• Title/Summary/Keyword: laser cutting efficiency

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Process Optimization for the Laser Cutting of Cold Rolled STS Sheet (냉연 스테인리스강판의 레이저 절단 특성)

  • 이기호;김기철
    • Journal of Welding and Joining
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    • v.14 no.5
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    • pp.59-68
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    • 1996
  • This study was aimed to characterize the laser cutting process for the cold rolled stainless steel sheet. The principal process parameters of the cutting process were applied to both the continuous wave form and the pulsed wave form for the laser output mode. The laser-oxygen cutting process and the laser-nitrogen cutting process were also considered to characterize the quality and efficiency of the cutting process. The laser-oxygen cutting process revealed the better productivity than the laser-nitrogen cutting process, since the laser energy and the exothermic oxidation energy exerted on the laser-oxygen cutting process simultaneously during the entire cutting process. However, the straightness of the cutting section, which was considered as the most important factors, was inferior to that of the laser-nitrogen cutting process due to the formation of chromum oxide on the cutting surface. Frequency and duration of the pulsed wave form act as the main factors for the better quality, When the frequency increased from 100 Hz to 200 Hz and the duty increased from 20% to 40%, the quality factors such as the height of dross and the surface roughness were improved remarkably. The increase in the frequency from 200 Hz to 300 Hz, on the other hand, revealed the less effective in the cutting quality.

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Effects of Laser Parameters and Workpiece Conditions on Cutting Characteristics of Solid Wood and Wood-based Panel(II) - Specific Cutting Energy and Surface Qualities - (레이저변수(變數)와 피삭재조건(被削材條件)이 목재(木材) 및 목질(木質)보드의 절삭특성(切削特性)에 미치는 영향(影響)(II) - 비절삭(比切削)에너지와 절삭면(切削面)의 품질(品質) -)

  • Sim, Jae-Hyeon;Jung, Hee-Suk
    • Journal of the Korean Wood Science and Technology
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    • v.26 no.1
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    • pp.38-50
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    • 1998
  • Laser cutting tests were conducted to investigate the laser cutting characteristics of solid woods such as 25mm-thick white oak(Quercus acutissima) and maple(Acer mono), and wood-based panels such as 15mm-thick medium density fiberboard and particleboard. Test variables were laser power, cutting speed, grain direction, and moisture content. Specific cutting energy was measured and the qualities of cut surface were estimated in constant laser power. Specific cutting energy of white oak was larger than that of maple, and specific cutting energy of medium density fiberboard was smaller than that of particleboard. For both white oak and maple, specific cutting energy of green wood was smaller than that of air-dried wood because weight loss of moisture evaporation in green wood was larger than that in air-dried wood. In laser-cut surface, wood cells were not deformed and damaged, but in circular saw-cut surface fibers were pushed out and cut, and wood cells were deformed severely. However, mechanical surface roughness of saw-cut surface was smoother than that of laser-cut surface because of the existence of undeformed cell cavity in laser-cut surface.

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A Study on the Optimum Machining Conditions and Energy Efficiency of a Laser-Assisted Fillet Milling

  • Woo, Wan-Sik;Lee, Choon-Man
    • International Journal of Precision Engineering and Manufacturing-Green Technology
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    • v.5 no.5
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    • pp.593-604
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    • 2018
  • Laser-assisted machining (LAM) is known to be an effective and economical technique for improving the machinability of difficult-to-machine materials. In the LAM method, material is preheated using a laser heat source and then the preheated area is removed by following cutting tool. For laser-assisted turning (LAT), the configuration of the system is not complicated because laser irradiates from a fixed position. In contrast, laser-assisted milling (LAMill) system is not only complicated but also difficult to control because laser heat source must always move ahead of the cutting tool along a three dimensional (3D) tool path. LAMill is still early stage and cannot yet be used to machine finished products with 3D shapes. In this study, a laser-assisted fillet milling process was developed for machining 3D shapes. There are no prior studies combining fillet milling and LAMill. Laser-assisted fillet milling strategy was proposed, and effective depth of cut (EDOC) was obtained using thermal analysis. Experiments were designed using response surface method and cutting force prediction equations were developed using statistical analysis and regression analysis. The optimum machining conditions were also proposed, and energy efficiency of the LAMill was analyzed by comparing the specific cutting energy of conventional machining (CM) and LAMill.

Laser Cutting of Thick Diamond Films Using Low-Power Laser (저 출력 레이저를 이용한 다이아몬드 후막의 절단)

  • 박영준;백영준
    • Journal of the Korean Ceramic Society
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    • v.37 no.2
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    • pp.140-144
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    • 2000
  • Laser cutting of thick diamond films is studied using a low-power(10 W) copper vapor laser. Due to the existence of the saturation depth in laser cutting, thick diamond films are not easily cut by low-power lasers. In this study, we have adopted a low thermalconductivity underlayer of alumina and a heating stage (up to 500$^{\circ}C$ in air) to prevent the laser energy from consuming-out and, in turn, enhance the cutting efficiency. Aspect ratio increases twice fromm 3.5 to 7 when the alumina underlayer used. Adopting a heating stage also increases aspect ratio and more than 10 is obtained at higher temperatures than 400$^{\circ}C$. These results show that thick diamond films can be cut, with low-power lasers, simply by modifying the thermal property of underlayer.

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Integrated Automation System of Pattern Design and $CO_2$ Laser Cutting for Diving Suits (잠수복 패턴 자동 설계 및 $CO_2$ 레이저 절단을 위한 통합 시스템 개발)

  • 윤세봉;강병수;강재관;김여숙
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.10a
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    • pp.409-412
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    • 2004
  • In this paper, an integrated automation system of pattern design and $CO_2$ laser cutting for diving suits is presented. Pattern design includes grading which creates a full-size range from a base pattern. Tool path for laser cutting from the patterns is generated in G-code format. $CO_2$ Laser cutting machine is developed to help cut the patterns with accuracy and speed. Aluminum profiles, ball screws, and stepping motors are engaged into the machine as frame structure, transfer unit, and driving devices respectively. The developed system is tested in dry suit cutting, convincing it can be readily introduced in driving suits manufacturing with respect to cost and efficiency.

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Fabrication and Chracteristics of Cutting Cell with Various Laser Conditions (다양한 레이저 조건에 따른 컷팅셀 제작 및 특성 분석)

  • Park, Jeong Eun;Kim, Dong Sik;Choi, Won Seok;Jang, Jae Joon;Lim, Dong gun
    • Journal of the Korean Solar Energy Society
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    • v.39 no.3
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    • pp.9-17
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    • 2019
  • Laser cutting cell of solar cells can achieve high voltage and efficiency through more array than conventional 6 inch cell compared to same area. In this study, we fabricated c-Si cutting cell with various lasers and laser conditions such as power, speed, and number of times. In the case of picosecond laser, excellent surface characteristics were obtained due to small surface defects and low thermal damage at the output of 20W and the speed of 100 mm/s. However, it is not possible to fabricate a cutting cell having good characteristics due to nonuniform cutting inside the wafer when the processing for forming a cutting cell is not sufficiently performed. For nanosecond lasers, the best wafer characteristics were obtained for fabrication of excellent cutting cells at a frequency of 500 kHz and a laser speed of 100 mm/s. However, the nanosecond laser has not been processed sufficiently in the condition of a number of times. As a result, it was confirmed that the wafer thickness was cut by $63{\mu}m$ of the cell thickness of $170{\mu}m$ in the condition of five times of laser process. It was found that more than 30% of the wafer thickness had to be processed to fabricate the cutting cell. After cutting the 6-inch cell having the voltage of 0.65 V, we obtained the voltage of about 0.63 V.

Development of Internal Laser Scribing System for Cutting of Sapphire Wafer in LED Chip Fabrication Processes (LED 칩 제조용 사파이어 웨이퍼 절단을 위한 내부 레이저 스크라이빙 시스템 개발)

  • Kim, Jong-Su;Ryu, Byung-So;Kim, Ki-Beom;Song, Ki-Hyeok;Kim, Byung-Chan;Cho, Myeong-Woo
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.14 no.6
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    • pp.104-110
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    • 2015
  • LED has added value as a lighting source in the illuminating industry because of its high efficiency and low power consumption. In LED production processes, the chip cutting process, which mainly uses a scribing process with a laser has an effect on quality and productivity of LED. This scribing process causes problems like heat deformation, decreasing strength. The inner laser method, which makes a void in wafer and induces self-cracking, can overcome these problems. In this paper, cutting sapphire wafer for fabricating LED chip using the inner laser scribing process is proposed and evaluated. The aim is to settle basic experiment conditions, determine parameters of cutting, and analyze the characteristics of cutting by means of experimentation.

Influence of process Parameters on the Surface Roughness and the Striation Formation of the Cut Section for the Case of Cutting of CSP 1N Sheet using High Power CW Nd:YAG Laser (고출력 CW Nd:YAG 레이저를 이용한 CSP1N 냉연강판 절단시 공정변수의 절단면 특성에 미치는 영향)

  • Ahn Dong-Gyu;Kim Min-Su;Park Hyung-Jun;Yoo Young-Tae
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.7 s.184
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    • pp.30-38
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    • 2006
  • Laser cutting technology is one of flexible rapid manufacturing technologies with various advantageous including a high cutting speed, manufacturing of parts with a complex shape and others. The quality of the cut part and the optimum cutting conditions are highly dependent on the combination of the process parameters. The objective of this research works is to investigate the influence of process parameters, such as power of laser, cutting speed of laser and material thickness, on the surface roughness and the striation formation of the cut section for the case of cutting of CSP 1N sheet using high power Nd:YAG Laser with a continuous wave (CW). In order to find the relationship between process parameters and the surface roughness and the striation formation of the cut section, several experiments are carried out. Through the investigation of the empirical results, it has been shown that the surface roughness is highly related to the striation formation, including the frequency and angle of the striation, of the cut section. From the results of experiments, an optimum cutting speed for each cutting condition has been obtained to improve both the quality of the cut surface and the cutting efficiency.

Part I Advantages re Applications of Slab type YAG Laser PartII R&D status of All Solid-State Laser in JAPAN

  • Iehisa, Nobuaki
    • Proceedings of the Korean Society of Laser Processing Conference
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    • 1998.11a
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    • pp.0-0
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    • 1998
  • -Part I- As market needs become more various, the production of smaller quantities of a wider variety of products becomes increasingly important. In addition, in order to meet demands for more efficient production, long-term unmanned factory operation is prevailing at a remarkable pace. Within this context, laser machines are gaining increasing popularity for use in applications such as cutting and welding metallic and ceramic materials. FANUC supplies four models of $CO_2$ laser oscillators with laser power ranging from 1.5㎾ to 6㎾ on an OEM basis to machine tool builders. However, FANUC has been requested to produce laser oscillators that allow more compact and lower-cost laser machines to be built. To meet such demands, FANUC has developed six models of Slab type YAG laser oscillators with output power ranging from 150W to 2㎾. These oscillators are designed mainly fur cutting and welding sheet metals. The oscillator has an exceptionally superior laser beam quality compared to conventional YAG laser oscillators, thus providing significantly improved machining capability. In addition, the laser beam of the oscillator can be efficiently transmitted through quartz optical fibers, enabling laser machines to be simplified and made more compact. This paper introduces the features of FANUC’s developed Slab type YAG laser oscillators and their applications. - Part II - All-solid-state lasers employing laser diodes (LD) as a source of pumping solid-state laser feature high efficiency, compactness, and high reliability. Thus, they are expected to provide a new generation of processing tools in various fields, especially in automobile and aircraft industries where great hopes are being placed on laser welding technology for steel plates and aluminum materials for which a significant growth in demand is expected. Also, in power plants, it is hoped that reliability and safety will be improved by using the laser welding technology. As in the above, the advent of high-power all-solid-state lasers may not only bring a great technological innovation to existing industry, but also create new industry. This is the background for this project, which has set its sights on the development of high-power, all-solid-state lasers with an average output of over 10㎾, an oscillation efficiency of over 20%, and a laser head volume of below 0.05㎥. FANUC Ltd. is responsible for the research and development of slab type lasers, and TOSHIBA Corp. far rod type lasers. By pumping slab type Nd: YAG crystal and by using quasi-continuous wave (QCW) type LD stacks, FANUC has already obtained an average output power of 1.7㎾, an optical conversion efficiency of 42%, and an electro-optical conversion efficiency of 16%. These conversion efficiencies are the best results the world has ever seen in the field of high-power all-solid-state lasers. TOSHIBA Corp. has also obtained an output power of 1.2㎾, an optical conversion efficiency of 30%, and an electro-optical conversion efficiency of 12%, by pumping the rod type Nd: YAG crystal by continuous wave (CW) type LD stacks. The laser power achieved by TOSHIBA Corp. is also a new world record in the field of rod type all-solid-state lasers. This report provides details of the above results and some information on future development plans.

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Modern Laser Technology and Metallurgical Study on Laser Materials Processing

  • Kutsuna, Muneharu
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.561-569
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    • 2002
  • Laser has been called a "Quantum Machine" because of its mechanism of generation since the development on July 7,1960.by T.H.Maiman. We can now use this machine as a tool for manufacturing in industries. At present, 45kW CO2 laser, 10kW Nd:YAG laser, 6kW LD pumped YAG laser and 4kW direct diode laser facilities are available for welding a heavy steel plate of 40mm in thickness and for cutting metals at high speed of 140m/min. Laser Materials Processing is no longer a scientific curiosity but a modern tool in industries. Lasers in manufacturing sector are currently used in welding, cutting, drilling, cladding, marking, cleaning, micro-machining and forming. Recently, high power laser diode, 10kW LD pumped YAG laser, 700W fiber laser and excimer laser have been developed in the industrialized countries. As a result of large numbers of research and developments, the modem laser materials processing has been realized and used in all kinds of industries now. In the present paper, metallurgical studies on laser materials processing such as porosity formation, hot cracking and the joint performances of steels and aluminum alloys and dissimilar joint are discussed after the introduction of laser facilities and laser applications in industries such as automotive industry, electronics industry, and steel making industry. The wave towards the use of laser materials processing and its penetration into many industries has started in many countries now. Especially, development of high power/quality diode laser will be accelerate the introduction of this magnificent tool, because of the high efficiency of about 50%, long life time and compact.

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