• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.829-831
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• 2003

In the present study, the electroless plating method was applied instead of the sputtering as a formation method of metallic bus electrodes. No additional blackening step is needed in this method since this process provides a metallic seed layer with black color by a single step. The parameters which affects color and morphology of the metallic seed layer in the electroless plating solution were investigated

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.7 s.238
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• pp.998-1004
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• 2005

A nano-stereolithography (NSL) process has been developed for fabrication of 3D shell structures which can be applied to various nano/micro-fluidic devices. By the process, a complicated 3D shell structure on a scale of several microns can be fabricated using lamination of layers with a resolution of 150 nm in size, so it does not require the use of my sacrificial layer or any supporting structure. A layer was fabricated by means of solidifying liquid-state monomers using two-photon absorption (TPA) induced using a femtosecond laser processing. When the polymerization process is finished, unsolidified liquid state resins can be removed easily by dropping several droplets of ethanol fur developing the fabricated structure. Through this work, some 3D shell structures, which can be applied to various applications such as nano/micro-fluidic devices and MEMS system, were fabricated using the developed process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.37-40
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• 2001

This paper presents the modeling methodology of Zinc diffusion process applied for high-speed avalanche photodiode fabrication using neural networks. Three process factors (sealing pressure, amount of Zn$_3$P$_2$ source per volume, and doping concentration of diffused layer) are examined by means of D-optimal design experiment. Then, diffusion rate and doping concentration of Zinc in diffused layer are characterized by a static response model generated by training fred-forward error back-propagation neural networks. It is observed that the process models developed here exhibit good agreement with experimental results.

• Journal of the Korean Ceramic Society
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• v.52 no.5
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• pp.315-319
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• 2015

Yttria-stabilized zirconia (YSZ)-based micro tubular SOFC single cells were fabricated by electrophoretic deposition (EPD) process. Stable slurries for the EPD process were prepared by adding phosphate ester (PE) as a dispersant in order to control the pH, conductivity, and zeta-potential. NiO-YSZ anode support, NiO-YSZ anode functional layer (AFL), and YSZ electrolyte were consecutively deposited on a graphite rod using the EPD process; materials were then co-sintered at $1400^{\circ}C$ for 4 h. The thickness of the deposited layer increased with increasing of the applied voltage and the deposition time. A YSZ-based micro tubular single cell fabricated by the EPD process exhibited a maximum power density of $0.3W/cm^2$ at $750^{\circ}C$.

• Progress in Superconductivity and Cryogenics
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• v.8 no.4
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• pp.19-21
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• 2006

Biaxially textured Ni was fabricated by electrodeposition process and delaminated from the biaxially textured cathode surface for further buffer layer deposition process. Those electrode posited Ni substrates showed well-developed biaxial texture and smooth surface. In order to improve the thermal stability of Ni substrates, Mn was alloyed by adding Mn precursor into the electrodeposition bath. Subsequently, $CeO_2$ buffer layers are deposited by MOD process to prevent interfacial reaction between superconductor and substrates. In particular, Bismuth oxide was added to $CeO_2$ to realize lower temperature processing of buffer layers. The microstructure and texture development of each layers have been investigated. Preliminary results shows that all electro/chemical process can be a candidate for cost effective route to YBCO coated conductor.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.8 s.197
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• pp.138-143
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• 2007

Microstereolithography technology is similar to the conventional stereolithography process and enables to fabricate a complex 3D microstructure. This is divided into scanning and projection type according to aiming at precision and fabrication speed. The scanning MSL fabricates each layer using position control of laser spot on the resin surface, whereas the projection MSL fabricates one layer with one exposure using a mask. In the projection MSL, DMD used to generate dynamic pattern consists of $1024{\times}768$ micromirrors which have $13.68{\mu}m$ per side. The fabrication range and resolution are determined by the field of view of the DMD and the magnification of the projection lens. If using the projection lens with high power, very fine microstructures can be fabricated. In this paper, the projection MSL system adapted to a large surface for array-type fabrication is presented. This system covers the meso range, which is defined as the intermediate range between micro and macro, with a resolution of a few ${\mu}m$. The fabrication of array-type microstructures has been demonstrated to verify the performance of implemented system.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.427-427
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• 2016

Organic-inorganic hybrid perovskite have attracted significant attention as a new revolutionary light absorber for photovoltaic device due to its remarkable characteristics such as long charge diffusion lengths (100-1000nm), low recombination rate, and high extinction coefficient. Recently, power conversion efficiency of perovskite solar cell is above 20% that is approached to crystalline silicon solar cells. Planar heterojunction perovskite solar cells have simple device structure and can be fabricated low temperature process due to absence of mesoporous scaffold that should be annealed over 500 oC. However, in the planar structure, controlling perovskite film qualities such as crystallinity and coverage is important for high performances. Those controlling methods in one-step deposition have been reported such as adding additive, solvent-engineering, using anti-solvent, for pin-hole free perovskite layer to reduce shunting paths connecting between electron transport layer and hole transport layer. Here, we studied the effect of alkali metal halide to control the fabrication process of perovskite film. During the morphology determination step, alkali metal halides can affect film morphologies by intercalating with PbI2 layer and reducing $CH3NH3PbI3{\cdot}DMF$ intermediate phase resulting in needle shape morphology. As types of alkali metal ions, the diverse grain sizes of film were observed due to different crystallization rate depending on the size of alkali metal ions. The pin-hole free perovskite film was obtained with this method, and the resulting perovskite solar cells showed higher performance as > 10% of power conversion efficiency in large size perovskite solar cell as $5{\times}5cm$. X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), and inductively coupled plasma optical emission spectrometry (ICP-OES) are analyzed to prove the mechanism of perovskite film formation with alkali metal halides.

• 한국신재생에너지학회:학술대회논문집
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• 2008.05a
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• pp.441-443
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• 2008

A non-vacuum process for fabrication of $CuInSe_2$ (CIS) absorber layer from the corresponding Cu, In solution precursors was described. Cu, In solution precursors was prepared by a room temperature colloidal route by reacting the starting materials $Cu(NO_3)_2$, $InCl_3$ and methanol. The Cu, In solution precursors were mixed with ethylcellulose as organic binder material for the rheology of the mixture to be adjusted for the doctor blade method. After depositing the mixture of Cu, In solution with binder on Mo/glass substrate, the samples were preheated on the hot plate in air to evaporate remaining solvents and to burn the organic binder material. Subsequently, the resultant CI/Mo/glass sample was selenized in Se evaporation in order to get a solar cell applicable dense CIS absorber layer. The CIS absorber layer selenized at $530^{\circ}C$ substrate temperature for 30 min with various Se gas evaporation temperature was characterized by XRD, SEM, EDS.

• Korean Journal of Metals and Materials
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• v.46 no.5
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• pp.321-327
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• 2008

Cu based amorphous ($Cu_{54}Zr_{22}Ti_{18}Ni_6$) coating was produced by cold spraying as a new fabrication process. The microstructure and macroscopic properties of amorphous coating layer was investigated and compared with those of cold sprayed pure Cu coating. Amorphous powders were prepared by gas atomization and Al 6061 was used as the substrate plate. X-ray diffraction results showed that Cu based amorphous powder could be successfully deposited by cold spraying without any crystallization. The Cu based amorphous coating layer ($300{\sim}400{\mu}m$ thickness) contained 4.87% porosity. The hardness of Cu based amorphous coating represented $412.8H_v$, which was correspond to 68% of the hardness of injection casted bulk amorphous material. The wear resistance of Cu based amorphous coating was found to be three times higher than that of pure Cu coating. The 3-point bending test results showed that the adhesion strength of Cu based amorphous coating layer was higher than that pure Cu coating. It was also observed that hard Cu base amorphous particle could easily deform soft substrate by particle collisions and thus generated strong adhesion between coating and substrate. However, the amorphous coating layer unexpectedly represented lower corrosion resistance than pure Cu coating, which might be resulted from the higher content of porosity in the cold sprayed amorphous coating.

• Progress in Superconductivity and Cryogenics
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• v.11 no.1
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• pp.1-4
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• 2009

Mechanical and electrical properties of silver stabilizer layer of coated conductor, which as prepared with nano silver paste as starting materials, have been investigated, Nano silver paste was coated on a YBCO film by dip coating process at a diping speed of 20m/min. Coated film was dried in air and heat treated at $400{\sim}700^{\circ}C$ in an oxygen atmosphere. Adhesion strength between YBCO and silver layer was measured by a tape est(ASTM D 3359). Hardness and electrical conductivity of the samples were measured by pencil hardness test (ASTM D 3363) and volume resistance test by LORESTA-GP (MITSHUBISHD, respectively. The sample heat-treated at $500^{\circ}C$ showed poor adhesion 1B, but samples heat treated at higher than $600^{\circ}C$ showed enhanced adhesion of 5B. The silver layer heat-treated at $700^{\circ}C$ showed the high hardness value larger than 9 H, low volume resistance, surface resistance value as well as superior current carrying capacity compared to sputtered silver. SEM observations showed that a dense silver layer was formed with a thickness of about $2{\mu}m$. Dip coated silver layer prepared by using nano silver paste showed superior electrical and mechanical characteristics.