한국정보디스플레이학회:학술대회논문집
- 2003.07a
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- Pages.829-831
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- 2003
Application of the electroless plating method to the fabrication of metallic bus electrodes of PDP
- Oh, Young-Joo (Metal Processing Research Center, Korea Institute of Science and Technology) ;
- Jeung, Won-Young (Metal Processing Research Center, Korea Institute of Science and Technology)
- Published : 2003.07.09
Abstract
In the present study, the electroless plating method was applied instead of the sputtering as a formation method of metallic bus electrodes. No additional blackening step is needed in this method since this process provides a metallic seed layer with black color by a single step. The parameters which affects color and morphology of the metallic seed layer in the electroless plating solution were investigated
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