• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.138-139
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• 2013

본 연구는 ZnO-TFT 소자에 Hf의 첨가에 따른 소자 특성 및 게이트 바이어스 스트레스에 대한 특성에 대해 분석을 하였다. Hf-Zn-O 박막은 Hf의 조성이 증가함에 따라 작아지는 grain size로 인해 TFT 소자의 전계효과 이동도와 게이트 바이어스 스트레스에서의 문턱전압의 변화가 더 커지는 것을 확인하였다. 한편, Hf이 14at% 함유된 HZO-TFT에서는 이동도는 현저히 저하되었지만, 게이트 바이어스 스트레스에서의 문턱전압의 변화가 현저히 개선되는 것을 확인하였는데, 이는 Hf의 조성이 증가함에 따라 비정질화 되어 grain boundaries에 의한 trap의 영향이 줄어든 결과를 확인하였다. 또한, 전계효과 이동도와 소자의 안정성을 확보하기 위해, poly-ZnO와 amorphous-HZO로 구성된 다중층 채널 구조를 이용한 TFT소자에서는 전계효과 이동도과 소자의 안정성이 개선된 결과를 보였다. 이는 채널과 게이트 산화물의 interface charge trap의 감소와 back-channel effect가 감소한 결과임을 확인하였다.

• Transactions on Electrical and Electronic Materials
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• v.10 no.6
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• pp.200-202
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• 2009

Tin oxide thin films were prepared by atomic layer deposition using a tetrakis(ethylmethylamino) tin precursor without any seed layer. The average growth rate of tin oxide film is about 1.2 A/cycle from $50{^{\circ}C}$ to $150{^{\circ}C}$. The rate decreases rapidly at a substrate temperature of $200{^{\circ}C}$. ALD-grown tin oxide thin film was characterized with the use of XRD, AFM and XPS. Due to a thermal annealing effect, the surface roughness and the tin amount in the film composition are slightly increased.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.2
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• pp.163-169
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• 2000

In this paper, we showed the erosion characteristic of MgO protector layer releated to lifetime of plasma display panel(PDP). We observed MgO erosion characteristic as a functions of deposition conditions, pressure and distance between electrodes. In RIE condition of Xe gas, the lowest erosion rate appears in the conditions of no heating bias voltage -30V and pressure 5mtorr. In general, as deposition rate increases, erosion rate decreases. In real panel, when the gap distance between electrodes is narrow and the pressure is low, the heavy plasma damage appears. Also, the surfaces between electrodes and on the bus electrode are extremely damaged.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.5
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• pp.376-382
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• 2000

We successfully fabricated OLED(Organic Light Emitting Diodes) with Al cathodes electrode deposited by the DC magnetron sputtering. The effects of a controlled Al cathode layer of an Indium Tin Oxide (ITO)/blended single polymer layer (PVK Bu:PBD:dye)/Al light emitting diodes are described. The PVK (Poly(N-vinylcarbazole)) and Bu-PBD (2-(4-biphenyl-phenyl)-1,3,4-oxadiazole) are used hole transport polymer and electron transport molecule respectively. We found that both current injection and electroluminescence output are significantly different with a variable DC sputtering power. The difference is believed to be due to the influence near the blended polymer layer/cathode interface that results from the DC power and H$\sub$2//O in a chamber. And DC sputtering deposition is an effective way to fabricate Al electrodes with pronounced orientational characteristics without damage occurring to metal-organic interface during the sputtering deposition.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.249-249
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• 2010

The effect of forming a passivation layer was investigated in superconformal Cu gap-filling of the nano-scale trench with atomic-layer deposited (ALD)-Ru glue layer. It was discovered that the nucleation and growth of Cu during metal-organic chemical vapor deposition (MOCVD) were affected by hydrogen plasma treatments. Specifically, as the plasma pretreatment time increased, Cu nucleation was suppressed proportionally. XPS and Thermal Desorption Spectroscopy indicated that hydrogen atoms passivate the Ru surface, which leads to suppression of Cu nucleation owing to prevention of adsorption of Cu precursor molecules. For gap-fill property, sub 60-nm ALD Ru trenches without the plasma pretreatment was blocked by overgrown Cu after the Cu deposition. With the plasma pretreatment, superconformal gap filling of the nano-scale trenches was achieved due to the suppression of Cu nucleation near the entrances of the trenches. Even the plasma pretreatment with bottom bias leads to the superconformal gap-filling.

• Journal of Surface Science and Engineering
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• v.27 no.5
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• pp.303-311
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• 1994

In this study, the factors, such as coating temperature T(K), reaction time t(sec) and mobile carbon content $C^*$ (wt%) of steels affecting, the growth rate of carbide layer were investigated in the reactive deposition and diffusion coating using the fluidized bed. From the results, the coating thickness d(cm) can be expressed by an equation. d=$C^*$$(KT)^{1/2}$, where K=K$\circ$exp(~Q/RT), KTEX>$\circ$ = 1.4$\times$$10^{-2}cm^{-2}$/sec, and Q=46Kcal/ mol. It was in a good aggrement with the experimental results, reguardless of the diffusion coating method and the carbide layer. Therefore, if the mobile carbon content of carbon steels and alloyed steels is known, the thickness under coating conditions can be predicted from the previous equation.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.78-82
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• 2005

펄스 플라즈마 원자층 증착 방법 (PPALD : Pulse Plasma Atomic Layer Deposition)을 이용하여 삼원계 박막인 W-C-N 박막을 ILD layer인 TEOS 위에 제조하였다. 실험은 $WF_6,\;N_2.\;CH_4$ 가스의 순차적 주입과 $N_2$를 이용한 퍼징으로 이루어지며 $N_2$와 $CH_4$ 가스 주입 시에 pulse plasma가 적용되었다. 일반적인 ALD 증착 기구를 그대로 따르는 PPALD 방법에 의해 제조된 W-C-N 박막은 $H_2/N_2$ 플라즈마 초기 표면 처리에 의해 incubation cycles 없이 초기 cycles부터 0.2 nm/cycle의 일정한 증착율을 가지고 증착되므로 정확한 두께의 control이 가능하며 $300\;{\mu}{\Omega}-cm$의 매우 낮은 비저항 특성을 나타내었다.

• Annual Conference of KIPS
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• 2024.05a
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• pp.25-26
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• 2024

본 연구에서는 ALD(Atomic Layer Deposition) 기술을 사용하여 고품질의 단일 박막을 형성하고, 이를 이용해 비휘발성 메모리 소자를 제작하며 그 특성을 분석한다. ALD 과정에서 단원자층을 차례로 증착하는 방식을 사용하여, 산화알루미늄 및 하프늄 옥사이드를 포함한 여러 층을 성공적으로 증착하였다. 이를 통해 높은 품질과 신뢰성을 가진 박막을 얻을 수 있었으며, 최종적으로 제작된 메모리 소자의 특성을 CV 곡선 분석을 통해 평가한다.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.17-22
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• 2009

Two different organic-inorganic hybrid thin film transistors (OITFTs) with the structures of glass/ITO/ZnO/PMMA/Al (staggered structure) and glass/ITO/PMMA/ZnO/Al (inverted staggered structure), were fabricated and their electrical and structural properties were compared. The ZnO thin films used as active channel layers were deposited by the atomic layer deposition (ALD) method at a temperature of $100^{\circ}C$. To investigate the effect of the substrates on their properties, the ZnO films were deposited on bare glass, PMMA/glass and ITO/glass substrates and their crystal properties and surface morphologies were analyzed. The structural properties of the ZnO films varied with the substrate conditions. The ZnO film deposited on the ITO/glass substrate showed better crystallinity and morphologies, such as a higher preferred c-axis orientation, lower FWHM value and larger particle size compared with the one deposited on the PMMA/glass substrate. The field effect mobility ($\mu$), threshold voltage ($V_T$) and $I_{on/off}$ switching ratio for the OITFT with the staggered structure were about $0.61\;cm^2/V{\cdot}s$, 5.5 V and $10^2$, whereas those of the OITFT with the inverted staggered structure were found to be $0.31\;cm^2/V{\cdot}s$, 6.8 V and 10, respectively. The improved electrical properties for the staggered OITFTs may originate from the improved crystal properties and larger particle size of the ZnO active layer.

• Korean Journal of Materials Research
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• v.27 no.7
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• pp.392-397
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• 2017

Fluorine-doped tin oxide (FTO) coated NiCrAl alloy foam is fabricated using ultrasonic spray pyrolysis deposition (USPD). To confirm the influence of the FTO layer on the NiCrAl alloy foam, we investigated the structural, chemical, and morphological properties and chemical resistance by using USPD to adjust the FTO coating time (12, 18, and 24 min). As a result, when an FTO layer was coated for 24 min on NiCrAl alloy foam, it was found to have an enhanced chemical resistance compared to those of the other samples. This improvement in the chemical resistance of using USPD NiAlCr alloy foam can be the result of the existence of an FTO layer, which can act as a protection layer between the NiAlCr alloy foam and the electrolyte and also the result of the increased thickness of the FTO layer, which enhances the diffusion length of the metal ion.