• 제목/요약/키워드: large area patterning

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펨토초 레이저를 이용한 식품포장 필름의 표면 패터닝 및 특성 (Surface Patterning and Characterization of Food Packaging Films Using Femtosecond Laser)

  • 조영진
    • 한국포장학회지
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    • 제29권2호
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    • pp.111-118
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    • 2023
  • 본 연구에서 연속형 레이저와 나노초 레이저의 경우에는 고분자와 물성 조건이 맞지 않아서, 고분자 필름 표면에 특정 패터닝이 구현되지 않았다. 그러나, 펨토초 레이저를 활용하여 HDPE, PP, PET 등의 식품포장 필름의 표면에 패터닝이 구현됨을 확인하였다. 따라서, 본 연구에서 식품포장 필름에서 펨토초 레이저 패터닝 공정 조건을 확립하였고, 싱글 펄스에 의한 대면적 원형 패턴, 싱글 펄스를 30%를 중첩한 대면적 거칠기 패턴, 직선 패턴, 직선 패터닝을 중첩한 대면적 거칠기 패턴, 직선 패터닝을 교차하여 격자 패턴 등의 표면 패터닝 필름을 제작하였다. 또한, 표면 패턴 구조와 크기에 따른 패터닝 HDPE, PP, PET 필름은 SEM, AFM, 접촉각 분석을 통하여 그 특성을 확인하였다. 펨토초 레이저 패터닝을 하지 않은 각 대조군 필름의 표면 대비 대면적 원형 패터닝 HDPE 및 PP 필름, 싱글 펄스를 30%를 중첩한 대면적 거칠기 패터닝 및 직선 패터닝을 중첩한 대면적 거칠기 패터닝 PET 필름의 표면은 27.1-37.5°의 접촉각을 나타냄으로써, 패터닝 후에 HDPE, PP, PET 필름은 친수성 표면으로 변화되었다. 반면, 나노-마이크로 크기의 돌기 표면구조를 갖고 있는 대면적 격자 패터닝 HDPE 필름의 경우에는 120.4°의 접촉각을 보임으로써, 패터닝 후에 소수성 표면으로 변화되었다. 따라서, 패터닝을 통해 친수성 표면으로 바뀐 필름들은 단백질, 세포, 바이러스 등을 비롯하여 식품의 물질들이 달라붙지 못하거나, 쉽게 떨어지는 엔티파울링 응용분야에 활용이 가능하다. 또한, 향후 좀더 정밀한 나노 및 마이크로 돌기 구조를 갖는 격자 패터닝을 통해 150° 이상의 초소수성 표면을 제작하게 된다면, 자가 청소(Self-cleaning) 등의 초소수성 표면 응용분야에 활용 가능할 것이다.

클로로메틸 폴리이미드(CMPI) 박막과 근접장 나노 프로브 레이저 패터닝을 이용한 미세 형상 가공 기술 (Micro Patterning Using Near-Field Coupled Nano Probe Laser Photo Patterning Of Chloromethylated Polyimide Thin Film)

  • 최무진;장원석;김재구;조성학;황경현
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.369-372
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    • 2004
  • Photo-induced surface alignment is charming as a non-contact photo-patternable alignment technology which can be used in the next generation of displays, such as large area, multi-domain. For decades, many polymer film have been investigated and developed to be used in the photo alignment. Among these photoreactive materials, recently developed polyimide, Chloromethylated Polyimide(CMPI) now became the focus of interests in this area because of its high photosensitivity and superior thermal stability. In this report, we present micro patterning method to form the nanoscale structure by Mask-Less laser patterning using this CMPI film and NSOM probe.

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A Study on the Uniformity Improvement of Residual Layer of a Large Area Nanoimprint Lithography

  • Kim, Kug-Weon;Noorani, Rafigul I.;Kim, Nam-Woong
    • 반도체디스플레이기술학회지
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    • 제9권4호
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    • pp.19-23
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    • 2010
  • Nanoimprint lithography (NIL) is one of the most versatile and promising technology for micro/nano-patterning due to its simplicity, high throughput and low cost. Recently, one of the major trends of NIL is large-area patterning. Especially, the research of the application of NIL to TFT-LCD field has been increasing. Technical difficulties to keep the uniformity of the residual layer, however, become severer as the imprinting area increases. In this paper we performed a numerical study for a large area NIL (the $2^nd$ generation TFT-LCD glass substrate ($370{\times}470$ mm)) by using finite element method. First, a simple model considering the surrounding wall was established in order to simulate effectively and reduce the computing time. Then, the volume of fluid (VOF) and grid deformation method were utilized to calculate the free surfaces of the resist flow based on an Eulerian grid system. From the simulation, the velocity fields and the imprinting pressure during the filling process in the NIL were analyzed, and the effect of the surrounding wall and the uniformity of residual layer were investigated.

미세 임프린팅용 금속몰드의 급속가열을 위한 유도가열기구 개발 (Development of Induction Heating Apparatus for Rapid Heating of Metallic Mold)

  • 홍석관;이성희;허영무;강정진
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2007년도 춘계학술대회 논문집
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    • pp.199-204
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    • 2007
  • Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C$ to $150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.

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Soft-Lithographic Fabrication of Ni Nanodots Using Self-Assembled Surface Micelles

  • Seo, Young-Soo;Lee, Jung-Soo;Lee, Kyung-Il;Kim, Tae-Wan
    • Journal of Magnetics
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    • 제13권2호
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    • pp.53-56
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    • 2008
  • This study proposes a simple nano-patterning process for the fabrication of magnetic nanodot arrays on a large area substrate. Ni nanodots were fabricated on a large area (4 inches in diameter) Si substrate using the soft lithographic technique using self-assembled surface micelles of Polystyrene-block-Poly(methyl methacrylate) (PS-b-PMMA) diblock copolymer formed at the air/water interface as a mask. The hexagonal array of micelles was successfully transferred to a Ni thin film on a Si substrate using the Langmuir-Blodgett technique. After ion-mill dry etching, a magnetic Ni nanodot array with a regular hexagon array structure was obtained. The Ni nanodot array showed in-plane easy axis magnetization and typical soft magnetic properties.

Fabrication of An Organic Thin-Film Transistor Array by Wettability Patterning for Liquid Crystal Displays

  • Kim, Sung-Jin;Bae, Jin-Hyuk;Ahn, Taek;Suh, Min-Chul;Chang, Seung-Wook;Mo, Yeon-Gon;Chung, Ho-Kyoon;Lee, Sin-Doo
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.151-154
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    • 2007
  • We demonstrate a novel selective patterning process of a semiconducting polymer for channel regions to fabricate an array of organic thin-film transistors (OTFTs). This process is applicable for various organic films over large area. A reflective liquid crystal display based on the OTFT array was produced using the selective patterning through a wettability control.

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PDMS 쿠션을 갖는 Si 몰드에 의한 핫엠보싱 공정에서의 4 인치 웨이퍼 스케일 전사성 향상 (4 Inch Wafer-Scale Replicability Enhancement in Hot Embossing by using PDMS-Cushioned Si Mold)

  • 김흥규;고영배;강정진;허영무
    • 한국정밀공학회지
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    • 제23권8호
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    • pp.178-184
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    • 2006
  • Hot embossing is to fabricate desired pattern on the polymer substrate by pressing the patterned mold against the substrate which is heated above the glass transition temperature, and it is a high throughput fabrication method for bio chip, optical microstructure, etc. due to the simultaneous large area patterning. However, the bad pattern fidelity in large area patterning is one of the obstacles to applying the hot embossing technology for mass production. In the present study, PDMS pad was used as a cushion on the backside of the micro-patterned 4 inch Si mold to improve the pattern fidelity over the 4 inch PMMA sheet by increasing the conformal contact between the Si mold and the PMMA sheet. The pattern replicability improvement over 4 inch wafer scale was evaluated by comparing the replicated pattern height and depth for PDMS-cushioned Si mold against the rigid Si mold without PDMS cushion.