Development of Internal Laser Scribing System for Cutting of Sapphire Wafer in LED Chip Fabrication Processes
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Kim, Jong-Su
(QMC LTD.)
Ryu, Byung-So (QMC LTD.) Kim, Ki-Beom (School of Mechanical Engineering, INHA UNIV.) Song, Ki-Hyeok (School of Mechanical Engineering, INHA UNIV.) Kim, Byung-Chan (School of Mechanical Engineering, INHA UNIV.) Cho, Myeong-Woo (School of Mechanical Engineering, INHA UNIV.) |
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8 | Kim, B. C., "System Calibration Method for Silicon Wafer Warpage Measurement" J. Korean Soc. Manuf. Process Eng., Vol. 13, No. 6, pp. 139-144, 2014. DOI |
9 | Hwang. J. H., Kwak. T. S., Lee. D. W., Jung. M. W. and Lee S. M., "A Study on the ELID Grinding Properties of Single Crystal Sapphire Wafer using Ultrasonic Table", J. Soc. Manuf. Process Eng., Vol. 12, No. 4, pp. 75-80, 2013. |
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