• Journal of the Korean Ceramic Society
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• v.44 no.10
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• pp.580-584
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• 2007

The ZrC layer instead of SiC layer is a critical and essential layer in TRISO coated fuel particles since it is a protective layer against diffusion of fission products and provides mechanical strength for the fuel particle. In this study, we carried out computational simulation before actual experiment. With these simulation results, Zirconium carbide (ZrC) films were chemically vapor deposited on $ZrO_2$ substrate using zirconium tetrachloride $(ZrCl_4),\;CH_4$ as a source and $H_2$ dilution gas, respectively. The change of input gas ratio was correlated with growth rate and morphology of deposited ZrC films. The growth rate of ZrC films increased as the input gas ratio decreased. The microstructure of ZrC films was changed with input gas ratio; small granular type grain structure was exhibited at the low input gas ratio. Angular type structure of increased grain size was observed at the high input gas ratio.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.138-138
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• 2008

Ti capping layer를 이용하여 NiGe의 열적 안정성을 향상시키는 연구를 수행하였다. N-type Ge(100) 기판에 30nm 두께의 Ni과 30nm 두께의 Ti capping layer를 E-beam evaporator를 이용하여 증착하고 $300^{\circ}C$에서 $700^{\circ}C$ 까지 30초간 $N_2$ 분위기에서 급속 열처리하여 Ni-Germanide를 형성하였다. XRD의 결과로부터 Ti capping layer 유무에 상관없이, 전 온도 범위에 걸쳐 NiGe 상이 형성된 것을 관찰할 수 있었다. 급속 열처리 온도에 따른 면저항 값을 측정한 경우, $300^{\circ}C$에서 $600^{\circ}C$까지의 열처리 온도 범위에서는 모든 시편들이 비슷한 면저항 값을 보인 반면, 열처리 온도가 $700^{\circ}C$ 이상에서는 Ti capping layer가 있는 시편이 Ti capping layer가 없는 시편보다 낮은 면저항 값을 갖는 것을 확인할 수 있었다. 이는 고온 열처리 시 Ti capping layer에 있는 Ti가 기판 방향으로 확산하여 NiGe grain boundary에 segregation 되고 그로 인하여 NiGe의 grain boundary 움직임을 억제하여 agglomeration 현상을 효과적으로 방지하였기 때문에 나타난 현상으로 사료된다.

• Journal of the Korean Society for Heat Treatment
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• v.1 no.1
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• pp.8-12
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• 1988

This study has been carried out to evaluate gaseous nitrocarburizing treatment undertaken for pure iron at $570^{\circ}C$ in an atmosphere containing 50% endothermic gas, generated from natural gas, and 50% ammonia. The results obtained from the experiment are as follows ; 1) The microstructure of gaseous nitrocarburized pure iron consists of the compound layer on the surface and the diffusion zone beneath it. The compound layer progresses uniformly into ferrite with a thickness of $20{\mu}$ obtained after treating for 3 hours. 2) Chemical analysis has shown that the compound layer has a C/N ratio of 0.19 and that the average combined interstitial content of the compound layer is about 30 atomic percent, which is close to the lower limit of the ${\varepsilon}$-carbonitride phase field in Fe-C-N phase diagram. 3) X-ray diffraction analysis has revealed that the compound layer consists mainly of the c.p.h. phase, ${\varepsilon}-Fe_3$(C.N) and a small amount of $Fe_4N$ and traces of ferrite are also present in the compound layer. 4) The microhardness of the compound layer is about 600 V.H.N and shows a relatively sharp fall-off at the compound layer/diffusion zome interface. 5) The average actual degree of ammonia dissociation is calculated to be 27% for a gaseous nitrocarburizing treatment carried out at $570^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.284-284
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• 2011

Recently, the increasing degree of device integration in the fabrication of Si semiconductor devices, etching processes of nano-scale materials and high aspect-ratio (HAR) structures become more important. Due to this reason, etch selectivity control during etching of HAR contact holes and trenches is very important. In this study, The etch selectivity and etch rate of TEOS oxide layer using ACL (amorphous carbon layer) mask are investigated various process parameters in CH2F2/C4F8/O2/Ar plasma during etching TEOS oxide layer using ArF/BARC/SiOx/ACL multilevel resist (MLR) structures. The deformation and etch characteristics of TEOS oxide layer using ACL hard mask was investigated in a dual-frequency superimposed capacitively coupled plasma (DFS-CCP) etcher by different fHF/ fLF combinations by varying the CH2F2/ C4F8 gas flow ratio plasmas. The etch characteristics were measured by on scanning electron microscopy (SEM) And X-ray photoelectron spectroscopy (XPS) analyses and Fourier transform infrared spectroscopy (FT-IR). A process window for very high selective etching of TEOS oxide using ACL mask could be determined by controlling the process parameters and in turn degree of polymerization. Mechanisms for high etch selectivity will discussed in detail.

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.128-134
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• 2003

Alloys of Ti-43%Al-2%W-0.1%Si were oxidized isothermally and cyclically between $900^{\circ}C$ and$ 1050^{\circ}C$, and their oxidation characteristics were studied. During isothermal tests, the alloys oxidized slowly up to 100$0^{\circ}C$, but fast at $1050^{\circ}C$. Though the scale adherence was not good above $900^{\circ}C$, the alloys displayed better oxidation behavior than unalloyed TiAl alloys. The oxide scales consisted primarily of an outer $TiO_2$ layer, intermediate $Al_2$$O_3$-rich layer, and an inner mixed layer of (TiO$_2$ $+Al_2$$O_3$). Tungsten was present mainly at the lower part of the oxide scale, while Si over the whole oxide scale.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.333-334
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• 2007

This paper describes the characteristics of poly (polycrystalline) 3C-SiC grown on SiOz and AlN substrates, respectively. The crystalline quality of poly 3C-SiC was improved from resulting in decrease of FWHM (full width half maximum) of XRD by increasing the growth temperature. The minimum growth temperature of poly 3C-SiC was $1100^{\circ}C$. The surface chemical composition and the electron mobility of poly 3C-SiC grown on each substrate were investigated by XPS and Hall Effect, respectively. The chemical compositions of surface of poly 3C-SiC films grown on $SiO_2$ and AlN were not different. However, their electron mobilities were $7.65\;cm^2/V.s$ and $14.8\;cm^2/V.s$, respectively. Therefore, since the electron mobility of poly 3C-SiC films grown on AlN buffer layer was two times higher than that of 3C-SiC/$SiO_2$, a AlN film is a suitable material, as buffer layer, for the growth of poly 3C-SiC thin films with excellent properties for M/NEMS applications.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.436-437
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• 2012

염료감응형 태양전지의 성능을 향상시키기 위해서는 염료에서 여기된 전자가 TiO2 계면을 따라 TCO (Transparent Conductive Oxide)로 이동하지 않고 산화된 염료나 전해질과 재결합하는 것을 차단하는 것, 그리고 염료에 TCO의 전기적 접촉을 차단하는 것 등이 필요하다. 이를 위해 본 연구에서는 TiO2 박막층 위에 차단층 TiO2를 $450^{\circ}C$, $600^{\circ}C$, $700^{\circ}C$에서 각각 소결한 뒤Blocking layer로서의 온도에 따른 상(phase) 변화를 통해 염료감응형 태양전지의 효율 향상에 대해 실험하였다. 기존 염료 감응형 태양전지에 대한 보고에 의하면 $600^{\circ}C$ 이상에서의 상은rutile 상임을 확인할 수 있다. 실험결과 Blocking layer로서의 TiO2를 $750^{\circ}C$에서 $750^{\circ}C$에서 sintering 했을 때, 가장 좋은 전기적 특성을 나타내었다.

• Journal of the Korean Society for Heat Treatment
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• v.12 no.1
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• pp.47-54
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• 1999

Microstructure of Al-Si coated PWA 1426 alloy was studied. Diffusion coated specimens were heat treated for 4hr at $870{\sim}1087^{\circ}C$ and then were examined the changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. According to the result of EDS, it is supposed that the coated layer was composed of $Ni_2Al_3$. When diffusion treatment was conducted at $1087^{\circ}C$, coated layer varied from $Ni_2Al_3$ to NiAl phase and composed of mixed, denuded and inter-diffusion layer.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.449-452
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• 1998

We have studied the oxidatio nrte of $Si_{1-x}Ge_{x}$ epitaxial layer grown by MBE(molecular beam epitaxy). Oxidation were performed at 700.deg. C, 800.deg. C, 900.deg. C, and 1000.deg. C. After the oxidation, the results of AES(auger electron spectroscopy) showed that Ge was completely rejected out of the oxide and pile up at $SiO_{2}/$Si_{1-x}Ge_{x}$ interface. It is shown that the presence of Ge at the $SiO_{2}$/$Si_{1-x}Ge_{x}$ interface changes the dry oxidation rate. The dry oxidation rate was equal to that of pure Si regardless of Ge mole fraction at 700.deg. C and 800.deg.C, while it was decreased at both 900.deg. C and 1000.deg.C as the Ge mole fraction was increased. The ry oxidation rates were reduced for heavy Ge concentration, and large oxidation time. In the parabolic growth region of $Si_{1-x}Ge_{x}$ oxidation, The parabolic rate constant are decreased due to the presence of Ge-rich layer. After the longer oxidation at the 1000.deg.C, AES showed that Ge peak distribution at the $SiO_{2}$/$Si_{1-x}Ge_{x}$ interface reduced by interdiffusion of silicon and germanium.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.9-10
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• 2007

In this paper, Thin films of $HfO_2$/Hf were deposited on p-type wafer by Atomic Layer Deposition(ALD). And we studied the electrical characterization of $HfO_2$/Hf/Si MOS capacitor depending on thickness of Hf metal layer. $HfO_2$ films were deposited using TEMAH and $O_3\;at\;350^{\circ}C$. Samples were then annealed using furnace heating to $500^{\circ}C$. The MOS capacitor of round-type was fabricated on Si substrates. Through TEM(Transmission Electron Microscope), XRD(X-ray Diffraction), capacitance-voltage(C-V) and current-voltage(I-V) analysis, the role of thin Hf metal layer for the better $HfO_2$/Si interface property was investigated.