• Title/Summary/Keyword: local floating superjunction

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Enhancement of energy efficiency of 3-phase inverter using LFS UMOSFET

  • Cheon, Jin-Hee;Kim, Kwang-Soo
    • Journal of IKEEE
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    • v.24 no.3
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    • pp.677-684
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    • 2020
  • In this paper, the energy efficiency of a 4H-SiC UMOSFET with a local floating superjunction (LFS UMOSFET) was compared with a conventional P-shielding UMOSFET. For analysis, P-shielding UMOSFET and LFS UMOSFET were modeled for energy loss and junction temperature. As a result, LFS UMOSFET showed switching loss reduction of 20.6%. In addition, it was confirmed that LFS UMOSFET is applied to a 3-phase inverter, resulting in 33.2% lower power efficiency and 28.1% lower junction temperature than P-shielding UMOSFET. Electrical characteristics were simulated using Sentaurus TCAD, and the power circuit was simulated with the modelled UMOSFET using PSIM, a power circuit simulator.

Temperature Reliability Analysis based on SiC UMOSFET Structure (SiC UMOSFET 구조에 따른 온도 신뢰성 분석)

  • Lee, Jeongyeon;Kim, Kwang-Soo
    • Journal of IKEEE
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    • v.24 no.1
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    • pp.284-292
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    • 2020
  • SiC-based devices perform well in high-voltage environments of more than 1200V compared to silicon devices, and are particularly stable at very high temperatures. Therefore, 1700V UMOSFET has been actively researched and developed for the use of electric power systems such as electric vehicles and aircrafts. In this paper, we analysed thermal variations of critical variables (breakdown voltage (BV), on-resistance (Ron), threshold voltage (vth), and transconductance (gm)) for the three type 1700V UMOSFETs-Conventional UMOSFET (C-UMOSFET), Source Trench UMOSFET (ST-UMOSFET), and Local Floating Superjunction UMOSFET (LFS-UMOSFET). All three devices showed BV increase, Ron increase, vth decrease, and gm decrease with increasing temperature. However, there are differences in BV, Ron, vth, gm according to the structural differences of the three devices, and the degree and cause of the analysis were compared. All results were simulated using sentaurus TCAD.