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http://dx.doi.org/10.5302/J.ICROS.2002.8.5.419

Development of Scribing Machine for Dicing of GaN Wafer  

Cha, Young-Youp (Dept.of Mechanical Engineering, Wonkwang University)
Go, Gyong-Yong (Dept.of Mechanical Engineering, Graduate School of Wonkwang University)
Publication Information
Journal of Institute of Control, Robotics and Systems / v.8, no.5, 2002 , pp. 419-424 More about this Journal
Abstract
After the patterning and probe process of wafer have been achieved, the dicing processing is necessary to separate chips from a wafer. The dicing process cuts a semiconductor wafer to lengthwise and crosswise directions to make many chips. The existing general dicing method is the mechanical cutting using a narrow circular rotating blade impregnated diamond particles or laser cutting. Inferior goods can be made by the mechanical or laser cutting unless several parameters such as blade, wafer, cutting water and cutting conditions are properly set. Moreover, we can not apply these general dicing method to that of GaN wafer, because the GaN wafer is harder than general semiconductor wafers such as GaAs, GaAsP, AIGaAs and so forth. In order to overcome these problems, this paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism.
Keywords
scribing machine; GaN wafer dicing; dicing machine; semiconductor wafer;
Citations & Related Records
Times Cited By KSCI : 4  (Citation Analysis)
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