• Korean Journal of Materials Research
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• v.31 no.12
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• pp.672-676
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• 2021

In this paper, the effect of Ni (0, 0.5 and 1.0 wt%) additions on the microstructure, mechanical properties and electrical conductivity of cast and extruded Al-MM-Sb alloy is studied using field emission scanning electron microscopy, and a universal tensile testing machine. Molten aluminum alloy is maintained at 750 ℃ and then poured into a mold at 200 ℃. Aluminum alloys are hot-extruded into a rod that is 12 mm in diameter with a reduction ratio of 39:1 at 550 ℃. The addition of Ni results in the formation of Al₁₁RE₃, AlSb and Al3Ni intermetallic compounds; the area fraction of these intermetallic compounds increases with increasing Ni contents. As the amount of Ni increases, the average grain sizes of the extruded Al alloy decrease to 1359, 536, and 153 ㎛, and the high-angle grain boundary fractions increase to 8, 20, and 34 %. As the Ni content increases from 0 to 1.0 wt%, the electrical conductivity is not significantly different, with values from 57.4 to 57.1 % IACS.

• Transactions of Materials Processing
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• v.31 no.4
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• pp.179-185
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• 2022

The influence of post-roll bonding heat treatment conditions such as temperature and time on the variation in the diffusion layer, generated at the bonding interface and the subsequent mechanical properties of the roll-bonded Ti grade 1/Al1050/Ti grade 1 sheets, was systematically investigated. The intermetallic compound (IMC) phase generated by post heat treatment conditions adopted in this study was obviously indexed as monolithic TiAl₃. Whereas the thickness of IMC layer generated by annealing at 500 ℃ was approximately 100 nm scale, it drastically increased above 1.5 ㎛ when annealed at 600 ℃. Uniaxial tensile and peel tests were then performed to compare mechanical properties. As a result, the bonding strength drastically increased above 7.9 N/mm by annealing at 600 ℃, which implies that proper annealing condition was a prerequisite, to improving interface bonding strength as well as global elongation properties for Ti/Al/Ti 3-ply sheet.

• Nuclear Engineering and Technology
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• v.54 no.11
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• pp.4062-4071
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• 2022

Long-term aluminum (Al) corrosion tests were designed to investigate the condition that would generate severe Al corrosion and precipitation. Buffer agents of sodium tetraborate (NaTB), trisodium phosphate (TSP) and sodium hydroxide (NaOH) were adopted. The insulation materials, fiberglass and calcium silicate (Ca-sil), were examined to explore their effects on Al corrosion. The results show that significant precipitates were formed in both NaTB/TSP-buffered solutions at high pH. The precipitates formed in NaTB solution raise more concerns on chemical effects in GSI-191. A passivation layer formed on the surfaces of coupon in solution with the presence of insulations could effectively mitigate Al corrosion. The Fe-enriched intermetallic particles (IPs) embedded in coupon appeared to serve as seeds to readily induce precipitation via providing extra area for heterogeneous Al hydroxide precipitation. X-ray spectroscopy (EDS) and X-ray diffraction (XRD) analyses indicate that the precipitates are mainly boehmite (γ-AlOOH) and no direct evidence confirms the presence of sodium aluminum silicate or calcium phosphate.

• Corrosion Science and Technology
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• v.23 no.4
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• pp.302-309
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• 2024

The purpose of this study was to elucidate effects of a thin (tens to hundreds of nanometers) Ni-flash coating layer on hydrogen embrittlement (HE) and liquid metal embrittlement (LME) in ultra-high-strength electrogalvanized steel with a tensile strength of more than 1 GPa. Various experimental and analytical methods, including thermal desorption spectroscopy, slow strain rate testing, resistance spot welding, X-ray diffraction, and metallographic observation, were employed. Results showed that an increase in Ni target amount for flash coating resulted in a decrease in diffusible hydrogen content during electrogalvanizing, resulting in a significant decrease in HE sensitivity. Moreover, a Ni target amount of more than 1000 mg/m² drastically reduced the occurring frequency and average depth of LME. This reduction could be primarily attributed to formation of Zn-Ni intermetallic phases during the welding process that could inhibit liquefaction of intermetallic phases in the heat-affected zone. This study provides a desirable Ni target amount for Ni-flash coating on ultra-high-strength steels conducted in a continuous galvanizing line or a high-speed batch line to achieve high resistance to both HE and LME.

• Archives of Metallurgy and Materials
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• v.65 no.3
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• pp.1045-1049
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• 2020

This research describes effects of Si addition on microstructure and mechanical properties of the Al-Cr based alloys prepared manufactured using gas atomization and SPS (Spark Plasma Sintering) processes. The Al-Cr-Si bulks with high Cr and Si content were produced successfully using SPS sintering process without crack and obtained fully dense specimens close to nearly 100% T. D. (Theoretical Density). Microstructure of the as-atomized Al-Cr-Si alloys with high contents of Cr and Si was composed multi-phases with hard and thermally stable such as Al₁₃Cr₄Si₄, AlCrSi, Al₈Cr₅ and Cr₃Si intermetallic compounds. The average hardness values were 703 Hv for S5, 698 Hv for S10 and 824 Hv for S20 alloy. Enhancement of hardness value was resulted from the formation of the multi-intermetallic compound with hard and thermally stable and fine microstructure by the addition of high Cr and Si using rapid solidification and SPS process.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.25-30
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• 2015

SAC-coated Cu specimens were fabricated by novel pad finish process using a phenomenon that metal nanoparticles less than 20 nm in diameter melted at a temperature lower than the melting point of bulk metal, and their wettabilities were evaluated. The thickness of SAC305 layer coated at low temperature of $160^{\circ}C$ using SAC305 ink was extremely thin as the level of several nanometers. It was analyzed by Auger electron spectroscopy that $Cu_6Sn_5$ intermetallic layer with a thickness of 10~100 nm and $Cu_3Sn$ intermetallic layer with a thickness of 50~150 nm were sequentially formed under the SAC305 coating layer. The thickness of formed intermetallic layers was thicker in electroplated Cu than rolled Cu, which attributed to improved surface roughness in the electroplated Cu. The improved surface roughness induces the contact, melting, and reaction of a larger number of SAC305 nanoparticles per the unit area of Cu specimen. In the wetting angle test using SAC305 solder balls, the Cu coated with SAC305 through the low temperature process presented evidently low wetting angles than those in non-coated Cu, indicating that only a few nanometer-thick SAC305 coating layer on Cu could also cause the enhancement of wettability.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.15-20
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• 2007

Growth kinetics of intermetallic compound (IMC) at various interface in Cu pillar bump during aging have been studied by thermal aging at 120, 150 and $165^{\circ}C$ for 300h. In result, $Cu_6Sn_5\;and\;Cu_3Sn$ were observed in the Cu pillar/SnPb interface and IMC growth followed parabolic law with increasing aging temperatures and time. Also, growth kinetics of IMC layer was faster for higher aging temperature with time. Kirkendall void formed at interface between Cu pillar and $Cu_3Sn$ as well as within the $Cu_3Sn$ layer and propagated with increasing time. $(Cu,Ni)_6Sn_5$ formed at interface between SnPb and Ni(P) after reflow and thickness change of $(Cu,Ni)_6Sn_5$ didn't observe with aging time. The apparent activation energies for growth of total $(Cu_6Sn_5+Cu_3Sn),\;Cu_6Sn_5\;and\;Cu_3Sn$ intermetallics from measurement of the IMC thickness with thermal aging temperature and time were 1.53, 1.84 and 0.81 eV, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.49-55
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• 2011

The failure of electronic instruments is mostly caused by heat and shock. This shock causes the crack initiation at the solder joint interface of PCB component which is closely related with the formation of intermetallic compound(IMC). The Ag content in Pb-free Sn-xAg-0.5Cu solder alloy used in this study was 1.0, 1.2 and 3.0 wt.%, respectively. After soldering with PCB component, isothermal aging was performed to 1000 hrs. The growth of IMC layer was observed during isothermal aging. The drop impact property of solder joint was evaluated by impact bending test method. The solder joint made with the solder containing lower Ag content showed better impact bending property compared with that with higher Ag content. On the contrary to this result, the solder joint made with solder containing higher Ag content showed better impact bending property after aging. It should be caused by the formation of fine $Ag_3Sn$, which relieved the impact. It showed consequently the different effect of fine $Ag_3Sn$ and coarse $Cu_6Sn_5$ particles formed in the IMC layer on the impact bending property.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.17-24
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• 2008

Thermal annealing and electromigration test were performed at $150^{\circ}C$ and $150^{\circ}C,\;5{\times}10^4\;A/cm^2$ conditions, respectively, in order to compare the growth kinetics of intermetallic compound(IMC) in Cu pillar bump. The quantitative interfacial adhesion energy with annealing was measured by using four-point bending strength test in order to assess the effect of IMC growth on the mechanical reliability of Cu pillar bump. Only $Cu_6Sn_5$ was observed in the Cu pillar/Sn interface after reflow. However, $Cu_3Sn$ formed and grew at Cu pillar/$Cu_6Sn_5$ interface with increasing annealing and stressing time. The growth kinetics of total($Cu_6Sn_5+Cu_3Sn$) IMC changed when all Sn phases in Cu pillar bump were exhausted. The complete consumption time of Sn phase in electromigration condition was faster than that in annealing condition. The quantitative interfacial adhesion energy after 24h at $180^{\circ}C$ was $0.28J/m^2$ while it was $3.37J/m^2$ before annealing. Therefore, the growth of IMC seem to strongly affect the mechanical reliability of Cu pillar bump.