• Title/Summary/Keyword: low conductivity

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Thermoelectric Properties of Half-Heusler TiCoSb Synthesized by Mechanical Alloying Process

  • Ur, Soon-Chul
    • Korean Journal of Materials Research
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    • v.21 no.10
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    • pp.542-545
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    • 2011
  • Half-Heusler alloys are a potential thermoelectric material for use in high-temperature applications. In an attempt to produce half-Heusler thermoelectric materials with fine microstructures, TiCoSb was synthesized by the mechanical alloying of stoichiometric elemental powder compositions and then consolidated by vacuum hot pressing. The phase transformations during the mechanical alloying and hot consolidation process were investigated using XRD and SEM. A single-phase, half- Heusler allow was successfully produced by the mechanical alloying process, but a minor portion of the second phase of the CoSb formation was observed after the vacuum hot pressing. The thermoelectric properties as a function of the temperature were evaluated for the hot-pressed specimens. The Seebeck coefficients in the test range showed negative values, representing n-type conductivity, and the absolute value was found to be relatively low due to the existence of the second phase. It is shown that the electrical conductivity is relatively high and that the thermal conductivities are compatibly low in MA TiCoSb. The maximum ZT value was found to be relatively low in the test temperature range, possibly due to the lower Seebeck coefficient. The Hall mobility value appeared to be quite low, leading to the lower value of Seebeck coefficient. Thus, it is likely that the single phase produced by mechanical alloying process will show much higher ZT values after an excess Ti addition. It is also believed that further property enhancement can be obtained if appropriate dopants are selectively introduced into this MA TiCoSb System.

Studies on Insulation Effect Related with Thin-Plate Design Factors for Reflective Metal Insulation(RMI) of Nuclear Power Plant (금속단열재 박판의 설계인자별 단열성능 영향 연구)

  • Eo, Minhun;Lee, Sungmyung;Jang, Kyehwan
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.28 no.9
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    • pp.350-354
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    • 2016
  • Although fibrous insulations are generally used with resistive insulation type, metallic insulation is proper matter to satisfy low head-loss and equipment life when considering the specific condition, especially for Nuclear power plant. Common insulation is resistance insulation with a low thermal conductivity. but RMI is made of sheet plate with low emissivity and closed air space. Thermal radiation is blocked by stainless steel with low emissivity. Thermal conductivity and thermal convection are blocked by closed air space. This study shows the changes and effects of the heat loss according to shape and method of stacking sheet plates inserted into the insulation and analyzed the most optimized way for thermal insulation performance. The result shows that using sheet plate structure through raised and protruding shape processing was the appropriate model to optimize thermal performance. Additionally, insulating performance of RMI improved by placing the sheet plate in a high temperature region intensively.

Analysis of Low-Frequency Magnetic SE of a Metal Plate: Diffusion and Slot Effects (도체 판의 자기장 차폐효과 분석: 확산과 슬롯 효과)

  • Park, Hyun Ho;Kwon, Jong Hwa
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.30 no.4
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    • pp.324-327
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    • 2019
  • This study analyzes the low-frequency magnetic shielding effectiveness (SE) of a metal plate, in terms of diffusion and slot effects, by conducting a numerical simulation and implementing an analytical solution. When the metal has a low conductivity, the SE is dominated by the diffusion effect. However, when the conductivity and frequency both increase, the slot has a major influence on the SE. These results can be used as guidelines in the shielding design and SE requirements of electromagnetic pulse protection facilities.

Characteristics on Sandwich Panel Welding of a Ni Thin Plate and Porous Ni Thin Plate (니켈박판과 다공질니켈박판의 샌드위치 판넬 용접 특성)

  • Hwang, Chan-Youn;Yang, Yun-Seok;Yoo, Young-Tae
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.21 no.4
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    • pp.547-555
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    • 2012
  • This paper focuses on the research of the anode and cathode in the Ni-MH secondary battery. In this paper, the proposed method employs a continuous wave Nd : YAG laser based on the pure Ni instead of the low carbon steel to improve the conductivity although the conventional secondary battery is based on the resistance spot welded with low carbon steel SS41. It welds a sandwich panel using the pure Ni and the porous thin plate, and the tested optimal conditions for the laser power and irradiation speed were 300 and 350 Watt, and 1.0~1.6m/min, respectively. Finally, we observed a ratio, heat input and cross-section and measured the conductivity of the welding section to test the weldability.

Hydrogen Supplying System using Metal Hydride (금속 수소화물을 이용한 수소공급시스템)

  • Bae, Sang-Chul;Katsuta, Masafumi
    • 한국신재생에너지학회:학술대회논문집
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    • 2007.06a
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    • pp.13-19
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    • 2007
  • To find out the optimum design of hydrogen storage and supply tank using Metal Hydride (briefly MH) and to make clear the performance characteristics under various conditions are our research purpose. In order to use the low-temperature exhaust heat, $LaNi_{4.7}Al_{0.3}$ which operates under the low pressure of 1 MPa is chosen, and we measure the basic properties, namely density, specific heat, PCT(Pressure-Concentration-Temperature) characteristics, and effective thermal conductivity. Then, a numerical calculation model of hydrogen storage using MH alloy is suggested and this thermal diffusion equation of model is solved by the backward difference method. This calculation results are compared with the experimental results of the systems which installed 1kg MH alloy and, it is found out that our calculation model can well predict the experimental results. By the experimental using MH alloy, it is recognized that the hydrogen flow rate can control by the step adjustment of brine temperature.

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Low Temperature Debinding Process Using Oxygen Plasma for Flexible Printed Electronics

  • Lee, Young-In
    • Journal of Powder Materials
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    • v.19 no.5
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    • pp.343-347
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    • 2012
  • In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.

Electrical Properties and Structures of Spinel Type LiMn$_{2-y}$M$_y$O$_4$(M=Cr$^{3+}$) Doped with Transition Metal (전이금속으로 치환된 Spinel형 LiMn$_{2-y}$M$_y$O$_4$(M=Cr$^{3+}$)의 구조 및 전기적 성질)

  • 형경우;김중헌;권태윤
    • Journal of the Korean Ceramic Society
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    • v.36 no.9
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    • pp.930-936
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    • 1999
  • For LiMn2O4 based spinel structures the stoichiometric reaction conditions need be considered carefully because the electrical properties depend on the structural stability. In order to obtain the homogeneous compound the Pechini process was chosen which could obtain a stoichiometry phase even low temperature and dependency of the synthetic condition on structural stability and electrochemical performance was investigated. X-ray diffraction studies showed that the compounds doped with transition metal have smaller lattice constants than those un doped. The dc conductivity was evaluated by a four probe method in the low and high temperature region respectively. The variations of basal spacings for the cathode were detected to be dependent on the extent of current flows (under dc)

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A Study on Urethane-Based Gel Polymer Electrolyte for Lithium ion Battery (리튬이온전지용 Urethane기 겔폴리머전해질에 관한 연구)

  • 김현수;김성일;최관영;문성인;김상필
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.15 no.12
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    • pp.1033-1038
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    • 2002
  • In this study, urethane acrylate macromer was synthesized and it was used in a gel polymer electrolyte (GPE), and then its electrochemical performances were evaluated. LiCoO$_2$/GPE/graphite cells were Prepared and their performances depending on discharge currents and temperatures were evaluated. The precursor consisting of urethane acrylate (UA), hexanediol dimethacrylate (HDDA) and benzoyl peroxide (BPO) had a low viscosity relatively ionic conductivity of the gel polymer electrolyte with UA at room temperature and -20$\^{C}$ was ca. 4.5 $\times$ 10$\^$-3/S$.$cm$\^$-1/ and 1.7 x 10$\^$-3/ S$.$cm$\^$-1/, respectively GPR was stable electrochemically up to potential of 4.i V vs. Li/Li$\^$+/. LiCoO$_2$/GPE/graphite cells showed good a high-rate and a low-temperature performance.

Electrochemical Properties of Lithium-Ion Polymer Battery with PMMA IPN-Based Gel Polymer Electrolyte (PMMA IPN계 겔폴리머전해질을 채용한 리튬이온폴리머전지의 전기화학적 특성)

  • 김현수;신정한;나성환;엄승욱;문성인;김상필
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.11
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    • pp.994-1000
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    • 2003
  • In this study, gel polymer electrolytes (GPE) with semi-interpenerating network of poly (methyl methacrylate) and hexanediol dimethacrylate were synthesized and their electrochemical performances were evaluated. LiCoO$_2$/GPE/graphite cells were prepared and their performances depending on discharge currents and temperatures were evaluated. The precursor containing 5 vol% curable mixture had a low viscosity relatively. GPE showed good electrochemical stability up to potential of 4.8 V vs. Li/Li$\^$+/. Ionic conductivity of the gel polymer electrolyte at room temperature and -20$^{\circ}C$ was ca. 5.9 and 1.4${\times}$10$\^$-3/ Scm$\^$-1/, respectively. LiCoO$_2$/GPE/graphite cells showed good rate capability, low-temperature performance and cycleability.

Thermophysical Properties of Epoxy Molding Compound for Microelectronic Packaging (반도체 패키지 EMC의 열물성 연구)

  • 이상현;도중광;송현훈
    • Journal of the Semiconductor & Display Technology
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    • v.3 no.4
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    • pp.33-37
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    • 2004
  • As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

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