• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.115-116
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• 2009

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.247-248
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• 2011

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.10a
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• pp.186-189
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• 2001

The main method in micro-etching process, used in manufacturing semiconductors, electronic components, circuits, is Photo Masking method that exposes and develops on the photo-sensitivity solutions or films. This method enables one to process highly precisely, $\pm$0.03 mm in end line location area. But this has limits in a high speed / wide width process, difficulties in endless masking, and the problem of high price. We have developed the direct masking method to make use of Gravure printing, widely used in grocery packing sheet printing. We made cylinder tools to influence the masking quality by laser stream process. We have confirmed that the end line location accuracy in the line width of the product is improved from 0.12 mm to $\pm$0.07 mm level, after etching process.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.203-203
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• 2012

The SWCNTs network are formed on various plastic substrates such as poly(ethylene terephthalate) (PET), polyimide (PI) and soda lime glass using roll-to-roll printing and spray process. Selective patterning of carbon nanotubes film on transparent substrates was performed using a femtosecond laser. This process has many advantages because it is performed without chemicals and is easily applied to large-area patterning. It could also control the transparency and conductivity of CNT film by selective removal of CNTs. Furthermore, selective cutting of carbon nanotube using a femtosecond laser does not cause any phase change in the CNTs, as usually shown in focused ion beam irradiation of the CNTs. The patterned SWCNT films on transparent substrate can be used electrode layer for touch panels of flexible or flat panel display instead indium tin oxide (ITO) film.

• Korean Journal of Metals and Materials
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• v.48 no.2
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• pp.163-168
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• 2010

We here describe the laser-direct patterning of nanostructured metal thin films. This method involves light-matter interaction in which a pulsed laser beam impinging on the film generates a thermoelastic force that plays a role to detach the film from the substrate or underlying layers. A moderate cohesion of the nanostructured film enables localized desorption of the material upon irradiation by a spatiallymodulated laser beam, giving good fidelity with the transfered pattern. This photoresist-free process provides a simple high-resolution scheme for patterning metal thin films.

• Laser Solutions
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• v.10 no.1
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• pp.29-34
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• 2007

We propose a novel application of laser engraving to patterning of light guide panel (LGP) for backlight. The feasibility of three-dimensional engraved pattern in the LGP was verified by measuring brightness and uniformity. To improve the overall uniformity, we have modified proposed patterns and found improved design for patterns. The tailoring of pattern by using laser engraving method could endow the controllability of uniformity. The proposed LGPs are more efficient in both average brightness and uniformity of illumination than the conventional LGPs which have surface pattern on the panel.

• Laser Solutions
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• v.15 no.3
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• pp.7-10
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• 2012

Dimensions (line/space) of circuits in IC substrates for high-end chips (e.g. CPU, etc.) are anticipated to decrease as small as $10{\mu}m/10{\mu}m$ in 2014. Since current etch-based circuit-patterning processes are not able to address the urgent requirement from industry, laser-based circuit patterning processes are under active research in which UV laser is used to engrave embedded circuits patterns into IC substrates. In this paper, we used a nanosecond UV laser to directly fabricate embedded circuit patterns into IC substrates with/without ceramic powders. In experiments, we engraved embedded circuit patterns with dimensions (width/depth) of abut $10{\mu}m/10{\mu}m$ and $6{\mu}m/6{\mu}m$ into the IC substrates. Due to the recoil pressure occurring during ablation, the circuit patterning of the IC substrates with ceramic powders showed the higher ablation rate.

• Journal of the Korean institute of surface engineering
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• v.49 no.1
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• pp.20-25
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• 2016

Femtosecond laser ablation of ultrathin polymer films on quartz glass using laser pulses of 100 fs and centered at ${\lambda}=400nm$ wavelength has been investigated for nanometer precision thin film patterning. Single-shot ablation craters on films of various thicknesses have been examined by atomic force microscopy, and beam spot diameters and ablation threshold fluences have been determined by square diameter-regression technique. The ablation thresholds of polymer film are about 1.5 times smaller than that of quartz substrate, which results in patterning crater arrays without damaging the substrate. In particular, at a $1/e^2$ laser spot diameter of $0.86{\mu}m$, the smallest craters of 150-nm diameter are fabricated on 15-nm thick film. The ablation thresholds are not influenced by the film thickness, but diameters of the ablated crater are bigger on thicker films than on thinner films. The ablation efficiency is also influenced by the laser beam spot size, following a $w_{0q}{^{-0.45}}$ dependence.

• Journal of the Korean Magnetics Society
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• v.13 no.3
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• pp.115-120
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• 2003

We have developed laser micro-machining technology for fabrication of the micro thin-film inductors. After the thin layers of FM/M/FM films were coated to the silicon substrate by using the conventional sputtering method, the new laser machining was applied to the patterning process that used to be carried out by the semiconductor lithography procedure. A CW Nd:YAG laser operating in TEM$\sub$00/ mode was actively Q-switched to obtain the very short pulse of 200 ns. The laser micro-machining process with pulse energy and repetition rate have been optimized as 5 mJ/pulse and 5 kHz, respectively, to obtain the line resolution as fine as 20 $\mu\textrm{m}$.

• Korean Journal of Optics and Photonics
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• v.17 no.2
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• pp.203-206
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• 2006

Femtosecond laser-induced nano-patterning of an Al surface coated on a slide glass is reported in this paper. It was found that the period of the laser-induced nano-patterning was much dependent on the incident laser power and pulse number. Through finely adjusting the laser power and pulse number, uniform nano-patterns could be formed on the Al surface. It is based on the interference of the incident laser beam with some form of a surface scatted electromagnetic wave. It was also found that an Al oxide layer played an important role in forming the nano-patterning on the Al surface.