• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.12
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• pp.750-758
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• 2016

For the channel doping of shallow junction and retrograde well formation in CMOS, indium can be implanted in silicon. The retrograde doping profiles can serve the needs of channel engineering in deep MOS devices for punch-through suppression and threshold voltage control. Indium is heavier element than B, $BF_2$ and Ga ions. It also has low coefficient of diffusion at high temperatures. Indium ions can be cause the erode of wafer surface during the implantation process due to sputtering. For the ultra shallow junction, indium ions can be implanted for p-doping in silicon. UT-MARLOWE and SRIM as Monte carlo ion-implant models have been developed for indium implantation into single crystal and amorphous silicon, respectively. An analytical tool was used to carry out for the annealing process from the extracted simulation data. For the 1D (one-dimensional) and 2D (two-dimensional) diffused profiles, the analytical model is also developed a simulation program with $C^{{+}{+}}$ code. It is very useful to simulate the indium profiles in implanted and annealed silicon autonomously. The fundamental ion-solid interactions and sputtering effects of ion implantation are discussed and explained using SRIM and T-dyn programs. The exact control of indium doping profiles can be suggested as a future technology for the extreme shallow junction in the fabrication process of integrated circuits.

• Electrical & Electronic Materials
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• v.11 no.11
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• pp.22-27
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• 1998

We have investigated the effect of an ion shower doping of the laser annealed poly-Si films at an elevated substrate temperatures. The substrate temperature was varied from room temperature to 300$^{\circ}C$ when the poly-Si film was doped with phosphorus by a non-mass-separated ion shower. Optical, structural, and electrical characterizations have been performed in order to study the effect of the ion showering doping. The sheet resistance of the doped poly-Si films was decreased from7${\times}$106 $\Omega$/$\square$ to 700 $\Omega$/$\square$ when the substrate temperature was increased from room temperature to 300$^{\circ}C$. This low sheet resistance is due to the fact that the doped film doesn't become amorphous but remains in the polycrystalline phase. The mildly elevated substrate temperature appears to reduce ion damages incurred in poly-Si films during ion-shower doping. Using the ion-shower doping at 250$^{\circ}C$, the field effect mobility of 120 $\textrm{cm}^2$/(v$.$s) has been obtained for the n-channel poly-Si TFTs.

• New & Renewable Energy
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• v.9 no.2
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• pp.23-29
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• 2013

Furnace and laser is currently the most important doping process. However furnace is typically difficult appling for selective emitters. Laser requires an expensive equipment and induces a structural damage due to high temperature using laser. This study has developed a new atmospheric pressure plasma source and research atmospheric pressure plasma doping. Atmospheric pressure plasma source injected Ar gas is applied a low frequency (a few 10 kHz) and discharged the plasma. We used P type silicon wafers of solar cell. We set the doping parameter that plasma treatment time was 6s and 30s, and the current of making the plasma is 70 mA and 120 mA. As result of experiment, prolonged plasma process time and highly plasma current occur deeper doping depth and improve sheet resistance. We investigated doping profile of phosphorus paste by SIMS (Secondary Ion Mass Spectroscopy) and obtained the sheet resistance using generally formula. Additionally, grasped the wafer surface image with SEM (Scanning Electron Microscopy) to investigate surface damage of doped wafer. Therefore we confirm the possibility making the selective emitter of solar cell applied atmospheric pressure plasma doping with phosphorus paste.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.286-289
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• 2000

PHEMT's with three different doping structures, -SH(single-heterojunction), DH (double-heterojunction), and DC(doped-channel)-,were designed, fabricated and characterized to study the effect of doping layer structures on the performance of millimeter-wave PHEMT's. 0.25${\mu}{\textrm}{m}$ DH-PHEMT with below-channel doping of 1$\times$10$^{12}$ c $m^{-2}$ was superior to SH-PHEMT by 40％ in $I_{dss}$, 20％ in f/sib T/ and showed broador gm- $I_{D}$ characteristics which is advantageous to power applications DH-PHEMT showed similar DC and small-signal performance compared with DC-PHEMT. Taking the much higher carrier mobility into considerations, DH-PHEMT is believed to be the best candidate for millimeter-wave, low-noise and/or power applications.s.s.

• Electrical & Electronic Materials
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• v.9 no.2
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• pp.165-173
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• 1996

We prepared polythiophene and poly(3-methylthiophene) films, known as conducting polymer, by electrochemical method. Polythiophene and poly(3-methylthiophene) films were doped and undoped dopant for the studing the understanding of doping mechanism and possible application to the color change switch. We observed that the anodic, cathodic wave and absorption spectra were slightly changed during doping and undoping process in polythiophene. It shows that doping and undoping process were showed some difference by the appearance and disappearance of polaron and bi-polaron. In the relation of the peak of oxidative current density and potential sweep rate of cyclic voltammograms, the amount of dopant in polythiophene film was homogeneously increased at low scan rate. This also can be applied to the poly(3-methlythiophene).

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1411-1414
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• 2007

We have developed a top-emitting white organic electroluminescent device (TWOLED) incorporating a low-reflectivity molybdenum (Mo) anode and doped transport layers as well as a dual-layer architecture of doped blue and yellow emitters with the same blue host. The EL efficiency and operational lifetime of TWOLED can be enhanced by a factor of 1.2 and 3.4 than that of standard TWOLED, respectively, with a co-doping technology in yellow emitter by doping another blue dopant. The enhancement in device performances can be attributed to improve the energy transfer efficiency from blue host to yellow dopant through a blue dopant as medium in yellow emitter.

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05a
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• pp.17-17
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• 1992

The ceramic high transition temperature superconducting materials present many interesting characteristics that will be analysed from two points of view: physical behavior, and chemical aspects. From the first point of view, these materials display an enormous variety of different physical properties. At low doping levels the normal state shows antiferromagnetism and insulating behavior. At intermediate doping levels, an anomalous metallic state appears and, the optimum Tc in the superconducting state is generated. With increasing doping a normal metallic state develops and superconductivity starts to disappear. Many of the physical phenomena that describe the overall behavior when doping levels are changed will be discussed. From the poing of view of the chemical aspects. we well discuss some of the problems involved in the methods of preparation with particular emphasis on defects, crystal structures, critical currrents, and applications in technology.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.5
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• pp.695-701
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• 2016

Be-doped GaSb layers were grown on highly mismatched semi-insulating GaAs substrate (001) with $2^{\circ}$ offcut towards <110> at low growth temperature, by molecular beam epitaxy (MBE). The influence of Be doping on the crystallographic quality, surface morphology, and electrical properties, was assessed by X-ray diffraction, Nomarski microscopy, and Hall effect measurements, respectively. Be impurities are well behaved acceptors with hole concentrations as high as $9{\times}10^{17}cm^{-3}$. In addition, the reduction of GaSb lattice parameter with Be doping was studied.

• Journal of Information Display
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• v.5 no.1
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• pp.1-6
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• 2004

Ion shower doping with a main ion source of $P_2H_x$ using a source gas mixture of $PH_3/H_2$ was conducted on excimer-laser- annealed (ELA) poly-Si. The crystallinity of the as-implanted samples was measured using a UV-transmittance. The measured value of as-implanted damage was found to correlate well with the one calculated through/obtained from TRIM-code simulation. The sheet resistance was found to decrease as the acceleration voltage increased from 1 kV to 15 kV at a doping time of 1 min. However, it increases as the acceleration voltage increases under severe doping conditions. Uncured damage after furnace annealing is responsible for the rise in sheet resistance.

• Macromolecular Research
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• v.17 no.9
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• pp.631-637
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• 2009

This study examined the unique self-doping behavior of carboxylated polyaniline (PCA). The self-doped PCA was synthesized using an environmentally benign enzymatic polymerization method with cationic surfactants. XPS showed that HCl-doped PCA contained approximately 34% of protonated amines but self-doped PCA contained 9.6% of the doped form of nitrogen at pH 4. FTIR and elemental analysis showed that although the PCA was doped with the proton of strong acids at low pH via the protonation of amines, the self-doping mechanism of PCA at pH > 4 was mainly due to hydrogen bonding between the carboxylic acid group and amine group.