• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.8 no.5
• /
• pp.115-120
• /
• 1999

This research is a described result of experimental for the parameter's effecting the microhole machining by Nd-Yag laser, The parameters are energy, pulse interval time a kin of assisting gas and its pressure. The result reveals that parameter value of energy 0.08J, pulse 20Hz, interval time of 300 microseconds could be a good machining condition to make upper microhoel that is the diameter range of 50-70${\mu}{\textrm}{m}$. At tat time the assistant gas such air, $O_2$, Ar $N_2$, was appelied. Assistant gas of air makes heat affected zone enlarge due to burning of material surface. Also it makes microhole irregular and damageable. Because of refusion caused by chemical reaction with $Al_2O_3$ ceramic material . The $O_2$(99.9%) has good characteristics to get good drilling and smooth surface on pressure of 0.2kgf/$\textrm{cm}^2$ but it is expensive. Ar, $N_2$ make material crack and burnning and proved that to be unappropriate but, Ar was a better than $N_2$.

• Transactions of Materials Processing
• /
• v.13 no.3
• /
• pp.253-261
• /
• 2004

The machining technology for the brittle materials such as ceramics are applied to the fields of MEMS(micro electromechanical system) by the progress of new machining technologies such as Etching, Diamond machining, Micro drilling, EDM(Electro discharge machining), ECDM(Electro discharge machining), USM(Ultrasonic machining), LBM(Laser beam machining), EBM(Electron beam machining). Especially, the USM technology can be applied to the dieletric brittle materials such as silicon, borosilicate glass, silicon nitride, quartz and ceramics with high aspect ratio. The micro machining system with machining force controlled position servo is developed in this paper and the optimized ultrasonic machining algorithm is constructed by the force controlled position servo control. The load cell is adapted in the force measuring and the servo control algorithm, suit for the ultrasonic machining characteristics, is estabilished with using the PID auto-tunning functions at the PMAC system which is generally adapted in the field of robot industries. The precision force signal amplifier is constructed with high precision operational amplifier AD524. The vacuum adsorption chuck which is made of titanum and internal flow line is engraved, is used in the workpiece fixing. The mahining results by USM shows that there are some deviation between the force command and the actual machining force that the servo control algorithm should be applied in the machining procedures. Therefore, the constant force controlled position servo system is developed for the micro USM system and by the examination machining process in USM, the stable USM system is realized by tracking the average value of machining force.

• International Journal of Internet, Broadcasting and Communication
• /
• v.12 no.2
• /
• pp.30-36
• /
• 2020

We demonstrated a successful fabrication of 4" Gallium Nitride (GaN)/Diamond High Electron Mobility Transistors (HEMTs) incorporated with Inner Slot Via Hole process. We made in manufacturing technology of 4" GaN/Diamond HEMT wafers in a compound semiconductor foundry since reported [1]. Wafer thickness uniformity and wafer flatness of starting GaN/Diamond wafers have improved greatly, which contributed to improved processing yield. By optimizing Laser drilling techniques, we successfully demonstrated a through-substrate-via process, which is last hurdle in GaN/Diamond manufacturing technology. To fully exploit Diamond's superior thermal property for GaN HEMT devices, we include Aluminum Nitride (AlN) barrier in epitaxial layer structure, in addition to conventional Aluminum Gallium Nitride (AlGaN) barrier layer. The current collapse revealed very stable up to Vds = 90 V. The trapping behaviors were measured Emission Microscope (EMMI). The traps are located in interface between Silicon Nitride (SiN) passivation layer and GaN cap layer.

• Design & Manufacturing
• /
• v.16 no.1
• /
• pp.43-49
• /
• 2022

As technologies in various industrial fields develop, high-quality parts are required. In the past, precision parts were produced by the contact machining method, but the contact machining method has clear limitations. In order to solve this problem, research on a non-contact processing method has been conducted, and laser processing and electric discharge processing are representative. However, the non-contact method has a problem in that productivity is insufficient, and there is a problem that it takes a lot of time to continuously process microholes. Researchers have developed an electron beam drilling equipment for continuous processing of fine holes, and a vaporization amplification sheet to increase the processing efficiency of the equipment. In this study, a cylindrical vaporization amplification sheet using room temperature curing type silicon was fabricated, and the metal distribution and thickness uniformity of the produced sheet were analyzed. In order to manufacture a cylindrical vaporization amplification sheet, an equipment capable of using centrifugal force was developed, and a sample in which metal powder was evenly distributed and a constant thickness was produced.

• Explosives and Blasting
• /
• v.33 no.4
• /
• pp.1-6
• /
• 2015

Abstract This study is to efficiently calculate and evaluate the elements of advance, overbreak and underbreak on the mine under the production using the 3D laser scanner. For this purpose, a 3D laser scanner was sued to acquire the point-cloud which records the space coordinates and modelling of the underground tunnel using the 3D modeling program. When each element was observed through the study result, the advance on the center cut was 2.6m in average while the total advance was 2.4m. If the drilling length of 3.8m is based, the advance rate was evaluated to be 67% in average in the center cut section with the total average of 64%. In addition, when the volume of overbreak was measured based on the design cross section, the average overbreak volume was found to be $4.5m^3$ on left wall, $4.5m^3$ on right wall, and $5m^3$ on roof with the total volume of $14m^3$. When the overbreak volume is measured based on the look-out cross section, it was $3m^3$ on roof with the total volume of $8.4m^3$. The rate of overbreak volume against the average excavation volume was 8% based on the design cross section and 5% based on the look-out cross section.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.3
• /
• pp.77-82
• /
• 2012

In this paper, the research of IC embedded PCB process is carried out. For embedding chips into PCB, solder-balls on chips were etched out and ABF(Ajinomoto Build-ip Film), prepreg and Cu foil was laminated on that to fabricate 6 layer build-up board. The chip of which solder ball was removed was successfully interconnected with PCB by laser drilling and Cu plating. However, de-lamination phenomenon occurred between chip surface and ABF during reflow and thermal shock. To solve this problem, de-smear and plasma treatment was applied to PI(polyimide) passivation layer on chip surface to improve the surface roughness. The properties of chip surface(PI) was investigated in terms of AFM(Atomic Force Micrometer), SEM and XPS (X-ray Photoelectron Spectroscopy). As results, nano-size anchor was evenly formed on PI surface when plasma treatment was combined with de-smear(NaOH+KMnO4) process and it improved thermal shock reliability ($260^{\circ}C$-10sec solder floating).

• Current Photovoltaic Research
• /
• v.1 no.1
• /
• pp.17-26
• /
• 2013

In contrast to conventional crystalline cells, back-contact solar cells feature high efficiencies, simpler module assembly, and better aesthetics. The highest commercialized cell and module efficiency was recorded by n-type back-contact solar cells. However, the mainstream PV industry uses a p-type substrate instead of n-type due to the high costs and complexity of the manufacturing processes in the case of the latter. P-type back-contact solar cells such as metal wrap-through and emitter wrap-through, which are inexpensive and compatible with the current PV industry, have consequently been developed. In this paper the characteristics of EWT (emitter wrap-through) solar cells and their status and prospects for development are discussed.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.11 no.6
• /
• pp.130-138
• /
• 2012

There are increasing demands from the industry for intelligent robot-calibration solutions, which can be tightly integrated to the manufacturing process. A proposed solution can simplify conventional robot-calibration and teaching methods without tedious procedures and lengthy training time. iGPS(Indoor GPS) system is a laser based real-time dynamic tracking/measurement system. The key element is acquiring and reporting three-dimensional(3D) information, which can be accomplished as an integrated system or as manual contact based measurements by a user. A 3D probe is introduced as the user holds the probe in his hand and moves the probe tip over the object. The X, Y, and Z coordinates of the probe tip are measured in real-time with high accuracy. In this paper, a new approach of robot-calibration and teaching system is introduced by implementing a 3D measurement system for measuring and tracking an object with motions in up to six degrees of freedom. The general concept and kinematics of the metrology system as well as the derivations of an error budget for the general device are described. Several experimental results of geometry and its related error identification for an easy compensation / teaching method on an industrial robot will also be included.

• Korean Journal of Materials Research
• /
• v.22 no.7
• /
• pp.335-341
• /
• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Journal of the Korean Geotechnical Society
• /
• v.25 no.8
• /
• pp.5-21
• /
• 2009

Based on recent studies on rock socketed drilled shafts, it was found that the side resistance of rock socketed drilled shafts is affected by unconfined compressive strength of rock, socket roughness, rock types and joints, and initial normal stress. Especially, the socket roughness is affected by rock types and joints, drilling methods, and diameters. Since existing roughness measurement systems could be conducted only in the air, a new roughness measurement system, which can measure rock socket roughness in the air and also in the water, is needed. However, the development of new roughness measurement system fur civil engineers has been faced with difficulties of electrical applications. In this study, the laboratory verification system far BKS-LRPS (Backyoung-KyungSung Laser Roughness Profiling System) was developed, which can be applied both in the water and air. Based on the laboratory verification, it was found that the improved BKS-LRPS could define effective measurement distances for the conditions reflecting the apparatus and in-situ situations.