• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.608-611
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• 2003

In this paper, laser direct micromaching is developed to fabricate micro patterns using UV laser ( λ$_3$= 355 nm). Experimentally, laser beam paths mainly influences the surface shape quality. Thus. we proposed laser beam path generator by extracting shape data in a blueprint worked through CAD modeler and using genetic algorithm that considers the characteristics of laser beam. The results show that various shapes of micro patterns could be manufactured using proposed method in this paper.

• International Journal of CAD/CAM
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• 제6권1호
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• pp.183-192
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• 2006

A CAD/CAM system has been developed for rapid prototyping (RP) of microfluidic devices based on excimer laser micromachining. The system comprises of two complementary softwares. One, the CAM tool, creates part programs from CAD models. The other, the Simulator Tool, uses a part program to generate the laser tool path and the 2D and 3D graphical representation of the machined microstructure. The CAM tool's algorithms use the 3D geometry of a microstructure, defined as an STL file exported from a CAD system, and process parameters (laser fluence, pulse repetition frequency, number of shots per area, wall angle), to automatically generate Numerical Control (NC) part programs for the machine controller. The performance of the system has been verified and demonstrated by machining a particle transportation device. The CAM tool simplifies part programming and replaces the tedious trial-and-error approach to creating programs. The simulator tool accepts manual or computer generated part programs, and displays the tool path and the machined structure. This enables error checking and editing of the program before machining, and development of programs for complex microstructures. Combined, the tools provide a user-friendly CAD/CAM system environment for rapid prototyping of microfluidic devices.

• 한국정밀공학회지
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• 제26권10호
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• pp.108-115
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• 2009

Although nanosecond pulsed laser drilling and milling are rapid and non-wear processes in micromachining, the quality cannot meet the precision standard due to the recast layer and heat affected zone. On the other hand, electrical discharge machining (EDM) is a well-known high precision machining process in micro scale; however, the low material removal rate (MRR) and tool wear remain as drawbacks. In this paper, hybrid process of laser beam machining (LBM) using nanosecond pulsed laser and micro EDM was studied for micro drilling and milling. While the quality of the micro structure fabricated by this hybrid process remains as high as direct EDM, the machining time and tool wear can be reduced. In addition, variable depth of layer was introduced as an effective method improving efficiency of hybrid milling.

• 한국정밀공학회지
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• 제31권1호
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• pp.75-81
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• 2014

Laser beam machining has been known as efficient for glass micromachining. It is usually used the ultra-short pulsed laser which is time-consuming and uneconomic process. In order to use economic and powerful long pulsed laser, indirect processing called laser-induced backside wet etching (LIBWE) is good alternative method. In this paper, micromachining of glass using Nd:YAG laser with nanosecond pulsed beam has been attempted. In order to improve shape accuracy, combined processing with magnetic stirrer has been widely used. Magnetic stirrer acts to circulate the solution and remove the bubble but it is not suitable for deep hole machining. To get better effect, ultrasonic vibration was applied for improving shape accuracy.

• 한국레이저가공학회지
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• 제16권2호
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• pp.16-18
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• 2013

In this paper, we fabricated breathable films on the use of microwave oven by using UV nanosecond laser micromachining, and the number of micro-grooves on the film is controlled for different oxygen transfer rate(OTR). As different number of micro-groove, the breath films of 100,000cc, 120,000cc, and 150,000cc can be fabricated. The breath film package of 120,000cc is used for the experiment of steaming a sweet potato. At the result, the sweet potato is well-cooked with enough moisture in the package not bursted.

• 한국정밀공학회지
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• 제23권5호
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• pp.190-196
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• 2006

Transparent materials are widely used in the fields of optic parts and bio industry. We have experiment to find out the characteristics of the micromachining inside transparent materials using femtosecond laser pulses. With its non-linear effects by very high peak intensity, filament (plasma channel) was formed by the cause of the self-focusing and the self-defocusing. Physical damage could be found when the intensity is high enough to give rise to the thermal stress or evaporation. At the vicinity of the power which makes the visible damage or modification, the structural modification occurs with the slow scanning speed. According to the polarization direction to the scanning direction, the filament quality is quite different. There is a good quality when the polarization direction is parallel to the scanning direction. For fine filament, we could suggest the conditions of the high numerical aperture lens, the short shift of focusing point, the low scanning speed and the low power below 20 mW. As the examples of optics parts, we fabricated the fresnel zone plate with the $225{\mu}m$ diameter and Y-bend optical wave guide with the $5{\mu}m$ width.

• 반도체디스플레이기술학회지
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• 제5권3호
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• pp.5-10
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• 2006

This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.

• 한국레이저가공학회지
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• 제12권1호
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• pp.7-13
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• 2009

Engineering ceramics as sapphire are widely used in industry owing to their superior mechanical and corrosion properties. However, micromachining of sapphire is a considerable challenge due to its transparency. Recently, direct ablation of sapphire has been demonstrated with a visible laser pulse at sufficiently high laser intensity. In this work, the theoretical model for pulsed laser ablation of sapphire is suggested and numerical analysis is carried out using the model. Sapphire ablation begins with plasma generation by the laser interaction with surface defects, impurities and contaminations in the initial stage of machining. Subsequent absorption of the visible laser beam can be explained by three mechanisms: metalization of sapphire surface due to the EUV radiation from the hot plasma, increments of surface roughness and temperature-dependent absorption coefficient. Comparison of the computation results with experimental observation indicates that the proposed model of sapphire is reasonable.

• Journal of the Optical Society of Korea
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• 제7권3호
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• pp.160-164
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• 2003

Materials processing by ultrashort pulsed laser is actively being applied to micromachining technology due to its advantages with regard to non-thermal machining. In this study, materials processing with ultrashort pulses was studied by using the high repetition rate of a 800 nm Ti:sapphire regenerative amplifier. This revealed that the highly precise micromachining of metallic thin film and bulk glass with a minimal heat affected zone (HAZ) could be obtained by using near damage threshold energy. Grooves with diffraction limited sub-micrometer width were obtained with widths of 620 nm on Cr thin film and 800 nm on a soda-lime glass substrate. The machined patterns were investigated through SEM images. We also phenomenologically examined the influence of variations of parameters and proposed the optimal process conditions for microfabrication.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.23-24
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• 2007