al2O3 for Improvement of High Temperature Strength

  • Ok, Chul-Ho
    • Transactions on Electrical and Electronic Materials
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    • v.8 no.3
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    • pp.125-130
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    • 2007
  • DLC coating on ceramics is very useful for manufacturing the materials with hardness and low friction. Adhesion of DLC thin film on ceramics, on the other hand, is usually very weak. Adhesion of DLC film depends on many parameters such as contamination and chemical bonding between thin film and substrate. In this study, adhesion of DLC film on ceramics was improved by the intermediate layer when the plasma immersion ion deposition (PIID) technique was applied. It is found that the chemical composition and the thickness of intermediate layer have significantly an effect on the adhesion of DLC thin film on $Al_2O_3$.

A Study on Wafer-Level Package of RF MEMS Devices Using Dry Film Resist (Dry Film Resist를 이용한 RF MEMS 소자의 기판단위 실장에 대한 연구)

  • Kang, Sung-Chan;Kim, Hyeon-Cheol;Chun, Kuk-Jin
    • Proceedings of the IEEK Conference
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    • 2008.06a
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    • pp.379-380
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    • 2008
  • This paper presents a wafer-level package using a Dry Film Resist(DFR) for RF MEMS devices. Vertical interconnection is made through the hole formed on the glass cap. Bonding using the DFR has not only less effects on the surface roughness but also low process temperature. We used DFR as adhesive polymer and made the vertical interconnection through Au electroplating. Therefore, we developed a wafer-level package that is able to be used in RF MEMS devices and vertical interconnection.

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Development of the Magnetic Abrasive Using Worthless Mineral (폐광물을 이용한 자기 연마재 개발)

  • Kim, Hee-Nam;Kim, Dong-Wook
    • Journal of the Speleological Society of Korea
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    • no.70
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    • pp.45-50
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    • 2006
  • The magnetic polishing is the useful method to finish using magnetic power of magnet. This method is one of precision polishing techniques and has an aim of the clean technology using for the pure of gas and inside of the clean pipe for transportation. The magnetic abrasive polishing method is not so common for machine that it is not spreaded widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. Therefore, in this paper deals with development of the magnetic abrasive using worthless mineral. In this development, abrasive grain WA and GC used to resin bond fabricated low temperature. And magnetic material was fabricated from the worthless mineral which were closed into 200 mesh grit type. The XRD analysis result show that only WA and GC abrasive and worthless mineral crystal peaks detected which explains resin bond was not any more chemical reaction. From SEM analysis it is found that WA and GC abrasive and worthless mineral were strong bonding with each other by bond.

Joining of lead-free solder(Sn-4-0 Ag-0-5 Cu) balls with In-48 Sn for low temperature bonding (고온 솔더(Sn-4.0 Ag-0.5 Cu)와 저온 솔더(In-48 Sn)를 이용한 저온 접합 공정에 관한 연구)

  • 안경수;강운병;김영호
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.80-83
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    • 2003
  • 본 연구에서는 고온 솔더 범프와 저온 솔더 패드를 이용하여 $140^{\circ}C$에서 1분간의 리플로 공정을 통해 접합에 성공하였다. 고온 솔더 범프로 Sn-4.0Ag-0.5Cu 솔더 볼을 사용하였고, 저온 솔더는 In-48Sn $(mp:\;117^{\circ}C)$ 솔더를 기판에 evaporation 방법으로 두께 $20\;{\mu}m$의 패드 형태로 증착하였다. $140^{\circ}C$에서 1분간의 리플로 공정을 통해 칩과 기판을 접합하였으며, 접합 단면을 관찰해 본 결과 저온 솔더가 녹아 고온 솔더에 wetting된 것을 관찰하였다. 이 시편을 상온에서 시효처리를 실시한 결과 시간의 경과에 따라 저온 솔더와 고온 솔더가 상호 확산하여 약 $40\;{\mu}m$였던 확산층의 범위가 점차 증가하는 것을 관찰할 수 있었다. 또한, 리플로 공정변수에 따른 솔더의 미세구조 변화 및 ball shear strength등의 기계적 특성에 대해 고찰하였다.

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A Study on Low Temperature Fine Pitch Solder Bump Bonding Technique Using Interdiffusion of Solder Materials (솔더재료의 확산을 이용한 미세피치 솔더범프 접합방법)

  • 이민석;이승현;김영호
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.11a
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    • pp.72-75
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    • 2003
  • 솔더의 상호확산을 이용한 저온 칩 접합을 구현하기 위하여 $117^{\circ}C$의 공정 온도를 가지는 In과 Sn 솔더패드를 $25\;mm^2$의 접합면적에 형성하고 두 솔더의 융점 보다 낮은 온도인 $120^{\circ}C$에서 접합을 시행하였다. 30초의 반응시간에서도 접합이 이루어 졌으며 반응시간이 지남에 따라 두 솔더가 반응하여 혼합상을 형성하였다. 솔더패드 접합에서 접합부는 낮은 접속저항과 높은 접속강도를 가짐을 확인할 수 있었다. $40\;{\mu}m$의 극미세피치의 In, Sn 솔더 범프를 형성하여 접합부를 형성하였으며 daisy chain을 형성한 접합부를 이용하여 평균 $65\;m\Omega/bump$ 저항값을 얻을 수 있었다. 상온에서 시효후 $54\%$의 접속저항이 감소함을 확인할 수 있었다.

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Ultrafine Grained Bulk Al Matrix Carbon Nanotube Composites Processed by High Pressure Torsion (고압비틀림 성형 공정에 의한 Al 기지 CNT 복합재료의 초미세결정 벌크화)

  • Joo,, S.H.;Kim, H.S.
    • Transactions of Materials Processing
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    • v.19 no.7
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    • pp.423-428
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    • 2010
  • Carbon nanotubes(CNTs) are expected to be ideal reinforcements of metal matrix composite materials used in aircraft and sports industries due to their high strength and low density. In this study, a high pressure torsion(HPT) process at an elevated temperature(473K) was employed to achieve both powder consolidation and grain refinement of aluminummatrix nanocomposites reinforced by 5vol% CNTs. CNT/Al nanocomposite powders were fabricated using a novel molecular-level mixing process to enhance the interface bonding between the CNTs and metal matrix before the HPT process. The HPT processed disks were composed of mostly equilibrium grain boundaries. The CNT-reinforced ultrafine grained microstructural features resulted in high strength and good ductility.

A Study on Magnetic Abrasive (자기 연마재에 관한 연구)

  • Kim, Hee-Nam
    • Design & Manufacturing
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    • v.2 no.4
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    • pp.44-47
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    • 2008
  • The magnetic polishing is the useful method to finish some machinery fabrications by using magnetic power. This method is one of the precision techniques and has an aim for clean technology in the transportation of the pure gas in the clean pipes. The magnetic abrasive polishing method is not so common in the field of machine that it is not known to widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. Therefore, in this paper we deals with the development of the magnetic abrasive with the use of Sr-Ferrite. In this development, abrasive grain A has been made by using the resin bond fabricated at low temperature. And magnetic abrasive powder was fabricated from the Sr-Ferrite which was crushed into 200 mesh. The XRD analysis result shows that only A abrasive and Sr-Ferrite crystal peaks were detected, explaining that resin bond was not any more to contribute chemical reaction. From SEM analysis, we found that A abrasive and Sr-Ferrite were strongly bonding with each other.

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