• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 춘계학술발표대회 논문집
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• pp.155-158
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• 2002

Fabrication process of metal/intermetallic laminated composites by using self-propagating high temperature synthesis(SHS) reactions between Ni and Al elemental metal foils have been investigated. Al foils were sandwiched between Ni foils and heated in a vacuum hot press to the melting point of aluminium. SHS reaction kinetics was thermodynamically analyzed through the final volume fraction of the unreacted Al related with the initial thickness ratio of Ni:Al and diffusion bonding stage before SHS reaction. Thermal aging of laminated composites resulted in the formation of functionally gradient series of intermetallic phases. Microstructure showed that the main phases of intermetallics were NiAl and $Ni_3Al$ having higher strength at room and high temperatures. The volume fractions of intermetallic phases were measured as 82.4, 58.6, 38.4% in 1:1, 2:1, 4:1 initial thickness ratio of Ni:Al.

• 열처리공학회지
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• 제31권3호
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• pp.97-103
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• 2018

The objective of this study is to develop the mechanical properties of AlSiCu aluminum alloy by the two-step solution heat treatment. The microstructure of gravity casting specimen represents a typical dendrite structure having a secondary dendrite arm spacing (SDAS) of 40 mm. In addition to the Al matrix, a large amount of coarsen eutectic Si phase, $Al_2Cu$ intermetallic phase, and Fe-rich phases are generated. The eutectic Si phases are fragmented and globularized with solution heat treatment. Also, the $Al_2Cu$ intermetallic phase is resolutionized into the Al matrix. The $2^{nd}$ solution temperature at $525^{\circ}C$ might be a optimum condition for enhancement of mechanical properties of AlSiCu aluminum alloy.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1295-1300
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• 2008

During the manufacturing and the service life of Au-Al wire bonded electronic packages, the ball bonds experience elevated temperatures and hence accelerated thermal diffusion reactions that promote the transformation of the Au-Al phases and the IMC growth. In this paper, the IC under high temperature storage (HTS) tests at $175^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ are meticulously investigated. Thermal exposure resulted in the IMC growth, Kirkendall void and the crack of the Au-Al phases. The crack propagation occurs resulting in the failure of the Au-Al ball bonds. As the IC was exposed at the high temperature, decreased in the lifetime.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2003년도 춘계학술발표회 초록집
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• pp.31-32
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• 2003

In the Present study, the effect of galvannealing conditions on the phase distribution of the Zn-Fe intermetallic phases in the coating layer of the galvannealed steel sheets(GA) was investigated in an interstitial free steel and two kinds of high strength steels. The composition profiles of the coating layers were analyzed using AA and EDS analysis, and the distribution of the intermetallic phases was examined with the aids of X-ray diffraction. On the basis of the pole figure and OIM analyses, it was clarified that the preferred orientation of the $\zeta$ phase depended on the development of the $\gamma$-fibre texture in the substrate.

• Composites Research
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• 제16권3호
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• pp.68-74
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• 2003

본 논문에서는 Ni과 Al 금속박판 사이의 자전고온반응을 이용한 금속간화합물/금속 적층복합재료의 제조시 제조공정 조건이 최종 미세조직에 미치는 영향을 연구하였다. 열분석을 통하여 Ni과 Al사이의 반응은 먼저 NiA1$_3$가 핵생성­성장 기구에 의해 생성된 후 다시 Ni$_2$A1$_3$로 확산변태됨을 확인하였다. 자전고온반응을 열역학적으로 해석하여 금속박판의 두께비(Ni:Al) 및 반응전 열처리와 반응후 미세조직에서 잔류한 Al의 부피분율과의 관계를 정립하였다. 후열처리 공정에 의해 Ni/Nl$_3$Al/NiAl의 적층구조와 각 두께비에서 82%(1:1), 59.5%(2:1), 40%(4:1)의 부피분율을 가지는 금속간화합물/금속적층복합재료를 얻을 수 있었다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 추계학술발표대회 논문집
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• pp.60-63
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• 2002

Metal/intermetallic laminated composites have been manufactured by SHS reactions between Ni and Al elemental metal foils. Microstructure showed that the intermetallic volume fraction was 55%, 45%, 35% in the 1:1, 2:1, 4:1 thickness ratio(Ni:Al) specimen and the main phases of the intermetallic were transformed from $Ni_2Al_3$ to NiAl when the thickness ratio was increased. Tensile strength and elongation were increased when the volume fraction of Ni metallic phase was increased. Under assumptions of isostrain condition, the tensile strength of metal/intermetallic laminated composites didn't obey the ROM due to the thermal residual stress and this was confirmed by X-ray residual stress analysis. Fracture toughness results by the SENB test showed R-curves with upward curvature based on LSB condition. Bridging stress based on LSB condition was determined by the curve fitting analysis, In-situ observed microstructure during fracture test showed that the various bridging mechanism such as crack bridging, crack branching and ductile failure of metallic layer were occurred

• 한국기계가공학회지
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• 제17권3호
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• pp.102-108
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• 2018

The objective of this study is to develop the mechanical properties of an AlSiCu aluminum alloy using the two-step solution heat treatment. The microstructure of the gravity casting specimen represents a typical dendrite structure with a secondary dendrite arm spacing (SDAS) of 40 um. In addition to the Al matrix, a large amount of coarsen eutectic Si phase, $Al_2Cu$ intermetallic phase, and Fe-rich phases is generated. The eutectic Si phases are fragmented and globularized with the solution heat treatment. The $Al_2Cu$ intermetallic phase is also resolutionized into the Al matrix. The $2^{nd}$ solution temperature at $525^{\circ}C$ may be an optimal condition to enhance the mechanical properties of the AlSiCu aluminum alloy.

• 한국분말재료학회지
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• 제21권5호
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• pp.338-342
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• 2014

In the present work, we investigated the mechanical alloying of binary Ga-Se(1:1) and Ga-Te(1;1) sysyems. The high-energy ball-milling was performed at $40^{\circ}C$ where one of constituents (Ga) is molten state. The purpose of the work was to see whether reactions between constituent elements are accelerated by the presence of a liquid phase. During the ball-milling, the liquid Ga phase completely disappeared and the resulting powders consist of nanocrystalline grain of ~20 nm with partly amorphized phases. However, no intermetallic compounds formed in spite of the presence of the liquid phases which has much higher diffusivity than solid constituents. By subsequent heat-treatments, the intermetallic compounds such as GaSe and GaTe formed at relatively low temperatures. The formation temperature of theses compound was much lower than those predicted by equilibrium phase diagram. The comparison of the ball-milled powders with un-milled ones indicated that the easy formation of intermetallic compound or allying occurs at low temperatures.

• 열처리공학회지
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• 제28권4호
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• pp.190-199
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• 2015

The study is intended to investigate the effect of solution treatment on microstructure and corrosion behavior of AZ91(Mg-9%Al-1%Zn-0.3%Mn)-2%Ca casting alloy. In as-cast state, the AZ91-2%Ca alloy consisted of intermetallic ${\beta}(Mg_{17}Al_{12})$, $Al_8Mn_5$ and $Al_2Ca$ phases in ${\alpha}-(Mg)$ matrix. After the solution treatment, Al within the ${\alpha}-(Mg)$ matrix was distributed more homogeneously, along with the slight decrease in the total amount of intermetallic compounds. The corrosion resistance of the AZ91-2%Ca alloy was improved after the solution treatment. The microstructural examinations for the solution-treated samples revealed that the better corrosion resistance may well be related to the incorporation of more oxides and hydroxides such as $Al_2O_3$, $Al(OH)_3$, CaO and $Ca(OH)_2$ into the surface corrosion product without dissolution of the intermetallic phases along the grain boundaries.

• 한국재료학회지
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• 제18권1호
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• pp.45-50
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• 2008

Microstructural evolution and the intermetallic compound (IMC) growth kinetics in an Au stud bump were studied via isothermal aging at 120, 150, and $180^{\circ}C$ for 300hrs. The $AlAu_4$ phase was observed in an Al pad/Au stud interface, and its thickness was kept constant during the aging treatment. AuSn, $AuSn_2,\;and\;AuSn_4$ phases formed at interface between the Au stud and Sn. $AuSn_2,\;AuSn_2/AuSn_4$, and AuSn phases dominantly grew as the aging time increased at $120^{\circ}C,\;150^{\circ}C,\;and\;180^{\circ}C$, respectively, while $(Au,Cu)_6Sn_5/Cu_3Sn$ phases formed at Sn/Cu interface with a negligible growth rate. Kirkendall voids formed at $AlAu_4/Au$, Au/Au-Sn IMC, and $Cu_3Sn/Cu$ interfaces and propagated continuously as the time increased. The apparent activation energy for the overall growth of the Au-Sn IMC was estimated to be 1.04 eV.