1 |
Assembly Technology, 'Dicing saw cuts wafers easily accurately,' Machine Design, vol. 66, no. 13, 1994
|
2 |
고경용, 차영엽, 최범식, '신호처리를 이용한 웨이퍼의 다이싱 상태 모니터링,' 한국정밀공학회지, 제17권, 제5호, pp. 70-75, 2000. 5
과학기술학회마을
|
3 |
고경용, 차영엽, 최범식, '역전파 알고리즘을 이용한 웨이퍼의 다이싱 상태 모니터링,' 제어 자동차 시스템공학회지, 제6권, 제6호, pp. 486-491, 2000. 6
과학기술학회마을
|
4 |
K.Subramanian, S.Ramanath, and M.Tricard, 'Mechanism of material removal in the pression production grinding of ceramics,' Journal of Manufacturing Science and Engineering, vol. 119, pp. 509-519, 1997
DOI
ScienceOn
|
5 |
S. Avagliano, N. Bianco, O. Manca, and V. Naso, 'Combined thermal and optical analysis of laser back-scribing for amorphous-silicon photovoltaic cells processing,' International Journal of Heat & Mass Transfer, vol. 42, no. 4, pp. 645-56, 1999
DOI
ScienceOn
|
6 |
I. T. Collier, M. R. J. Gibbs, and N. Seddon, 'Laser ablation and mechanical scribing in the amorphous alloys VAC 6030 and METGLAS 2605 SC,' Journal of Magnetism & Magnetic Materials, vol. 111, no. 3, pp. 260-272, 1992
DOI
ScienceOn
|
7 |
A. Hassui, A.E.Diniz, et al., 'Experimental evaluation on grinding wheel wear through vibration and acoustic emission,' Wear, vol. 217, pp. 7-14, 1998
DOI
ScienceOn
|
8 |
V. G. Oklobdzija and E. R. Barnes, 'On implementing addition in VLSI technology,' IBM T. J. Watson Research Center, 1988
|
9 |
A. Wang, J. Zhao, and M. A. Green, '24% efficient silicon solar cells,' Appl. Phys. Lett., vol. 57, no. 602, 1990
DOI
|
10 |
C. Chong, K. Davies, et al., 'Plasma grooved buried contact silicon solar cells,' Appl. Phys. Lett., vol. 69, no. 4135, 1991
DOI
|
11 |
S. R. Wenham, B. O. Chan, and C. B. Honsberg, 'Green MA. Beneficial and constraining effects of laser scribing in buried-contact solar cells,' Journal of Progress in Photovoltaics : Research & Applications, vol. 5, no. 2, pp. 131-137, 1997
DOI
ScienceOn
|