• Tribology and Lubricants
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• v.34 no.2
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• pp.67-73
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• 2018

Ni-Al intermetallic coating technology is an available method for the strengthening of aluminum substrate. In this study, Ni-Al intermetallics were coated on an aluminum substrate through a reaction synthesis process at a temperature lower than melting point of aluminum. And the sliding wear properties of the coatings have been investigated to verify their usability and compared the wear properties with those of a cast Al-12.5%Si alloy and an anodizing layer on aluminum. Results show that the wear rate of the coating layer greatly increased at 1 m/s and 1.5 m/s when compared with that of the cast Al-12.5%Si alloy. Much pitting damages were observed on the worn surfaces at these sliding speeds, unlike at other sliding speeds. The wear of the intermetallic coating layer at these sliding speeds seems to be increased by pitting as a consequence of adhesion. In contrast, wear of the coating layer at other speeds hardly occurs, regardless of wear periods. Nevertheless, the wear properties of the intermetallic coating layer on the aluminum substrate through the reaction synthesis process are more stable than those of anodized aluminum and are superior to those of the cast Al-12.5%Si alloy in a steady-state wear period.

• Tribology and Lubricants
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• v.28 no.2
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• pp.56-61
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• 2012

In order to investigate the possibility of Ni-Al based intermetallics coating onto aluminum substrate, the coating process for induction heating has been evaluated by microscopically analyzing the intermetallic layers coated at temperatures lower than the melting temperature of aluminum. The coating layers were divided into two parts with different microstructure along the depth. Hard $NiAl_3$ layer was found at lower parts of the coatings near the interface with aluminum substrate. This layer was formed by the diffusion of aluminum atoms from the substrate into the coating layer across the interface during the induction heating. Meanwhile, at the upper parts of the coating near the surface, a large amount of un-reacted Ni was still remained and surrounded by several Ni-Al based intermetallic compounds, such as $Ni_3Al$, NiAl and $Ni_2Al_3$ formed by the lattice diffusion.

• Tribology and Lubricants
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• v.27 no.1
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• pp.1-6
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• 2011

The possibility of Cu-Al-Ni intermetallic coating on the mild steel through the combustion synthesis has been investigated. In particular, the effect of the ball milling energy on the microstructure of the coating layer was examined to obtain the best coating condition. Experimental results show that Cu-Al-Ni powder compact was explosively synthesized and successfully coated with the steel matrix. It was revealed that the formation of $Cu_9Al_4$ intermetallic decreased with increase in the ball milling energy. This result supports that the high energy ball milling would be effective for obtaining the most suitable microstructure for Cu-Al-Ni coating layer. However, the excessive ball milling energy seems to decrease the bonding strength between the coating layer and the matrix.

• Journal of Welding and Joining
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• v.14 no.4
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• pp.62-70
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• 1996

Al or Al-alloy have been known to be able to be claded on various materials by using explosive welding process, however, the intermetallic layer frequently formed along the interface have made this process very complicated. In this study, it was focussed to select the process variables, which can get rid of interfacial layer in the Al-claded steel plate. As a result, it was demonstrated that there was a certain range of explosive thickness which did not form the intermetallic phase as well as the non-bonded area. On the other hand, ultasonic tests performed for identifying the presence of interfacial layer nondestructively showed that it could be applied for the intended purpose but its result was weakly related with the microstructural quality of interface.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.179-183
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• 2007

A plate heat exchanger (PHE) normally uses vacuum brazing technology for connecting plates and fins. However, the reliability of high temperature brazing, especially with nickel-based filler metals containing boron the formation of brittle intermetallic compounds (IMCs) in brazed joints is of major concern. since they considerably degrade the mechanical properties. This research was examined the vacuum brazing of commercially SUS304 stainless steel with BNi-2 (Ni-Cr-B-Si) filler metal, and discussed to determine the influence of brazing temperatures on the microstructure and mechanical strength of brazed joints. In the metallographic analysis it is observed that considerable large area of Cr-B intermetallic compound phases at the brazing layer and the brazing tensile strength is related to removal of this brittle phase greatly. The mechanical properties of brazing layer could be stabilized through increasing the brazing temperature over $100^{\circ}C$ more than melting temperature of filler metals, and diffusing enough the brittle intermetallic compound formed in the brazing layer to the base metal.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.487-492
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• 2002

The growth kinetics of intermetallic compound layers formed between eutectic Sn-58Bi solder and (Cu, electroless Ni-P/Cu) substrate were investigated at temperature between 70 and 120 C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energies of Cu$_{6}$Sn$_{5}$ and Ni$_3$Sn$_4$ intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P were 127.9 and 81.6 kJ/mol, respectively.ely.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.2067_2068
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, $Cu_6Sn_5({\mu})$ and $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface. $Cu_6Sn_5({\mu})$ intermetallics layer gradually changed $Cu_3Sn({\varepsilon})$. Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only $Cu_3Sn({\varepsilon})$ intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.8
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• pp.1559-1565
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(${\mu}$) and Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(${\mu}$) intermetallics layer gradually changed Cu3Sn(${\varepsilon}$). Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.43-49
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• 2007

Thickness of intermetallic compounds and consumption rates of under bump metallurgies (UBMs) were investigated in wafer-level solder bumping with variations of UBM materials and reflow times. In the case of Cu UBM, $0.6\;{\mu}m-thick$ intermetallic compound layer was formed before reflow of Sn solder, and the average thickness of the intermetallic compound layer increased to $4\;{\mu}m$ by reflowing at $250^{\circ}C$ for 450 sec. On the contrary, the intermetallic layer had a thickness of $0.2\;{\mu}m$ on Ni UBM before reflow and it grew to $1.7\;{\mu}m$ thickness with reflowing for 450 sec. While the consumption rates of Cu UBM were 100nm/sec fur 15-sec reflow and 4.50-sec for 450-sec reflow, those of Ni UBM decreased to 28.7 nm/sec for 15-sec reflow and 1.82 nm/sec for 450-sec reflow.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.95-95
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• 2009

Zinc coatings provide the most effective and economical way of protecting steel against corrosion. There are three types of galvanizing lines typically used in production line in galvanizing industries,Galvanize (GI) coating (Zn-0.1-0.3%Al), Galfan coating (Zn-5%Al), Galvalume(GL) coating (45%Zn-Al). In continuous Galvanizing lines, the immersed bath hardware (e.g. bearings, sink, stabilizer, and corrector rolls, and also support roll arms and snout tip) are subjected to corrosion and wear failure. Understanding the reaction of these materials with the molten Zn alloy is becomes scientific and commercial interest. To investigate the reaction with molten Zn alloys, static immersion test performed for 4, 8, 16, and 24 Hr. Two different baths used for the static immersion, which are molten Zn and molten Zn-55%Al. Microstructures characterization of each of the materials and intermetallic layer formed in the reaction zone was performed using optical microscope, SEM and EDS. The thickness of the reaction layer is examined using image analysis to determine the kinetics of the reaction. The phase dominated by two distinct phase which are eutectic carbide and matrix. The morphology of the intermetallic phase formed by molten Zn is discrete phase showing high dissolution of the material, and the intermetallic phase formed by Zn-55wt%Al is continuous. Aluminum reacts readily with the materials compare to Zinc, forming iron aluminide intermetallic layer ($Fe_2Al_5$) at the interface and leaving zinc behind.