• Journal of Welding and Joining
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• 제28권4호
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• pp.61-66
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• 2010

Silicon nitride is widely used as an engineering ceramics because it has high strength, abrasion resistance and corrosion resistance even at high temperature. However, machining of silicon nitride is difficult due to its high hardness and brittleness. Laser assisted machining(LAM) allows effective cutting using CBN tool by locally heating the cutting part to the softening temperature of YSiAlON using the laser beam. The effect of preheating depending on process parameters were studied to find out the oxidation mechanism. If silicon nitride is sufficiently preheated, the surface is oxidized and $N_2$ gas is formed and escapes from the material, thereby making the cutting process more advantageous. During laser preheating process before machining, high temperature results in strong oxidation which makes the bloating, silicate layers and micro cracks. Using the results of these experiments, preheating characteristics and oxidation behavior were found out.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1475-1480
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• 2007

In the last few years, lasers have found new applications in production engineering as tools for surface treatment, cutting, welding, drilling and marking. So far, the laser has mainly been used in special laser processing machines ('laser-only') directly integrated into a production line or serving as stand-alone stations in the workshop. By combining conventional metal cutting technologies with laser processes in one machine, complete processing of a workpiece with different technologies in one setting can be realized. The main advantages are a reduction of the material flow between the production machines, which leads to a reduction in processing time and logistics, and an enhancement of manufacturing quality due to the processing in one setting. In addition to this approach new processing technologies such as laser-assisted machining are possible.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 추계학술대회 논문집
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• pp.517-518
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• 2006

• 한국기계가공학회지
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• 제4권1호
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• pp.37-42
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• 2005

The localization of manufacturing technique development is actualizing for low cost with supplies of display devices. We need more high cutting technique because consumers want flat glasses of various sizes. Recently, most general two methods are normal wheel cutting and laser cutting, but both of them have some faults. First, the wheel cutting has cracks and sharp edges of sections. Second, it is easy for laser cutting to cut curved lines. however, it has thermal damage and low traverse speed. I suggest a new cutting method by high-wave frequency vibration wheel cutting(HFVC), which is good for quality improvement. Vertical cracks and crack depth is observed, after HFVC. When the average of the crack depth is $30{\mu}m$ and the average of the wallner liner depth is $200{\mu}m$, it has the most high quality of the sections in this experiment. As a result, when we consider between the normal wheel cutting method and the HFVC method, the latter has low cracks and good quality.

• 한국터널지하공간학회 논문집
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• 제15권5호
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• pp.469-481
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• 2013

워터젯 절삭기술을 이용한 자유면 생성에 있어서, 생성된 자유면 내부의 모니터링은 효율적인 작업 진행을 위해서 매우 중요하다. 본 연구에서는 레이저 센서를 이용하여 자유면 측정 실험을 수행하고 실질적 현장적용을 위한 변수의 영향 정도와 최적변수 범위를 제시하였다. 영향을 미치는 변수를 레이저의 분해각(angular resolution), 측정 이격거리(measurement distance), 그리고 자유면의 절삭형상(cutting shape)으로 나누어 실험 수행 및 결과 분석을 하였다. 그 결과 분해각과 측정 이격거리가 감소할수록 그리고 절삭 폭이 증가할수록 보다 정밀한 모니터링이 가능함을 확인할 수 있었다. 본 레이저 측정 시스템을 이용하면 자유면 형상과 깊이의 측정이 실제 현장에서 충분히 적용 가능할 것으로 판단된다.

• 대한전자공학회논문지SD
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• 제39권11호
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• pp.1-6
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• 2002

본 논문에서는 High speed DRAM의 speed 특성을 향상시키기 위한 Laser_Repair Condition 최적화의 한 방안을 구현하였다. 구현 방법은 먼저 Wafer내의 개별 Die별 DC Generator level을 확인하고 최약 DC Generator를 파악한 후 AC parameter의 margin을 check하고 AC parameter의 특성을 개선시킬 수 있는 DC Generator level을 forcing하여 test하여 개선 효과를 곧장 확인하였고 그에 대한 Fuse cutting inform을 생성하여 Laser_Repair 공정에서 적용하여 Post_Laser test시 개선 효과를 확인하였다.

• 제어로봇시스템학회논문지
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• 제8권5호
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• pp.419-424
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• 2002

After the patterning and probe process of wafer have been achieved, the dicing processing is necessary to separate chips from a wafer. The dicing process cuts a semiconductor wafer to lengthwise and crosswise directions to make many chips. The existing general dicing method is the mechanical cutting using a narrow circular rotating blade impregnated diamond particles or laser cutting. Inferior goods can be made by the mechanical or laser cutting unless several parameters such as blade, wafer, cutting water and cutting conditions are properly set. Moreover, we can not apply these general dicing method to that of GaN wafer, because the GaN wafer is harder than general semiconductor wafers such as GaAs, GaAsP, AIGaAs and so forth. In order to overcome these problems, this paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1994년도 추계학술대회 논문집
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• pp.156-160
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• 1994

Use of engineering ceramics has been increasing due to the outstanding physical and chemical properties. Conventional machining processes, however, are not applicable due to their hardness and brittleness. Laser cutting is a promising alternative for these ceramics. In this study, experimental data of CO $_{2}$ laser cutting of $Al_{2}$ $O_{3}$ and Si $_{3}$ N $_{4}$ are obtained to give a guide in the industry. Results of $Al_{2}$ $O_{3}$ cutting showed extreme weakness to thermal crack and it was found that pulsed beam has to be used for thick $Al_{2}$ $O_{3}$ specimen. Si $_{3}$ N $_{4}$ showed good results for both CW and pulsed beams. Using pulsed beam resulted narrower kerf width with increased surface roughness a nd reduced cutting speed. It was also found that a parameter call path energy is useful for representing minimum threshold value for possible cutting range with pulsed beam.

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 2000년도 추계학술발표대회 논문개요집
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• pp.7-9
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• 2000

• 한국레이저가공학회:학술대회논문집
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• 한국레이저가공학회 1999년도 춘계학술발표대회 논문개요집
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• pp.5-8
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• 1999