• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.276-279
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• 2004

Plasma enhanced chemical vapor deposition (PECVD) of silicon nitride (SiN) is a proven technique for obtaining layers that meet the needs of surface passivation and anti-reflection coating. In addition, the deposition process appears to provoke bulk passivation as well due to diffusion of atomic hydrogen. This bulk passivation is an important advantage of PECVD deposition when compared to the conventional CVD techniques. A further advantage of PECVD is that the process takes place at a relatively low temperature of 300t, keeping the total thermal budget of the cell processing to a minimum. In this work SiN deposition was performed using a horizontal PECVD reactor system consisting of a long horizontal quartz tube that was radiantly heated. Special and long rectangular graphite plates served as both the electrodes to establish the plasma and holders of the wafers. The electrode configuration was designed to provide a uniform plasma environment for each wafer and to ensure the film uniformity. These horizontally oriented graphite electrodes were stacked parallel to one another, side by side, with alternating plates serving as power and ground electrodes for the RF power supply. The plasma was formed in the space between each pair of plates. Also this paper deals with the fabrication of multicrystalline silicon solar cells with PECVD SiN layers combined with high-throughput screen printing and RTP firing. Using this sequence we were able to obtain solar cells with an efficiency of 14% for polished multi crystalline Si wafers of size 125 m square.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.04a
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• pp.53-54
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• 2008

We have studied electro-optic characteristics as a function of passivation thickness$(t_p)$ in the fringe-field swiching (FFS) mode using the LC with positive dielectric anisotropy. When $t_p$ is increased from $0.29{\mu}m$ to $3.0{\mu}m$, a maximum transmittance is slightly increased to $2{\mu}m$. However, operating voltage is continuously increased up to above 11v. We found that the tilt angle is decreased between the edge of pixel electrode and the center of each pixel electrode. In the FFS mode using the liquid crystal with positive dielectric anisotropy, transmittance is affected by the tilt angle. When tilt angle is increased, transmittance become decrease. Therefore, in the FFS device, a low tilt angle is favored for high transmittance. It is demonstrated that the suitable passivation thickness make a tilt angle decreased.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.129-134
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• 2004

The development of fabrication processes of polycrystalline-silicon-thin-film transistors (poly-Si TFTs) at low temperatures is reviewed. Rapid crystallization through laser-induced melt-regrowth has an advantage of formation of crystalline silicon films at a low thermal budget. Solid phase crystallization techniques have also been improved for low temperature processing. Passivation of $SiO_2$/Si interface and grain boundaries is important to achieve high carrier transport properties. Oxygen plasma and $H_2O$ vapor heat treatments are proposed for effective reduction of the density of defect states. TFTs with high performance is reported.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.164-164
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• 2008

금속배선공정에서 높은 전도율과 재료의 값이 싸다는 이유로 최근 Cu를 사용하였으나, 디바이스의 구조적 특성을 유지하기 위해 높은 압력으로 인한 새로운 다공성 막(low-k)의 파괴와, 디싱과 에로젼 현상으로 인한 문제점이 발생하게 되었다. 이러한 문제점을 해결하고자, 본 논문에서는 Cu 표면에 Passivation layer를 형성 및 제거하는 개념으로 공정시 연마제를 사용하지 않으며, 낮은 압력조건에서 공정을 수행하기 위해, 전해질의 농도 변화에 따른 Liner sweep voltammetry 법을 사용하여 전압활성화에 의한 전기화학적 반응이 Cu전극에 어떤 영향을 미치는지 연구하였으며, 표면 조성을 알아보기 위하여 Energy Dispersive Spectroscopy (EDS) 분석을 하였고, Cu disk의 결정성과 배향성 관찰을 위해 X-Ray diffraction (XRD)로 금속 표면을 비교하여 실험 결과로 얻어진 데이터를 통하여 ECMP 공정에 적합한 전해액 선정과 농도를 선택하였다.

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.89.2-89.2
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• 2011

Stainless steel bipolar plates have many advantage such as high electrical conductivity and mechanical strength and low fabrication cost. However, they need a passivation layer due to low corrosion resistance under PEM fuel cell operation condition. In this study, polyphenyene sulfide(PPS)/carbon composite coated stainless steel bipolar plates were fabricated by compression molding method after PPS/carbon composite sprayed on the stainless steel plate. PPS and carbon were chosen as the binder and conductive filler of passivation layer, respectively. The interfacial contact resistance and corrosion resistance of PPS/carbon composite coated stainless steel bipolar plates were investigated and compared to the stainless steel. The PPS/carbon composite coated stainless steel compared to stainless steel was improved interfacial contact resistance. The results of the potentiodynamic and potentiostatic measurements also showed that the PPS/carbon composite coated stainless steel did not corroded under PEM fuel cell operating conditions.

• Journal of the Korean Chemical Society
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• v.58 no.5
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• pp.437-444
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• 2014

The electrochemical corrosion and passivation of Co-RDE in borate buffer solution was studied by Potentiodynamic and electrochemical impedance spectroscopy. The mechanisms of both the active dissolution and passivation of cobalt and the hydrogen evolution in reduction reaction were hypothetically established while utilizing the Tafel slope, the rotation speed of Co-RDE, impedance data and the pH dependence of corrosion potential. Based on the EIS data, an equivalent circuit was suggested. In addition, the electrochemical parameters for specific anodic dissolution regions were carefully measured. An induction loop in Nyquist plot measured at the open-circuit potential was observed in the low frequency, and this could be attributed to the adsorption-desorption behavior in the corrosion process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.05a
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• pp.142-145
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• 2004

In this work, we have investigated the application of rapid thermal processing (RTP) and plasma enhanced chemical vapour deposition (PECVD) for surface passivation. Rapid thermal oxidation (RTO) has sufficiently low surface recombination velocities (SRV) $S_{eff}$ in spite of a thin oxides and short process time. The effective lifetime is increasing with an increase of the oxide thickness. In the same oxide thickness, The effective lifetime is independent on the process temperature and time. $S_{eff,max}$ is exponentially decreased with increasing oxide thickness. $S_{eff,max}$ can be reduced to 200 cm/s with only 10 nm oxide thickness. On the other hand, three different types of SiN are reviewed. SiN1 layer has a thickness of about 72 nm and a refractive index of 2.8. Also, The SiN1 has a high passivation quality. The effective lifetime and SRV of 1 $\Omega$ cm Float zone (FZ) silicon deposited with SiN1 is about 800 s and under 10 cm/s, respectively. The SiN2 is optimized for the use as an antireflection layer since a refractive index of 2.3. The SiN3 is almost amorphous silicon caused by less contents of N2 from total process. The effective lifetime on the FZ 1 ${\Omega}cm$ is over 1000 ${\mu}s$.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.75-80
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• 2012

$InSb$ films were fabricated by DC magnetron sputtering and the effects of deposition temperature, heat treatment, passivation from evaporation and multi-layered structure were investigated. Electron mobility and electron concentration were linearly increased with deposition temperature for as-deposited specimens. It was found that the mobilities depend on the grain size rather than the stoichiometry for the samples with very low mobilities. The mobilities largely increased for the specimens with evaporation passivation compared with those without passivation layer. The mobility also increased with the amount of indium deposition in the multi-layer structured $InSb$ films. It was found that the mobility increments in both cases are due to the matching of the stoichiometry in $InSb$ films. For the heat treated and passivated specimens, the mobilities increased with annealing time and the maximum mobility was measured as 1612 $cm^2$/Vs.

• Journal of the Korean Applied Science and Technology
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• v.32 no.1
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• pp.40-47
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• 2015

Single-walled carbon nanotubes (SWNTs) was modified with various length of linear alkyl chains and passivated to form dielectric filler. The modified SWNTs embedded into epoxy matrix to fabricate a flexible composite with high dielectric constant. The dielectric behavior of the composite was significantly changed with various alkyl chain length(n) of pyrene. The dielectric constant of the epoxy/SWNTs composite significantly increased with respect to increase in length of alkyl chain at the frequency range from 10 to 105Hz (n=12and18).We also found that the passivated epoxy/SWNTs composite with high dielectric constant presented low dielectric loss. The resulted dielectric performances corresponded to de-bundling of nanotubes and their distribution behavior in the matrix in terms of tail length of alkyl pyrene in the passivation layer.

• Corrosion Science and Technology
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• v.17 no.4
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• pp.154-165
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• 2018

During the process of sulfur dioxide removal, flue gas desulfurization equipment provides a serious internal corrosion environment in creating sulfuric acid dew point corrosion. Therefore, the utilities must use the excellent corrosion resistance of steel desulfurization facilities in the atmosphere. Until now, the trend in developing anti-sulfuric acid steels was essentially the addition of Cu, in order to improve the corrosion resistance. The experimental alloy used in this study is Fe-0.03C-1.0Mn-0.3Si-0.15Ni-0.31Cu alloys to which Ru, Zn and Ta were added. In order to investigate the effect of $H_2SO_4$ concentration and the alloying elements, chemical and electrochemical corrosion tests were performed. In a low concentration of $H_2SO_4$ solution, the major factor affecting the corrosion rate of low alloy steels was the exchange current density for $H^+/H_2$ reaction, while in a high concentration of $H_2SO_4$ solution, the major factors were the thin and dense passive film and resulting passivation behavior. The alloying elements reducing the exchange current density in low concentration of $H_2SO_4$, and the alloying elements decreasing the passive current density in high concentration of $H_2SO_4$, together play an important role in determining the corrosion rate of Cu-bearing low alloy steels in a wide range of $H_2SO_4$ solution.