• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.109-109
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• 2000

Recently, carbon nanotube has been investigating for field emission display ( (FED) applications due to its high electron emission at relatively low electric field. However, the growing of carbon nanotube generally requires relatively high temperature processing such as arc-discharge (5,000 ~ $20,000^{\circ}C$) and laser evaporation (4,000 ~ $5,000^{\circ}C$) methods. In this presentation, low temperature growing of carbon nanotube by plasma enhanced chemical vapor deposition (PECVD) using nickel catalyst which is compatible to conventional FED processing temperature will be described. Carbon n notubes with average length of 100 run and diameter of 2 ~ $3\mu$ill were successfully grown on silicon substrate with native oxide layer at $550^{\circ}C$using nickel catalyst. The morphology and microstructure of carbon nanotube was highly depended on the processing temperature and nickel layer thickness. No significant carbon nanotube growing was observed with samples deposited on silicon substrates without native oxide layer. This is believed due to the formation of nickel-silicide and this deteriorated the catalytic role of nickel. The formation of nickel-silicide was confirmed by x-ray analysis. The role of native oxide layer and processing parameter dependence on microstructure of low temperature grown carbon nanotube, characterized by SEM, TEM XRD and R없nan spectroscopy, will be presented.

• ETRI Journal
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• v.38 no.2
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• pp.235-243
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• 2016

A low-noise readout integrated circuit (ROIC) for a microelectromechanical systems (MEMS) microphone is presented in this paper. A positive feedback signal amplification technique is applied at the front-end of the ROIC to minimize the effect of the output buffer noise. A feedback scheme in the source follower prevents degradation of the noise performance caused by both the noise of the input reference current and the noise of the power supply. A voltage booster adopts noise filters to cut out the noise of the sensor bias voltage. The prototype ROIC achieves an input referred noise (A-weighted) of -114.2 dBV over an audio bandwidth of 20 Hz to 20 kHz with a $136{\mu}A$ current consumption. The chip is occupied with an active area of $0.35mm^2$ and a chip area of $0.54mm^2$.

• Journal of the Korean Ceramic Society
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• v.46 no.3
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• pp.313-316
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• 2009

A zinc borosilicate glass having a low softening temperature of $490^{\circ}C$ has been investigated as a protective layer for Ag patterns against chemical reactions with a $I^-/I_3^-$ electrolyte in dye-sensitized solar cells (DSSCs). A thick glass layer was prepared by the typical screen printing and firing processes to obtain a final thickness of ${\sim}5{\mu}m$. The chemical leaching performance of the glass layer in the electrolyte revealed that the reactive Ag pattern can be significantly protected by utilizing the low softening protective layer. The electrical resistance of the FTO-coated glass substrate was effectively maintained at a low value of ${\sim}27{\Omega}$ as long as the glass layer was well densified at a sufficiently high temperature of ${\sim}520^{\circ}C$. The transmittance of the layer was near 60%, depending on the firing temperature of the glass layer.

• Journal of the Korean Ceramic Society
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• v.50 no.3
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• pp.226-230
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• 2013

We performed high pressure high temperature (HPHT) sintering for the 20 nm MgO powders at the temperatures from $600^{\circ}C$ to $1200^{\circ}C$ for only 5 min under 7 GPa pressure condition. To investigate the microstructure evolution and physical property change of the HPHT sintered MgO samples, we employed a scanning electron microscopy (SEM), density and Vickers hardness measurements. The SEM results showed that the grain size of the sintered MgO increased from 200 nm to $1.9{\mu}m$ as the sintering temperature increased. The density results showed that the sintered MgO achieved a more than 95% of the theoretical density in overall sintering temperature range. Based on Vickers hardness test, we confirmed that hardness increased as temperature increased. Our results implied that we might obtain the dense sintered MgO samples with an extremely short time and low temperature HPHT process compared to conventional electrical furnace sintering process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.08a
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• pp.98-102
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• 2003

$Ba_2NaNb_5O_{15}$, hereafter BNN, thin films are attractive candidates for nonvolatile memory and electro-optic devices. In the present work, thin films that have different contents of Ba, Na and Nb have been prepared by H-MOD technique on silicon and Pt substrates. XRD and SEM were used to investigate the phase evolution behavior and the microstructure of the films. It was found that the films of about 450nm thick were crack-free and uniform in microstructure. Nb content strongly influenced the phase formation of the films, where low temperature phase was always formed at the stoichiometric BNN composition. However, the amount of low temperature phase decreased with the increase of excess Nb content, and the single phase (orthorhombic tungsten bronze structure) BNN thin film was obtained at the temperature as low as $750^{\circ}C$ for samples with excess niobium. From this study, the sub-solidus phase diagram below $850^{\circ}C$ for $BaO-Na_2O-Nb_2O_5$ ternary system is proposed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.2
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• pp.106-112
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• 2007

Advanced back-end processing requires the integration of low-k dielectrics and Cu. However, in the presence of an electric field and a temperature, positive Cu ions may drift rapidly through dielectric and causing reliability problems. Therefore, in this paper, Cu+ drift diffusion in two low-k materials and silicon oxide is evaluated. The drift diffusion is investigated by measuring shifts in the flat band voltage of capacitance-voltage measurements on Cu gate capacitors after bias thermal stressing. The Cu+ drift late in $SiO_{x}C_{y}\;(2.85{\pm}0.03)$ and Polyimide(2.7${\leq}k{\leq}3.0$) is Considerably lower than in thermal oxide.

• Transactions of Materials Processing
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• v.23 no.2
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• pp.110-115
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• 2014

Low cycle fatigue characteristics are very important in the development of automobile suspension parts. Fatigue properties using the strain life approach are usually obtained from low cycle fatigue tests. However, low cycle fatigue testing requires a lot of time and cost. In the current study, an attempt to estimate low cycle fatigue properties of high strength steel sheet from tensile test and tensile simulations is performed. In addition, low cycle fatigue testing was conducted to compare the fatigue properties obtained from tensile testing and simulations. In conclusion, the results effectively predict the low cycle fatigue properties. However, some deviations still exist.

• Journal of the Korean Wood Science and Technology
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• v.38 no.2
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• pp.117-123
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• 2010

The objective of this research was executed to investigate the effect of molar ratio of formaldehyde to urea and melamine (F/(U+M)) of urea-melamine-formaldehyde (UMF) resin on bonding high and low moisture content veneers. For that purpose, UMF resin types with 5 different F/(U+M) molar ratios (1.45, 1.65, 1.85, 2.05, and 2.25) synthesized were used in present study. First, their curing behavior was evaluated by differential scanning calorimetry. Second, their adhesion performance in bonding high and low moisture content veneers was evaluated by probe tack and dry and wet shear strength tests. Curing temperature and reaction enthalpy decreased with the increase of F/(U+M) molar ratio. And the dry and wet shear strengthsof plywood manufactured from low moisture content veneers were higher than thoseof plywood manufactured from high moisture content veneers. Also, the maximum initial tack force on the low moisture content veneer was higher than that on the high moisture content veneer.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1335-1336
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• 2007

Among the emerging non-volatile memory technologies, phase change memories are the most attractive in terms of both performance and scalability perspectives. Phase-change random access memory(PRAM), compare with flash memory technologies, has advantages of high density, low cost, low consumption energy and fast response speed. However, PRAM device has disadvantages of set operation speed and reset operation power consumption. In this paper, we investigated scalability of $Ge_{1}Se_{1}Te_{2}$ chalcogenide material to improve its properties. As a result, reduction of phase change region have improved electrical properties of PRAM device.

• Laser Solutions
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• v.15 no.1
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• pp.15-19
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• 2012

The fabrication of internal diffraction gratings with photoinduced refractive index modification in transparent materials was demonstrated using low-density plasma formation excited by a femtosecond (130 fs) Ti: sapphire laser (${\lambda}_p$=800 nm). The refractive index modifications with diameters ranging from $1{\mu}m$ to $3{\mu}m$ were photoinduced after plasma formation occurred upon irradiation with peak intensities of more than $2.0{\times}10^{13}W/cm^2$. The graded refractive index profile was fabricated to be a symmetric around from the center of the point at which low-density plasma occurred.