• Transactions of Materials Processing
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• v.20 no.4
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• pp.279-283
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• 2011

Recently incremental sheet metal forming (ISF) has used widely in making prototypes and small-volume products in automotive industry etc. We apply the ISF to make a 1/4 sized automobile body-in-white. First, ISF tests for rectangular shaped cup have been performed to clarify the formability denoting the relationship between the component wall angle and maximum cup height of safe forming. Next, a CAD model for the automobile was designed and segmented into several components in order to accommodate the working space of the CNC machine we adopted and the formability of the sheet metal. Then, a CAM software was employed to generate the tool path for manufacturing wooden dies and all the small parts. Finally, the different parts were joined into a single component by laser welding after the ISF process. By using the ISF we successfully produced the 1/4 sized automobile body-in-white.

• Transactions of Materials Processing
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• v.19 no.2
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• pp.132-137
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• 2010

In the multi-pass shape drawing process, the appropriate process design is very important to produce sound products. The reduction ratio, die angle, and the intermediate die shape are very important process variable of the multi-pass shape drawing. The aim of this study is the determination of the reduction ratio, die angle, and the intermediate die shape of the 2 pass shape drawing process for producing steering spline shaft. In this study, FE analysis, Taguchi method, and ANN(artificial neural network) were applied to determine the appropriate reduction ratio, die angle, and intermediate die shape. After the determination of the process variables, FE analysis and drawing experiment were performed to evaluate the effectiveness of the determined process variables. The dimensional accuracy of the final drawn spline shaft was evaluated by using 3D surface profiler and 3D laser digitizing system.

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Fisheries and Aquatic Sciences
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• v.5 no.1
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• pp.43-47
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• 2002

Jeotgal, salt- fermented sea food, is a kind of Korean traditional foods. We carried out hazard analysis on Changran (stomach and intestine of Alaska pollack) Jeotgal and squid Jeotgal through the whole processing procedures at H Co. located at Guryongpo from April 2000 to September 2001. During this studying period, we educated employee regularly and analyzed hazards on the whole process and then could conclude that pathogenic bacteria and metal particles were most important hazards in Jeotgal. Metal particles in end-product will be eliminated by laser detector before packaging. But bacteria must thoroughly manage through the whole process. Bacteriological qualities of the end products were much improved after education for the employees and by effort for HACCP (Hazard Analysis and Critical Control Point) program introduction. Pathogenic bacteria such as pathogenic Escherichia coli, Salmonella spp., coagulase positive Staphylococcus aureus and Vibrio parahaemolyticus were not detected from not only raw materials but also end products. The falling bacteria in the places such as thawing area, packaging area, seasoning area, fermenting room, subsidiary materials room and storage room were less than 30 CFU per plate for 30 minutes during working time. But those were increased more than 10 times during the resting time. It means that special measures are needed during the break time such as lunch time or exchanging working teams.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.244-249
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• 2001

In this paper, we present the simultaneous measurement of the fabricaition strain and temperature during and after cure of unsymmetric composite laminate uising fiber optic sensors. Fiber Bragg grating/extrinsic Fabry-Perot interferometric (FBG/EFPl) hybrid sensors are used to measure those measurands. The characteristic matrix of sensor is analytically derived and measurements can be done without sensor calibration. A wavelength-swept fiber laser is utilized as a light source. FBG/EFPI sensors are embedded in a graphite/epoxy unsymmetric cross-ply composite laminate at different direction and different location. We perform the real time measurement of fabrication strains and temperatures at two points of the composite laminate during cure process in an autoclave. Also, the thermal strains and temperatures of the fabricated laminate are measured in thermal chamber. Through these experiments, we can provide a basis for the efficient smart processing of composite and know the thermal behavior of unsymmetric cross-ply composite laminate.

• Journal of Sensor Science and Technology
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• v.21 no.3
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• pp.186-191
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• 2012

In this paper, we present a pH measurement method that uses a microcantilever-array-based biosensor system. It is composed of microcantilever array, liquid cell, micro syringe pump, laser diode array, position sensitive detector, data acquisition device, and data processing software. Four microcantilevers are functionalized with pH-sensitive MHA(mercaptohexadecanoic acid) as a probe, while three microcantilevers are functionalized with HDT(hexadecane thiol) as reference. We prepare PBS(phosphate buffered saline) solutions of different pH and inject them into the liquid cell with a predefined volumetric speed at regular time intervals. The functionalized mircocantilevers in the liquid cell deflect as a self-assembled monolayer on the microcantilever binds with probe molecules in the solution. The difference in deflection between the MHA-covered probe microcantilever and the HDT-covered reference microcantilever was used to compensate for thermal drift. The deflection difference clearly increases with increasing pH in the solution. It was shown that when the pH values of the PBS solutions are high, there were large variations in the deflection of microcantilevers, whereas there were small variations for low pH value. The experimental results show that the microcantilever array functionalized with MHA and HDT can detect pH value with good repeatability.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.285-289
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• 2004

Micro tensile test specimens of thin film single crystal silicon for the most useful structural materials in MEMS (Micro Electro Mechanical System) devices were fabricated using SOI (Silicon-on-Insulator) wafers and MEMS processes. Dimensions of micro tensile test specimens were thickness of $7\mu\textrm{m}$, width of 50~$350\mu\textrm{m}$, and length of 2mm. Top and bottom silicon were etched using by deep RIE (Reactive Ion Etching). Thin film aluminum markers on testing region of specimens with width of $5\mu\textrm{m}$, lengths of 30~$180\mu\textrm{m}$ and thickness of 200 nm for measuring tensile strain were fabricated by aluminum wet etching method. Fabricated side wall angles of aluminum marker were about $45^{\circ}~50^{\circ}$. He-Ne laser with wavelength of 633nm was used for checking fringed patterns.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.918-920
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• 2006

Metal sulfide powders such as MnS, $MoS_2$ and FeS are simply used to the machinery processing improvement agent and solid lubricant in powder metallurgy industrial. And then, metal sulfide powders have received relatively little attention from powder metallurgy. Recently, the portable machine is one of the important interfaces between human or human and electronic machine. With the increase of the intelligent activity, the social and industrial demands for information display device and power source are increasing. The transition metal sulfide materials (FeS, ZnS) have received considerable attention due to the large variety of its electric, optical and magnetic properties. Among the metal sulfide, $FeS_2$ is appealing superior material for applications in $Li-2^{nd}$ battery because of high capacity. ZnS is also a famous phosphor material with various luminescence properties, such as photoluminescence (PL) and electroluminescence (EL). So generally used in the fields of display, sensors and laser. Metal sulfide materials, therefore, are provided for most widely application in all industries. In recent years, material researchers have become increasingly interested in studying with synthesis of metal sulfide.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.1-12
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• 2021

Here, we introduce a laser-induced graphene synthesis technology and its applications for the electric/electronic device manufacturing process. Recently, the micro/nanopatterning technique of graphene has received great attention for the utilization of these new graphene structures, which shows progress developments at present with a variety of uses in electronic devices. Some examples of practical applications suggested a great potential for the tunable graphene synthetic manners through the control of the laser set-up, such as a selection of the wavelength, power adjustment, and optical techniques. This emerging technology has expandability to electric/electronic devices combined together with existed micro-packaging technology and can be integrated with the new processing steps to be applied for the operation in the fields of biosensors, supercapacitors, electrochemical sensors, etc. We believe that the laser-induced graphene technology introduced in this paper can be easily applied to portable small electronic devices and wearable electronics in the near future.

• Korean Journal of Materials Research
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• v.20 no.5
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• pp.257-261
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• 2010

A non-volatile resistive random access memory (RRAM) device with a Cr-doped $SrZrO_3/SrRuO_3$ bottom electrode heterostructure was fabricated on $SrTiO_3$ substrates using pulsed laser deposition. During the deposition process, the substrate temperature was $650^{\circ}C$ and the variable ambient oxygen pressure had a range of 50-250 mTorr. The sensitive dependences of the film structure on the processing oxygen pressure are important in controlling the bistable resistive switching of the Cr-doped $SrZrO_3$ film. Therefore, oxygen pressure plays a crucial role in determining electrical properties and film growth characteristics such as various microstructural defects and crystallization. Inside, the microstructure and crystallinity of the Cr-doped $SrZrO_3$ film by oxygen pressure were strong effects on the set, reset switching voltage of the Cr-doped $SrZrO_3$. The bistable switching is related to the defects and controls their number and structure. Therefore, the relation of defects generated and resistive switching behavior by oxygen pressure change will be discussed. We found that deposition conditions and ambient oxygen pressure highly affect the switching behavior. It is suggested that the interface between the top electrode and Cr-doped $SrZrO_3$ perovskite plays an important role in the resistive switching behavior. From I-V characteristics, a typical ON state resistance of $100-200\;{\Omega}$ and a typical OFF state resistance of $1-2\;k{\Omega}$, were observed. These transition metal-doped perovskite thin films can be used for memory device applications due to their high ON/OFF ratio, simple device structure, and non-volatility.