• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.247-251
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• 2002

In this paper the maximum current carrying capability of ACAs flip chip joint is investigated based on two failure mechanisms: (1) degradation of the interface between gold stud bumps and aluminum pads; and (2) ACA swelling between chips and substrates under high current stress. For the determination of the maximum allowable current, bias stressing was applied to ACAs flip chip joint. The current level at which current carrying capability is saturated is defined as the maximum allowable current. The degradation mechanism under high current stress was studied by in-situ monitoring of gold stud bump-aluminum pad ACA contact resistance and also ACA junction temperature at various current level. The cumulative failure distributions were used to predict the lifetime of ACAs flip chip joint under high current stressing. These experimental results can be used to better understand and to improve the current carrying capability of ACA flip chip joint.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.4
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• pp.1-9
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• 2002

The distribution characteristics of data retention time for DRAM was studied in connection with the probability distribution of the cell parameters. Using the cell parameters and the transient characteristics of cell node voltage, data retention time was investigated. The activation energy for dielectric layer growth on cell capacitance, the recombination trap energy for leakage current in the junction depletion region, and the sensitivity characteristics of sense amplifier were used as the random variables to perform the Monte Carlo simulation, and the probability distributions of cell parameters and distribution characteristics of cumulative failure bit on data retention time in DRAM cells were calculated. we found that the sensitivity characteristics of sense amplifier strongly affected on the tail bit distribution of data retention time.

• Journal of The Korean Society of Clinical Toxicology
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• v.18 no.1
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• pp.42-46
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• 2020

Tetramine toxicity due to sea snail ingestion is generally mild and has a good prognosis. Tetramine toxicity acts on the acetylcholine receptor, affecting the neuromuscular junction and autonomic nervous system. A 78-year-old female patient visited the emergency room with vomiting and dyspnea after eating sea snails. At the time of admission, the vital signs recorded were 140/80 mmHg-105/min-24/min-36.5℃, and 90% oxygen saturation. Arterial blood test revealed hypercapnia (pCO₂ 58.2 mmHg) and respiratory acidosis (pH 7.213, HCO₃^- 22.5 mmol/L), whereas other blood tests showed no specific findings. Due to decreased consciousness and hypoxia, endotracheal intubation and mechanical ventilation were administered to the patient. Successful weaning was accomplished after 12 hrs, and the patient was discharged without any further complications. Although tetramine toxicity rarely results in acute respiratory failure due to paralysis of the respiratory muscle, caution is required whilst treating the patient.

• Nuclear Engineering and Technology
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• v.31 no.3
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• pp.267-275
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• 1999

This paper deals with the industrial problem of thermal striping damage on the French prototype fast breeder reactor, Phenix and it was studied in coordination with the research program of IAEA. The thermomechanical and fracture mechanics evaluation procedure of thermal striping damage on the tee-junction of the secondary piping using Green's function method and standard FEM is presented. The thermohydraulic(T/H) loading condition used in the present analysis is the random type thermal loads computed by T/H analysis on the turbulent mixing of the two flows with different temperatures. The thermomechanical fatigue damage was evaluated according to ASME code section 111 subsection NH. The results of the fatigue analysis showed that fatigue failure would occur at the welded joint within 90,000 hours of operation. The assessment for the fracture behavior of the welded joint showed that the crack would be initiated at an early stage in the operation. It took 42,698.9 hours for the crack to propagate up to 5 mm along the thickness direction. After then, however, the instability analysis, using tearing modulus, showed that the crack would be arrested, which was in agreement with the actual observation of the crack. An efficient analysis procedure using Green's function approach for the crack propagation problem under random type load was proposed in this study. The analysis results showed good agreement with those of the practical observations.

• Journal of Aerospace System Engineering
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• v.10 no.2
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• pp.1-6
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• 2016

The thermal analysis of electronic equipment is required to predict the reliability of electronic equipment being loaded on a satellite. The transient heat transfer of electronic equipment that was developed recently has been generated using a large-scale integration circuit. If there is a transient heat transfer between EEE(Electric, Electronic and Electro mechanical) parts, it may lead to failure the satellite mission. In this study, we performed the thermal design and analysis for reliability of APD(Antenna Pointing Driver) electronics for activation of a spaceborne X-band 2-axis antenna. The EEE parts were designed using a thermal mathematical model without the thermal mitigation element. In addition, thermal analysis was performed based on the worst case for verifying the reliability of EEE parts. For the thermal analysis results, the thermal stability of electronic equipment has been demonstrated by satisfying the de-rating junction temperature.

• Journal of Power Electronics
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• v.16 no.5
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• pp.1843-1850
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• 2016

This study focused on predicting the fatigue life of an insulated gate bipolar transistor (IGBT) power module for electric locomotives. The effects of different wiring technologies, including aluminum wires, copper wires, aluminum ribbons, and copper ribbons, on solder fatigue life were investigated to meet the high power requirement of the IGBT module. The module's temperature distribution and solder fatigue behavior were investigated through coupled electro-thermo-mechanical analysis based on the finite element method. The ribbons attained a chip junction temperature that was 30℃ lower than that attained with conventional round wires. The ribbons also exhibited a lower plastic strain in comparison with the wires. However, the difference in plastic strain and junction temperature among the different ribbon materials was relatively small. The ribbons also exhibited different crack propagation behaviors relative to the wires. For the wires, the cracks initiated at the outmost edge of the solder, whereas for the ribbons, the cracks grew in the solder layer beneath the ribbons. Comparison of fatigue failure areas indicated that ribbon bonding technology could substantially enhance the fatigue life of IGBT modules and be a potential candidate for high power modules.

• Journal of Ocean Engineering and Technology
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• v.33 no.5
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• pp.411-420
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• 2019

It is essential to design crashworthy marine structures for operations in Arctic regions, especially ice-covered waters, where the structures must have sufficient capacity to resist iceberg impact. In this study, a numerical analysis of a colliding accident between an iceberg and stiffened plates was carried out employing the commercial finite element code ABAQUS/Explicit. The ice material model developed by Liu et al. (2011) was implemented in the simulations, and its availability was verified by performing some numerical simulations. The influence of the ambient temperature on the structural resistance was evaluated while the local stress, plastic strain, and strain energy density in the structure members were addressed. The present study revealed the risk of fracture in terms of steel embrittlement induced by ambient temperature. As a result, the need to consider the possibility of brittle failure in a plate-stiffener junction during operations in Arctic regions is acknowledged. Further experimental work to understand the structural behavior in a plate-stiffener junction and HAZ is required.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.10
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• pp.3199-3210
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• 1996

The buckling and postbuckling behaviors were sutdied analytically and experimentally for stiffened laminated composite panels under compression loading. The panels with I-, blade, -and hat-shapeed stiffeners were investigated. In the analysis, the stiffened panels were anlyzed using the nonlinear finite element method combined with an improved arc-length method. The progressive failure analysis was done by adopting the maximum stress criterion and complete unloading failure model. The effects of the fiber angles were investigated on the buckling and postbuckling behaviors. In the experiment, the web and the lower cap of each stiffener were formed by the continuous lay-up of the skin for cocuring the stiffened panels. Therefore, the separation between stiffener and skin was not found in the junction part even after postbuckling ultimate load and the stiffened panels had excellent postbuckling load carrying capacity. A shadow moire thchnique was used to monitor the out-of-plane deformations of the panels. The piezoelectric films were attached to the panels to get the failure characteristics of the panel. The analytical results on the buckling load, postbuckling ultimate load, and failure pattern showed good agreement with the experimental results.

• The Journal of Advanced Prosthodontics
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• v.8 no.6
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• pp.489-493
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• 2016

PURPOSE. This in-vitro study aimed to evaluate the fracture resistances and failure modes of endodontically treated mandibular premolars restored with endocrowns and conventional post-core retained crowns. MATERIALS AND METHODS. Thirty mandibular premolars were assigned into three groups (n=10): GI, intact teeth; GE, teeth with endocrowns; GC, teeth with conventional post-core supported crowns. Except for the teeth in group GI, all specimens were cut to 1.5 mm above the cementoenamel junction and endodontically treated. Both endocrowns and conventional crowns were fabricated from lithium-disilicate blocks using a CEREC 3D CAD/CAM unit. All specimens were subjected to thermocycling and then to $45^{\circ}$ oblique compressive load until fracture occurred. The fracture resistance and failure mode of each specimen were recorded. Data were analyzed with one-way ANOVA and LSD Post Hoc Test (${\alpha}=.05$). RESULTS. The fracture resistances of GE and GC were significantly lower than that of GI (P<.01), while no significant difference was found between GE and GC (P=.702). As of the failure mode, most of the specimens in GE and GC were unfavorable while a higher occurrence of favorable failure mode was presented in GI. CONCLUSION. For the restoration of mandibular premolar, endocrown shows no advantage in fracture resistance when compared with the conventional method. Both of the two methods cannot rehabilitate endodontically treated teeth with the same fracture resistances that intact mandibular premolars have.

• Journal of the Korean Solar Energy Society
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• v.38 no.3
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• pp.21-28
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• 2018

The objects of PV (Photovoltaic) monitoring system is to reduce the loss of system and operation and maintenance costs. In case of PV plants with configured of centralized inverter type, only 1 PV module might be caused a large loss in the PV plant. For this reason, the monitoring technology of PV module-level that find out the location of the fault module and reduce the system losses is interested. In this paper, a fault diagnosis algorithm are proposed using thermal and electrical characteristics of PV modules under failure. In addition, the monitoring system applied with proposed algorithm was constructed. The wireless sensor using LoRa chip was designed to be able to connect with IoT device in the future. The characteristics of PV module by shading is not failure but it is treated as a temporary failure. In the monitoring system, it is possible to diagnose whether or not failure of bypass diode inside the junction box. The fault diagnosis algorithm are developed on considering a situation such as communication error of wireless sensor and empirical performance evaluation are currently conducting.