• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.1
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• pp.26-32
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• 2012

In the present study, the stencil printing process using solder paste are numerically analyzed. The key design parameters in the stencil printing process are the printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of printing conditions including the squeegee angle and squeegee pressure are investigated through finite element (FE) analysis. However, the FE analysis for the stencil printing process requires tremendous computational loads and time because this process carries micro-filling through thousands of micro-apertures in stencil. To overcome this difficulty in simulation, the present study proposes a two-step approach to sequentially perform the global domain analysis and the local domain analysis. That is, the pressure development under the squeegee are firstly calculated in the full analysis domain through the global analysis. The filling stage of the solder paste into a micro-aperture is then analyzed in the local analysis domain based on the results of the preceding global analysis.

• 한국전산유체공학회:학술대회논문집
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• 2006.10a
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• pp.74-75
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• 2006

Recently much attention has been drawn to meshfree method since conventional methods such as FDM, FVM and FEM have suffered from difficulty with mesh generation for complex geometry and deformable bodies. In this paper, an upwind point collocation meshfree method developed by the authors is applied to two shock wave diffraction problems. One is the shock diffraction over a 90-degree corner and the other is the single Mach reflection on a ramp. The scheme showed stability and the results showed accuracy.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.3
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• pp.408-414
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• 2012

Screen printing is a printing method that uses a woven mesh to support an ink-blocking stencil by transferring ink or other printable materials in order to form an image onto a substrate. Recently, the screen printing method has applied to micro-electronic packaging by using solder paste as a printable material. For the screen printing of solder paste, metal masks containing a number of micro-holes are used as a stencil material. The metal mask undergoes deformation when it is installed in the screen printing machine, which results in the deformation of micro-holes. In the present study, finite element (FE) analysis was performed to predict the amount of deformation of a metal mask. For an efficient calculation of the micro-holes of the metal mask, the sub-domain analysis method was applied to perform FE analyses connecting the global domain (the metal mask) and the local domain (micro-holes). The FE analyses were then performed to evaluate the effects of slot designs on the deformation characteristics, from which more uniform and adjustable deformation of the metal mask can be obtained.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.3
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• pp.11-16
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• 2006

A new method to fabricate metal electrodes on side wall of the microchannel is presented. Electrical signal can be measured by the metal electrodes on channel side wall when microparticles pass through a polymer microchannel. 3 dimensional metal electrodes on channel side wall could be fabricated by local deposition of metal through a shadowmask and inclined evaporation. The polymer microchannel with side wall electrodes could be precisely aligned onto metal contact patterns on pyrex glass. The impedance measurement test showed possibility of electrical signal measurement using the fabricated device.