• 한국재료학회지
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• 제15권9호
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• pp.598-603
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• 2005

To develope new lead-free solders with the melting temperature close to that of Sn-37Pb$(183^{\circ}C)$, Sn-0.7Cu-5Pb-1Ga, Sn-0.7Cu-5Pb-1Ag, Sn-0.7Cu-5Pb-5Bi-1Ag, and Sn-0.7Cu-SBi-1Ag alloys were composed by adding low-netting elements such as Ga, Bi, Pb, and Ag to Sn-0.7Cu. Then the melting temperatures, microstructures, wettability, and adhesion properties of these alloys were evaluated. DSC analysis showed that the melting temperature of Sn-0.7Cu-SPb-1Ga was $211^{\circ}C$, and those of other alloys was in the range of $192\~200^{\circ}C$. Microstructures of these alloys after heat-treatment at $150^{\circ}C$ for 24 hrs were basically composed of coarsely- grown $\beta-Sn$ grains, and $Cu_6Sn_5$ and $Ag_3Sn$ intermetallic precipitates. Sn-0.7Cu-5Pb-1Ga and Sn-0.7Cu-5Pb-5Bi-1Ag showed excellent wettability, while Sn-0.7Cu-5Bi-1Ag and Sn-0.7Cu-5Pb-5Bi-1Ag revealed good adhesion strength with the Cu substrates. Among 4 alloys, Sn-0.7Cu-5Pb-5Bi-1Ag with the lowest melting temperature $(192^{\circ}C)$ and relatively excellent wettability and adhesion strength was suggested to be the best candidate solder to replace Sn-37Pb.

• 한국전기전자재료학회논문지
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• 제32권1호
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• pp.35-39
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• 2019

In this study, we investigated the optimum calcination temperature of lead-free $0.74(Bi_{0.5}Na_{0.5})TiO_3-0.26SrTiO_3$(BNST) piezoelectric ceramics by analyzing the crystal structure, dielectric properties, and electric field-induced strain behavior. BNST ceramics prepared by conventional solid-state reaction methods at various calcination temperatures according to the industrial standard. All samples of BNST ceramics were subsequently sintered at $1,175^{\circ}C$ for 2 h. Crystal structure classification of the ceramics showed a single perovskite phase, with no second phase detectable for the samples calcined at $750^{\circ}C$ or higher. BNST samples calcined at $850^{\circ}C$ exhibited the most optimal values for itsand the common physical parameters of $density=5.518g/cm^3$, ${\varepsilon}=1,871.837$, $tan{\delta}=0.047$, and ${d_{33}}^*=874pm/V$.

• 한국재료학회지
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• 제29권8호
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• pp.469-476
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• 2019

A lead-free bulk ceramic having a chemical formula $Ba_{0.8}Ca_{0.2}(Ti_{0.8}Zr_{0.1}Ce_{0.1})O_3$ (further termed as BCTZCO) is synthesized using mixed oxide route. The structural, dielectric, impedance, and conductivity properties, as well as the modulus of the synthesized sample are discussed in the present work. Analysis of X-ray diffraction data obtained at room temperature reveals the existence of some impurity phases. The natural surface morphology shows close packing of grains with few voids. Attempts have been made to study the (a) effect of microstructures containing grains, grain boundaries, and electrodes on impedance and capacitive characteristics, (b) relationship between properties and crystal structure, and (c) nature of the relaxation mechanism of the prepared samples. The relationship between the structure and physical properties is established. The frequency and temperature dependence of the dielectric properties reveal that this complex system has a high dielectric constant and low tangent loss. An analysis of impedance and related parameters illuminates the contributions of grains. The activation energy is determined for only the high temperature region in the temperature dependent AC conductivity graph. Deviation from the Debye behavior is seen in the Nyquist plot at different temperatures. The relaxation mechanism and the electrical transport properties in the sample are investigated with the help of various spectroscopic (i.e., dielectric, modulus, and impedance) techniques. This lead free sample will serve as a base for device engineering.

• 한국전기전자재료학회논문지
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• 제36권5호
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• pp.505-512
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• 2023

This study investigated crystal structures, microstructures, and electric-field-induced strain (EFIS) properties of Bi-based lead-free ferroelectric/relaxor composites. Bi_1/2Na_0.82K_0.18)_1/2TiO₃ (BNKT) as a ferroelectric material and 0.78Bi_1/2(Na_0.78K_0.22)_1/2TiO₃-0.02LaFeO₃ (BNKT2LF) as a relaxor material were synthesized using a conventional solid-state reaction method, and the resulting BNKT2LF powders were subjected to high-energy ball milling (HEBM) after calcination. As a result, HEBM proved a larger average grain size of sintered samples compared to conventional ball milling (CBM). In addition, the increased sintering time led to grain growth. Furthermore, HEBM treatment and sintering time demonstrated a significant effect on EFIS of BNKT/BNKT2LF composites. At 6 kV/mm, 0.35% of the maximum strain (S_max) was observed in the HEBM sample sintered for 12 h. The unipolar strain curves of CBM samples were almost linear, indicating almost no phase transitions, while HEBM samples displayed phase transitions at 5~6 kV/mm for all sintering time levels, showing the highest S_max/E_max value of 700 pm/V. These results indicated that HEBM treatment with a long sintering time might significantly enhance the electromechanical strain properties of BNT-based ceramics.

• Nuclear Engineering and Technology
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• 제54권12호
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• pp.4708-4714
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• 2022

The novelty in the present search, the Soda-Lime-Silica (SLS) glass waste to prepare free lead glass shielding was used in order to limit the accumulation of glass waste, which requires extensive time to decompose. This also saves on the consumption of pure SiO₂, which is a finite resource. Furthermore, the combining of BaO with Bi₂O₃ into a glass network leads to increased optical properties and improved attenuation. The UV-Visible Spectrophotometer was used to investigate the optical properties and the radiation shielding properties were reported for current glass samples utilizing the PhysX/PDS online software. The optical property results indicate that when BaO content increases in glass structure, the Urbach energy ΔE, and refractive index n increases while the energy optical band gap E_opt decreases. The result of the metallisation criteria (M) revealed that the present glass samples are nonmetallic (insulators). Furthermore, the radiation shielding parameter findings suggest that when BaO was increased in the glass structure, the linear attenuation coefficient and effective atomic number (Z_eff) rose. But the half-value layer HVL declined as the BaO concentration grew. According to the research, the glass samples are non-toxic, transparent to visible light, and efficient radiation shielding materials. The Ba5 sample is considered the best among all the samples due to its higher attenuation value and lower HVL and MFP values, which make it a suitable candidate as transparent glass shield shielding.

• 마이크로전자및패키징학회지
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• 제11권3호
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• pp.1-7
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• 2004

주석 도금은 특정 환경하에서 위스커를 발생시키며, 이는 전자부품의 불량을 초래한다. 최근 세계곳곳에서는 환경보호를 위해 "무연"의 사용을 권고하고 있다. 본 논문에서는 두 종류 무연 도금 재료에서 도금 온도와 신뢰성시험 하에서 성장하는 위스커를 평가하였다. 도금 온도가 높아질수록 표면에 형성되는 도금 입자의 크기는 커지고, 위스커의 성장은 작아진다. 또한 온도 순환시험에서 성장한 위스커는 무광택 Sn 도금은 굽은 모양을, 무광택 Sn-Bi에서는 줄무의 모양이 관찰되었고, Sn 도금에 비해 Sn-Bi에서 위스커가 작게 성장하였다. 무광택 Sn 도금된 FeNi42 리드프레임은 TC 300 사이클에서 직경이 $7.0{\~}10.0{\mu}m$이고, 길이가 $25.0{\~}45.0{\mu}m$인 위스커가 성장하였다. 또한 Cu는 300 사이클에서는 표면에 노듈(핵 상태)만이 관찰되었고, 600 사이클에서 길이가 $3.0{\~}4.0{\mu}m$의 위스커로 성장하였다. TC 600 사이클 후 FeNi42는 계면에서 ${\~}0.34{\mu}m$의 얇은 $Ni_3Sn_4$가, Cu에서는 두께가 $0.76{\~}l.14{\mu}m$인 $Cu_6Sn_5$와 ${\~}0.27{\mu}m$의 $Cu_3Sn$ 화합물들이 두껍게 성장하였다. 따라서 FeNi42 리드프레임은 열팽창계수의 차이, Cu에서는 금속간 화합물의 형성이 위스커의 성장에 영향을 미치는 주요 인자이다.

• 마이크로전자및패키징학회지
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• 제18권2호
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• pp.17-27
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• 2011

본 논문에서는 솔더의 온도 변화에 따른 변형 거동을 평가하기 위하여 솔더 재료의 열변형 거동을 파악할 수 있는 전단시편을 고안하여 온도변화에 따르는 열변형 실험과 유한요소해석을 수행하였다. 전단시편은 열팽창계수가 다른 두 금속 막대와 그 사이 공간에 접합된 솔더로 구성되어 있으며, 솔더는 유연 솔더 (Sn/36Pb/2Ag)와 무연 솔더 (Sn/3.0Ag/0.5Cu) 두가지를 대상으로 하였다. 실시간 무아레 간섭계를 이용하여 세 온도 사이클 동안의 각 온도단계에서 변 위 분포를 나타내는 간섭무늬를 얻고 그로부터 온도에 따른 유연 솔더와 무연 솔더의 열변형 특성을 비교하였다. 유한요소해석을 통하여 여러 연구자가 제시한 솔더의 점소성 물성치를 평가하였으며 유연 솔더의 경우에는 Darveaux가 제안한 Anand 모델, 무연 솔더의 경우 Chang이 제안한 Anand 모델을 사용한 해석 결과가 실험 결과와 가장 일치한다는 것을 밝혔다. 평가된 재료 모델을 사용하여 무연 솔더와 유연 솔더가 포함된 전단시편을 유한요소 해석하고 솔더의 점소성 거동 을 자세하게 분석하였다.

• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.37-44
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• 2013

유연 솔더가 실장된 패키지와 무연 솔더가 실장된 패키지의 온도에 따른 변형 거동은 솔더 자체의 물성치 뿐만 아니라 패키지를 구성하는 재료의 물성치에도 큰 영향을 받는다고 알려져 있다. 본 논문에서는 스트레인 게이지의 온도특성을 이용하여 미지 재료의 열팽창계수를 결정하는 방법을 정립하고, 반도체 패키지 몰딩 화합물의 열팽창계수를 실험적으로 구하였다. 탄소강과 알루미늄 시편을 기준 시편으로 사용하고 스트레인 게이지 측정을 통하여 온도에 따른 유연 솔더용 몰딩 화합물과 무연 솔더용 몰딩 화합물의 열팽창계수를 구하고, 무아레 간섭계를 이용하여 비접촉적으로 열팽창 계수를 측정하여 결과를 비교하였다. 기준 시편에 따른 두 가지 스트레인 게이지 실험 결과와 무아레 실험 결과가 잘 일치하여서 실험방법에 신뢰성이 있는 것을 보였다. 유연 솔더용 몰딩 화합물의 경우에는 열팽창계수가 온도에 관계없이 약 $15.8ppm/^{\circ}C$로 측정되었고, 무연 솔더용의 경우에는 $100^{\circ}C$이하의 온도에서 몰딩 화합물의 열팽창계수는 약 $9.9ppm/^{\circ}C$이었으나 $100^{\circ}C$이상에서는 온도가 증가함에 따라 열팽창계수가 급격하게 증가되어 $130^{\circ}C$에서는 $15.0ppm/^{\circ}C$의 값을 가졌다.

• 한국재료학회지
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• 제12권9호
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• 한국전기전자재료학회논문지
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• 제29권6호
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• pp.342-347
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• 2016

We investigated the effect of $Bi_{1/2}(Na_{0.82}K_{0.18})_{1/2}TiO_3$ (BNKT) modification on the ferroelectric and electric-field-induced strain (EFIS) properties of lead-free $0.97Bi_{1/2}(Na_{0.82}K_{0.18})_{1/2}TiO_3-0.03LaFeO_3$ (BNKTLF) ceramics as a function of BNKT content (x= 0, 0.1, 0.2, 0.3, 0.5, and 1). BNKT-modified BNKTLF powders were synthesized using a conventional solid-state reaction method. As the BNKT content x increased from 0 to 1 the normalized electric-field-induced strain ($S_{max}/E_{max}$) was observed to increase at relatively low fields, i.e., below the poling field. Moreover, BNKTLF-30BNKT showed about 460 pm/V as low as at 3 kV/mm, which is a considerably high value among the lead-free systems reported so far. Consequently, it was confirmed that ceramic-ceramic composite, a mixture of an ergodic relaxor matrix and embedded ferroelectric seeds, is a salient way to make lead-free piezoelectrics practical with enhanced EFIS at low field as well as less hysterical.