• Applied Microscopy
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• 제45권4호
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• pp.189-194
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• 2015

Backside Ar ion milling technique for the preparation of cross-sectional transmission electron microscopy (TEM) specimens, and backside-ion milling combined with focused ion beam (FIB) operation for electron holography were introduced in this paper. The backside Ar ion milling technique offers advantages in preparing cross-sectional specimens having thin, smooth and uniform surfaces with low surface damages. The back-side ion milling combined with the FIB technique could be used to observe the two-dimensional p-n junction profiles in semiconductors with the sample quality sufficient for an electron holography study. These techniques have useful applications for accurate TEM analysis of the microstructure of materials or electronic devices such as arrayed hole patterns, three-dimensional integrated circuits, and also relatively thick layers (> $1{\mu}m$).

• 한국공작기계학회논문집
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• 제16권5호
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• pp.129-133
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• 2007

Focused Ion Beam(FIB) systems is a useful tool for the fabrication of micro-nano scale structures. In this study, the effects of FIB etching on the Au microstructure are systematically investigated. As the fabrication parameters, ion dose, dwell time and beam overlap ratio are studied. First, the increases of Ga ion dose makes the milling yield higher and the sidewall of milling profile steeper. Dwell time is found to have little effects on the milling profile due to the relatively large milling area of $1\times1{\mu}m^2$ used in this study. However, beam overlap significantly affects not only milling rate but also milling profile. As the beam overlap ratio changes from positive to negative, the development of regular cross-stripe patterns at the bottom with low milling rate is observed.

• Journal of Magnetics
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• 제5권1호
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• pp.23-25
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• 2000

We have investigated the effects of Ar and$O_2$-ion milling on the exchange coupling field ($H_{ex}$) and coercive field ($H_c$) at the interfaces between substrates and NiO/NiFe films, to understand the exchange biasing mechanism. The $O_2$-ion milling was successfully performed by means of the electron cyclotron resonance (ECR) process. We found that the local roughness gradient of the NiO surface increased by $O_2$-ion milling. The ratio of $H_{ex}/H_c$ increased from 0.87 to 1.77, whereas $H_c$ decreased by almost a half as a results of the ion milling. The decrease in $H_c$could be interpreted as due to the refinement of magnetic domain size, which arose from the increase of the local roughness gradient of the NiO surface. The decrease in low $H_c$, and increase in $H_{ex}$ in NiO spin valves by ECR-ion milling are in the right direction far use in magnetoresistance (MR) heads.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.785-786
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• 2011

• Applied Microscopy
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• 제34권2호
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• pp.95-102
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• 2004

본 실험에서는 tripod polishing 방법을 이용하여 Pd/GaN/Sapphire 박막, PZT/MgO/Si 박막, 304 stainless steel 분말, $Mo_5Si_3/Mo_2B$ diffusion couple의 매우 다양한 물성이 포함된 불균질 재료의 TEM 시편을 제작하고 분석하였다. Tripod polishing을 사용하여 시편을 준비하면 시편의 종류에 관계없이 시편의 선단부에 매우 광범위한 전자빔 투과 영역을 지닌 TEM 시편을 얻을 수 있었으며, Pd/GaN/Sapphire 박막, PZT/MgO/Si 박막과 같이 기판이 경한 반도체 재료의 경우에는 연마 정도가 균일하며 연마과정 동안 오염이 심하지 않기 때문에 ion milling으로 cleaning 없이 TEM 관찰이 가능하다. 한편 304 stainless steel 분말과 같은 금속재료의 경우 짧은 시간의 ion milling 은 시편의 오염 제거에 도움된다. $Mo_5Si_3/Mo_2B$ diffusion couple에 형성된 실리사이드는 큰 취성 때문에 polishing 동안 시편이 깨지는 현상으로 전자가 투과할 수 있을 정도의 연마가 불가능하여 1시간 정도 ion milling 연마가 필요하다. Tripod polishing으로 TEM 시편을 준비하면 분석하고자 하는 지역을 정확하고도 넓게 연마할 수 있다. 또한 비교적 짧은 시간 내에 ion milling 없이 TEM 시편을 제작할 수 있기 때문에 ion milling에서 유발되는 여러 가지 문제점들을 해결할 수 있는 장점이 있었다. 그러나 tripod polishing은 전부 수작업으로 시편을 준비하기 때문에 시편을 제작하는 과정 동안 매우 세심한 주의가 요구되며 제작자의 숙련도와 경험을 필요로 하는 단점이 있다.

• Applied Microscopy
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• 제50권
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• pp.22.1-22.6
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• 2020

In-situ transmission electron microscopy (TEM) holders that employ a chip-type specimen stage have been widely utilized in recent years. The specimen on the microelectromechanical system (MEMS)-based chip is commonly prepared by focused ion beam (FIB) milling and ex-situ lift-out (EXLO). However, the FIB-milled thin-foil specimens are inevitably contaminated with Ga⁺ ions. When these specimens are heated for real time observation, the Ga⁺ ions influence the reaction or aggregate in the protection layer. An effective method of removing the Ga residue by Ar⁺ ion milling within FIB system was explored in this study. However, the Ga residue remained in the thin-foil specimen that was extracted by EXLO from the trench after the conduct of Ar⁺ ion milling. To address this drawback, the thin-foil specimen was attached to an FIB lift-out grid, subjected to Ar⁺ ion milling, and subsequently transferred to an MEMS-based chip by EXLO. The removal of the Ga residue was confirmed by energy dispersive spectroscopy.

• Applied Microscopy
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• 제51권
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• pp.19.1-19.7
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• 2021

The main purpose of this paper is the preparation of transmission electron microscopy (TEM) samples from the microsized powders of lithium-ion secondary batteries. To avoid artefacts during TEM sample preparation, the use of ion slicer milling for thinning and maintaining the intrinsic structure is described. Argon-ion milling techniques have been widely examined to make optimal specimens, thereby making TEM analysis more reliable. In the past few years, the correction of spherical aberration (Cs) in scanning transmission electron microscopy (STEM) has been developing rapidly, which results in direct observation at an atomic level resolution not only at a high acceleration voltage but also at a deaccelerated voltage. In particular, low-kV application has markedly increased, which requires a sufficiently transparent specimen without structural distortion during the sample preparation process. In this study, sample preparation for high-resolution STEM observation is accomplished, and investigations on the crystal integrity are carried out by Cs-corrected STEM.

• Applied Microscopy
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• 제36권2호
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• pp.47-55
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• 2006

이 논문에서 Al-2.5Cu-1.5Mg wt.% 합금에서 미세한 Cu 석출물에 대한 투과전자현미경 관찰이 보고 되었다. 이 새로운 관찰은 시료에 오염된 산화물을 제거하기 위해 ion milling을 하고 곧바로 시료 관찰을 했을 때 우연히 이루어 졌다. 특히 이 Cu석출물은 $150^{\circ}C$에서 100시간 aging한 시료에서 분명하게 관찰되었다. 그리고 ion milling 전 시료표면에서 분명히 관측되는 산화물은 $Cu_2O$임이 확실히 밝혀졌다. 이러한 분석과정은 회절 환 패턴의 정밀 분석을 요구함으로 이에 대한 시뮬레이션에 필요한 이론적 공식도 만들었다. 마지막으로 이 합금에 대한 예기치 않은 ion milling효과와 그 중요성이 논의되었다.

• 한국정밀공학회지
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• 제28권2호
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• pp.245-250
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• 2011

A high-resolution shadow mask, a nanostencil, is widely used for high resolution lithography. This high-resolution shadowmask is often fabricated by a combination of MEMS processes and focused ion beam (FIB) milling. In this study, FIB milling on 500-nm-thin SiN membrane was tested and characterized. 500 nm thick and $2{\times}2$ mm large membranes were made on a silicon wafer by micro-fabrication processes of LPCVD, photolithography, ICP etching and bulk silicon etching. A subsequent FIB milling enabled local membrane thinning and aperture making into the thinned silicon nitride membrane. Due to the high resolution of the FIB milling process, nanoscale apertures down to 60 nm could be made into the membrane. The nanostencil could be used for nanoscale patterning by local deposition through the apertures.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2002년도 춘계 학술발표강연 및 논문개요집
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• pp.36-36
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• 2002