• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.8
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• pp.575-579
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• 2012

Heteroepitaxial InP films have been grown on GaAs substrates to study the effects of the nucleation layer's surface roughness on the epitaxial layer's quality. For this, InP nucleation layers were grown at $400^{\circ}C$ with various ethyldimethylindium (EDMIn) flow rates and durations of growth, annealed at $6200^{\circ}C$ for 10 minutes and then InP epitaxial layers were grown at $550^{\circ}C$. It has been found that the nucleation layer's surface roughness is a critical factor on the epitaxial layer's quality. When a nucleation layer is grown with an EDMIn flow rate of 2.3 ${\mu}mole/min$ for 12 minutes, the surface roughness of the nucleation layer is minimum and the successively grown epitaxial layer's qualities are comparable to those of the homoepitaxial InP layers reported. The minimum full width at half maximum of InP (200) x-ray diffraction peak and that of near-band-edge peak from a 4.4 K photoluminescence are 60 arcmin and 6.33 meV, respectively.

• Journal of IKEEE
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• v.28 no.1
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• pp.46-52
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• 2024

In this study, we investigated the electrical characteristics of SiC MOSFETs by depositing Si and oxidizing it to form the gate oxide layer. A thin Si layer was deposited approximately 20 nm thick on top of the SiC epi layer, followed by oxidation to form a gate oxide layer of around 55 nm. We compared devices with gate oxide layers produced by oxidizing SiC in terms of interface trap density, on-resistance, and field-effect mobility. The fabricated devices achieved improved interface trap density (~8.18 × 10¹¹ eV^-1cm^-2), field-effect mobility (27.7 cm²/V·s), and on-resistance (12.9 mΩ·cm²).

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2007.06a
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• pp.193-198
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• 2007

The NiSi is very promising candidate for the metallization in 60nm CMOS process such as FUSI(fully silicided) gate and source/drain contact because it exhibits non-size dependent resistance, low silicon consumption and mid-gap workfunction. Ni film was first deposited by using ALD (atomic layer deposition) technique with Bis-Ni precursor and $H_2$ reactant gas at $220^{\circ}C$ with deposition rate of $1.25{\AA}/cycle$. The as-deposited Ni film exhibited a sheet resistance of $5{\Omega}/{\square}$. RTP (repaid thermal process) was then performed by varying temperature from $400^{\circ}C$ to $900^{\circ}C$ in $N_2$ ambient for the formation of NiSi. The process window temperature for the formation of low-resistance NiSi was estimated from $600^{\circ}C$ to $800^{\circ}C$ and from $700^{\circ}C$ to $800^{\circ}C$ with and without Ti capping layer. The respective sheet resistance of the films was changed to $2.5{\Omega}/{\square}$ and $3{\Omega}/{\square}$ after silicidation. This is because Ti capping layer increases reaction between Ni and Si and suppresses the oxidation and impurity incorporation into Ni film during silicidation process. The NiSi films were treated by additional thermal stress in a resistively heated furnace for test of thermal stability, showing that the film heat-treated at $800^{\circ}C$ was more stable than that at $700^{\circ}C$ due to better crystallinity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.154-154
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• 2009

Cr capping layer를 이용하여 Titanium germanide의 열적 안정성을 향상시키는 연구를 수행하였다. n-type Ge(100) 기판 위에 전자빔 증착기를 이용하여 30nm 두께의 Ti와 Cr capping layer를 증착하고 $400\;^{\circ}C$에서 $800\;^{\circ}C$까지 30초간 N2 분위기로 급속 열처리하여 Ti germanide를 형성하였다. XRD결과로부터 Cr capping layer의 유무에 관계 없이 Ti germanide가 형성된 것을 관찰할 수 있었다. Ge 기판 위에 CTLM 패턴을 형성하고 실험을 진행하여 Ti germanide의 I-V 측정 데이터를 통해 Ohmic 특성을 알아보았고, contact resistance, sheet resistance, specific contact resistance를 구하였다.

• Journal of the Korean institute of surface engineering
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• v.28 no.6
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• pp.361-367
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• 1995

When steels are heated at $1000^{\circ}C$ in a fused borax bath containing $V_2O_5$ and $B_4C$powders, vanadium carbide layers are formed on the steel surfaces. Since a decrease in carbon concentration and in microhardness in the substrate just below the carbide layer has been observed, gas nitrocarburizing and vanadium carbide forming processes were combined to form a V(C,N) type layer which prevented the decrease in carbon concentration in the substrate. EPMA analysis was done for this V(C,N) type layer. Hardness just below the layer and wear resistance properties of such treated specimens were investigated.

• Journal of the Korean institute of surface engineering
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• v.32 no.2
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• pp.93-99
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• 1999

Surface polymer layer formed on the silicon wafer during the oxide overetching using $C_4F_8$/ helicon wave plasmas and their characteristics were investigated using spectroscopic elipsometry, X-ray photoelectron spectroscopy, and secondary ion mass spectrometry. Overetch percentage and dc-self bias voltage were varied to investigate the effects on the characteristics of the polymers remaining on the overetched silicon surface. The increase of bias voltage from -80 volts to -120 volts increased the C/F ratio and carbon bondings such as C-C, $C-CF_x$/, and C-Si in the polymer while reducing the thickness of the polymer layer. However, the increase of the overetch percentage from 50% to 100% did not change the composition of the polymer layer and the carbon bondings in the polymer layer remained same even though it increased the polymer thickness. The polymer layer formed at the higher dc-self bias voltage was more difficult to be removed by the following various post-etch treatments compared to that formed at the longer overetch percentage.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.311-312
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• 2010

The fabricated photovoltaic cells based on PIN heterojunctions, in this study, have a structure of ITO/poly(3, 4-ethylenedioxythiophene)-poly(styrenesulfonate)(PEDOT:PSS)/donor/donor:C60(10nm)/C60(35nm)/2, 9-dimethyl-4, 7-diphenyl-1, 10-phenanthroline(8nm)/Al(100nm). The thicknesses of an active layer(donor:C60), an electron transport layer(C60), and hole/exciton blocking layer(BCP) were fixed in the organic photovoltaic cells. We investigated the performance characteristics of the PIN organic photovoltaic cells with copper phthalocyanine(CuPc), tetracene and pentacene as a hole transport layer. Discussion on the photovoltaic cells with CuPc, tetracene and pentacene as a hole transport layer is focussed on the dependency of the power conversion efficiency on the deposition rate and thickness of hole transport layer. The device performance characteristics are elucidated from open-circuit-voltage(Voc), short-circuit-current(Jsc), fill factor(FF), and power conversion efficiency($\eta$). As the deposition rate of donor is reduced, the power conversion efficiency is enhanced by increased short-circuit-current(Jsc). The CuPc-based PIN photovoltaic cell has the limited dependency of power conversion efficiency on the thickness of hole transport layer because of relatively short exciton diffusion length. The photovoltaic cell using tetracene as a hole transport layer, which has relatively long diffusion length, has low efficiency. The maximum power conversion efficiencies of CuPc, tetracene, and pentacene-based photovoltaic cells with optimized deposition rate and thickness of hole transport layer have been achieved to 1.63%, 1.33% and 2.15%, respectively. The photovoltaic cell using pentacene as a hole transport layer showed the highest efficiency because of dramatically enhanced Jsc due to long diffusion length and strong thickness dependence.

• Journal of the Korean institute of surface engineering
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• v.20 no.2
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• pp.49-59
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• 1987

The properties of $Cr_2O_3-Al_2O_3-SiO_2$ composite oxide coatings on steel surface were investigated. The results obtained were as follows: The microhardness of oxide coating layer increased with increasing heat-treatment temperature and $Cr_2O_3$ content in coating layer. The hardness showed the highest value (850Hv) treated at 700$^{\circ}C$ for $SiO_2:Al_2O_3:Cr_2O_3$=1:1:4. Increasing heat-treatment temperature, corrosion current density became lower and coating layer became denser. The corrosion current density showed the lowest value $(6.5{\times}10^{-5}\;Acm^2)$ treated at 750$^{\circ}C\;for\;SiO_2:Al_2O_3:Cr_2O_3$=1:1:3. These results were explained by protective layer which was formed during heat-treatment. The bonding between matrix and coating layer is expected to be made mechanically and chemically by the inter diffusion of Ni and Fe. The composite oxide coating was formed by softening of the binder with increasing heat-treatment temperature. The strengthening of coating layer is to be resulted from the dispersion of major oxide particles.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.273-273
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• 2008

This paper describes the frequency response of two-port surface acoustic wave (SAW) resonator made of 002-polycrystalline aluminum nitride (AlN) thin film on 111-poly 3C-SiC buffer layer. In there, Polycrystalline AlN thin films were deposited on polycrystalline 3C-SiC buffer layer by pulsed reactive magnetron sputtering system, the polycrystalline 3C-SiC was grown on $SiO_2$/Si sample by CVD. The obtained results such as the temperature coefficient of frequency (TCF) of the device is about from 15.9 to 18.5 ppm/$^{\circ}C$, the change in resonance frequency is approximately linear (30-$150^{\circ}C$), which resonance frequency of AlN/3C-SiC structure has high temperature stability. The characteristics of AlN thin films grown on 3C-SiC buffer layer are also evaluated by using the XRD, and AFM images.

• Transactions on Electrical and Electronic Materials
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• v.3 no.2
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• pp.16-19
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• 2002

In this study, a novel red emitting organic electroluminescent (EL) device was fabricated with the bis(8-oxyquinolino)zinc II (Znq2) doped dye as an emitting layer. The Znq2 was synthesized successfully from zinc chloride (ZnC1$_2$) as an initial material. Then, we fabricated the red organic EL device with a dye (DCJTB) doped and inserted Znq2 between emission layer and cathode for increasing EL efficiency. The hole transporting layer is a N,N'-diphenyl-N,N'-bis-(3-methylphenyl)-1,1'-diphenyl-4,4-diamine (TPD), and the host material of emission layer is Znq2. And the electrical and luminance characteristics of the device were measured. We found that the EL device with Znq2 inserting layer results in the increasing luminance efficiency.