• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.184-185
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• 2011

In this study, in order to obtain a high reflectivity for the LED lead frame, tin dip coating and tin plating were conducted respectively, and wettability of LED lead frame with tin solder also was tested by wetting balance tester. A Cu sheet was plated in Cu brighten electroplating bath and followed by immersion in a Sn electro-less plating bath [1]. On the other hand, in the dip coating process, a Cu sheet was dipped into molten tin. In the progress of wetting test, besides wetting balance curve, the maximum measured force($F_m$), the maximum withdrawal force($F_w$) and zero-cross time($t_0$) were obtained in various temperatures. With the maximum withdrawal force, the surface tension was calculated at different temperatures. The Cu sheet plated with bright Cu and Sn show a silver bright property while that of Cu dipped with Sn possessed a high reflectance density of 1.34GAM at $270^{\circ}C$.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.05a
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• pp.574-576
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• 2010

In this paper, we propose a development of high speed inspection system which allows the inspection of width, definition and flaws in lead-frame using CCD camera. This system consists of the parts of lighting, inspection, lighting control, GUI and more and developed techniques used are lighting control, fast inspection algorithm and advanced measurement technique for improvement in resolution. The effectiveness in proposed method is proved by conducting field tests.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.1
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• pp.34-37
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• 2010

0.25 mm thickness super thin surface mounted device LED Lamp is developed with PCB type lead frame in which BT (Bismaleimide Triazine) resin is used. BT resin is removed by a laser beam in order to reduce the thermal resistance below $1\;^{\circ}C/W$ and transfer molding is used with silicone. Compared to conventional 0.4 mm thickness LED lamp, the developed LED lamp can be derived in high current and the luminance of the LED lamp is increased up to 240 mA.

• Korean Journal of Metals and Materials
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• v.50 no.8
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• pp.563-568
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• 2012

The wetting property and reflectivity of Sn-3.5Ag solder which was dip coated on a LED lead frame were investigated. The wettability of molten solder on Cu substrate was evaluated by the wetting balance tester, and surface tension was calculated from maximum withdrawal force and withdrawal time. Temperature of the molten solder in a bath was varied in the range of $250-290^{\circ}C$. With increasing temperature, the surface tension decreased a little. The reflectivity of Sn-3.5Ag coated on a substrate became a little lower than the highest current LED lead frame reflectivity.

• Journal of the Earthquake Engineering Society of Korea
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• v.2 no.1
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• pp.47-62
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• 1998

The laminated elastomeric bearing and the lead-rubber bearing were designed to isolate one bay-two story steel frame which is designed for only gravity load. The seismic performance is evaluated for the designed steel frame before and after application of these seismic isolators between the super structure and the foundation. These isolators can improve the seismic capacity of the steel frame. Especially, by inserting the lead plug into the center of the laminated elastomeric bearing, the initial stiffness of th bearing can be increased, thus rather large lateral displacement can be prevented under the frequent service lateral load. During the strong earthquake, yielding of the lead can increase the capacity of the energy dissipation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.640-644
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• 2000

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, Ag$_3$Sn and Cu$\sub$6/Sn$\sub$5/ phases in the matrix Sn and 1∼2$\mu\textrm{m}$ thick Cu$\sub$6/Sn$\sub$5/ Phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5AAg/A11oy42, only Ag$_3$Sn Phase of low density in the matrix Sn and 0.5∼1.5$\mu\textrm{m}$ thick FeSn$_2$phase at the interface of solder/lead-frame were formed. Comparing to Cu, Alloy42 shear strength of Alloy 42 solder joints was smaller than that of Cu and all declined after aging. After aging at 180$^{\circ}C$ for 1 week, η-Cu$\sub$6/Sn$\sub$5/ layer was formed on Cu lead-frame, while AgSn$_3$ phase in the matrix and thickened FeSn$_2$at the interface were formed on Alloy42 lead-frame.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.19-24
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• 2001

The lead frame, which is principal material used in semiconductor packaging, is required to be microscopic in leads and pitches to cope with miniaturization, thin film, large scale integrated. In addition, it is indispensable to eliminate residual stress and burrs occurring at manufacturing lead frames This thesis applied electrolytic abrasion in order to remove burrs and residual stress created during the stamp process. Electrolytic abrasion removed the burrs on the surface of lead frame. Removal of residual stress highly depends on the types of electrolyte solution. In case of perchloric system, electrolytic abrasion removed 23% of residual stress. Through removal of burrs and reducing residual stress, the reliability of lead frame was substantially improved.

• Earthquakes and Structures
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• v.5 no.1
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• pp.23-48
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• 2013

In this study, the effect of flexibility of superstructures and nonlinear characteristics of LRB (Lead Rubber Bearing) isolator on inelastic response of base isolated structures is investigated. To demonstrate the intensity of damage in superstructures, demand response modification factor without the consideration of damping reduction factor, demand RI, is used and the N2 method is applied to compute this factor. To evaluate the influence of superstructure flexibility on inelastic response of base isolated structures, different steel intermediate moment resisting frames with different heights have been investigated. In lead rubber bearing, the rubber provides flexibility and the lead is the source of damping; variations of aforementioned characteristics are also investigated on inelastic response of superstructures. It is observed that an increase in height of superstructure leads to higher value of demand RI till 4-story frame but afterward this factor remains constant; in other words, an increase in height until 4-story frame causes more damage in the superstructure but after that superstructure's damage is equal to the 4-story frame's. The results demonstrate that the low value of second stiffness (rubber stiffness in LRBs) tends to show a significant decrease in demand RI. Increase in value of characteristic strength (yield strength of the lead in LRBs) leads to decrease in the demand RI.

• Earthquakes and Structures
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• v.23 no.4
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• pp.329-338
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• 2022

This work addresses the optimization controller design problem combining the AI evolution bat (EB) optimization algorithm with a fuzzy controller in the practical application of a reinforced concrete frame structure. This article explores the use of an intelligent EB strategy to reduce the dynamic response of Lead Rubber Bearing (LRB) composite reinforced concrete frame structures. Recently developed control units for plant structures, such as hybrid systems and semi-active systems, have inherently non-linear properties. Therefore, it is necessary to develop non-linear control methods. Based on the relaxation method, the nonlinear structural system can be stabilized by properly adjusting the parameters. Therefore, the behavior of a closed-loop system can be accurately predicted by determining the behavior of a closed-loop system. The performance and durability of the proposed control method are demonstrated by numerical simulations. The simulation results show that the proposed method is a viable and feasible control strategy for seismically tuned composite reinforced concrete frame structures.

• Proceedings of the KIEE Conference
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• 2004.11c
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• pp.135-137
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• 2004

In this study we'll deal with the small-sized metalized film capacitors with large capacity which head have $5mm{\times}5mm{\times}2.5mm$ dimension. The lead wire is used to weld at both sides of capacitors. At that time the position gap between the welding machine and lead wire supplier would cause the welding error. Also, during the tapping processing of metalized film capacitors, the interval error among the capacitors, the length error of lead frame attached at the capacitors, and the straightness distortion of the lead frame could happen. As mentioned, four kinds of error parameters will be measured and analyzed by using the automatic visual inspection system that is implemented with CCD camera, optical parts, background lighting, and image processing algorithms. Finally we are able to achieve success rate above 99% to detect the welding faults of capacitors in the field test.