• Korean Journal of Materials Research
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• v.14 no.3
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• pp.186-190
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• 2004

An electron beam microcolumn composed of an electron emitter, micro lenses, scan deflector, and focus lenses have been fabricated and tested in the STEM mode. In this paper, we report a technique of precisely aligning the electron lenses by the laser diffraction patterns instead of the conventional alignment method based on aligner and STM. STEM images of a standard Cu-grid were observed using a fabricated microcolumn under both the retarding and accelerating modes.

• Proceedings of the KOSOMBE Conference
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• v.1994 no.12
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• pp.101-103
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• 1994

The film scanner that digitizes the conventional x-ray films is the necessary equipment in the transition period of going to the filmless hospital. We have developed the film scanner using laser. We have selected HeNe laser as light source. The polygonal mirror converts the point light source to line scanning light. In sensing part, the diffusing cylinder and 7 photo transistors converts the light signal which passing the film into the electric signal. With this scanner, we can scan successfully the conventional x-ray film by $1024\times1024$. Smaller the spot sire is, higher the resolution can be achieved.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.4
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• pp.386-390
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• 2006

Global consumption of aspheric lens will expand rapidly due to golbal transformation of the electronics based industry to optics based mechatronics. Especially, F-Theta lens is one of important parts in Laser Scanning Unit(LSU) because it affects the optical performance of LSU dominantly. Non axisymmetric machine based processing techologies are required to obtain high accuracy in utlra-precision aspheric core, the most important component in plastic injection molded F-Theta lens assembly. In this study, the core with non-axisymmetric aspheric shape which is used to emit the F-Theta lens was processed using the ultra precision processing technology and the shape accuracy of the core was measured. And the results there of were evaluated and compared with the emitted shape accuracy of F-Theta lens.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.889-891
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• 1998

Copper films have been deposited on glass substrate via a thermal decomposition of copper(II) formate using a focused $Ar^+$ laser emitting at 514 nm. The growth kinetics of these Cu films was investigated as a function of laser power and scan speed which varied in the range of 70-150 mW and 0.1-20 mm/s, respectively. The resistivity of the copper films was a factor of about 20 higher than· that of bulk value, but the resistivity decreased due to changes in morphology and porosity of the deposit after annealing at $300^{\circ}C$, 5 min. and was about $10{\mu}{\Omega}cm$.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1444-1446
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• 1998

Direct writing of copper lines has been achieved by pyrolytic decomposition of copper formate films using a focused argon ion laser beam($\lambda$ =514.5nm) on a glass. The thickness and linewidth of the deposited copper films were considered as a function of laser power and scan speed. As the result from AES, there are no other elements except for copper after decomposition in the atmospheric ambient.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.4
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• pp.374-385
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• 2015

In this paper, effective and user friendly CAM software is presented that automatically generates any three dimensional complex toolpaths according to a CAD drawing. In advanced manufacturing, often it is essential to scan the sample following a complex trajectory which consists of short (few microns) and multidirectional moves. The reported CAM software offers constant velocity for all short trajectory elements and provides an efficient shift of tool path direction in sharp corners of a tool trajectory, which is vital for any laser, based precision machining. The software also provides fast modification of tool path, automatic and efficient sequencing of path elements in a complicated tool trajectory, location of reference point and automatic fixing of geometrical errors in imported drawing exchange files (DXF) or DWG format files.

• Korean Journal of Computational Design and Engineering
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• v.10 no.1
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• pp.70-75
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• 2005

A 3D solid element mesh generation algorithm was newly developed. 3D surface points of global rectangular coordinates were supplied by a 3D laser scanner. The algorithm is strait forward and simple but it generates mixed solid elements such as hexagonal, pyramid and prism types. Then, the surface triangular or rectangular elements were generated from the solid elements. The key of the algorithm is elimination of elements and 3D adaptive surface smoothing using given 3D surface point data.

• Progress in Superconductivity
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• v.12 no.1
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• pp.17-22
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• 2010

Distribution of local critical temperature and current density in $YBa_2Cu_3O_{7-\delta}$ (YBCO) coated conductors was analyzed using a Low-temperature Scanning Laser Microscopy (LTSLM). We prepared YBCO coated conductors of various bridge types to study the spatial distribution of critical temperature and current density in single and multi bridges. An LTSLM system was modified for a detailed two-dimensional scan without shifting of the sample. We observed a spatial distribution of the critical temperature from the bolometric response, which arises from a focused laser beam at the sample near the superconducting transition. Also we studied the relation between the critical temperature and the current density.

• Laser Solutions
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• v.18 no.4
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• pp.12-16
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• 2015

The research on multi electron beam systems is being carried out by various methods. We are studying multi electron beam system using miniaturized electron beam columns. The column consists of electrostatic lenses, electrostatic deflector and tip emitter. Our operating system controls 4 column array, captures images of each column and maintains the instrument. We present the usefulness of our operating system for multi columns by capturing images of each column.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.310-313
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• 2005

CW laser dopant activation (CLDA) is suggested as an alternative to conventional thermal annealing. The sheet resistance of the ion doped poly-Si after CLDA is sufficiently low compared to the value measured after thermal annealing. The surface damage due to ion doping on the poly-Si can be recovered while CW laser scan for dopant activation. Therefore, the CLDA can be applied to LTPS processing.