• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.10 no.4
• /
• pp.292-296
• /
• 2000

Mechenochemical reaction by planetary type ball mill is applied to prepare $Sm_2$$Fe_{17}$$N_{x}$ permanent magnet powders. Starting from pure samarium and iron powders, the formation process of hard magnetic $Sm_2$$Fe_{17}$$N_{x}$ phase by ball milling and a subsequent solid state reaction were studied. At as-milled stage powders were found to consist of amorphous Sm-Fe and $\alpha$-Fe phases in all composition of $Sm_2$$Fe_{100-x}$(x = 11, 13, 15). The dependence of starting composition of elemental powder on the formation of Sm-Fe intermetallic compound was investigated by heat treatment of as-milled powders. When Sm concentration was 15 at%, heat-treated powder consists of mostly $Sm_2$$Fe_{17}$$N_{x}$single phase. For synthesizing of hard magnetic $Sm_2$$Fe_{17}$$N_{x}$ compound, additional nitriding treatment was carried out under $N_2$gas atmosphere at $450^{\circ}C$. The increase in the coercivity and remanence was parallel to the nitrogen content which increased drastically at first and then gradually as the nitriding time was extended. The ball-milled Sm-Fe-N powders were expected to be prospective materials for synthesizing of permanent magnet with high performance.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.3
• /
• pp.11-17
• /
• 2009

The drop impact reliability comes to be important for evaluation of the life time of mobile electronic products such as cellular phone. The drop impact reliability of solder joint is generally affected by the kinds of pad and reflow number, therefore, the reliability evaluation is needed. Drop impact test proposed by JEDEC has been used as a standard method, however, which requires high cost and long time. The drop impact reliability can be indirectly evaluated by using high speed shear test of solder joints. Solder joints formed on 3 kinds of surface finishes OSP (Organic Solderability Preservation), ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) was investigated. The shear strength was analysed with the morphology change of intermetallic compound (IMC) layer according to reflow number. The layer thickness of IMC was increased with the increase of reflow number, which resulted in the decrease of the high speed shear strength and impact energy. The order of the high speed shear strength and impact energy was ENEPIG > ENIG > OSP after the 1st reflow, and ENEPIG > OSP > ENIG after 8th reflow.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.2
• /
• pp.23-27
• /
• 2017

This paper proposes an approach to predict the reliability of high temperature heaters by identifying their primary failure modes and mechanisms in the field. Test specimens were designed to have the equivalent stress conditions with the high temperature heaters in the field in order to examine the effect of stress conditions on the solder joint failures. There failures often result from cracking due to intermetallic compound (IMC) or void formation within a solder joint. Aging tests have been performed by exposing the test specimens to a temperature of $170^{\circ}C$ in order to reproduce solder joint failures in the field. During the test, changes in IMC formation were investigated by scanning electron microscopy (SEM) on the cross-sections of the test specimens, while changes in void formation were monitored both by resistance spectroscopy and by micro-computed tomography (microCT), alternately. The test results demonstrated the void volume within the solder increased as the time at the high temperature increased. Also, the phase shift of high frequency resistance was found to have high correlation with the void volume. These results implied the failure of high temperature heaters can be non-destructively predicted based on the correlation.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.02a
• /
• pp.135-135
• /
• 2010

In Mn-Ge equilibrium phase diagram, many Mn-Ge intermetallic phases can be formed with difference structures and magnetic properties. The MnGe has the cubic structure and antiferromagnetic(AFM) with Neel temperature of 197 K. The calculation predicted that the $MnGe_2$ with $Al_2Cu$-type is hard to separate between the paramagnetic(PM) states and the AFM states because this compound displays PM and AFM configuration swith similar energy. Mn-doped Ge showed the FM with Currie temperature of 285 K for bulk samples and 116 K for thin films. In addition, the $Mn_5Ge_3$ compound has hexagonal structure and FM with Curie temperature around 296K. The $Mn_{11}Ge_8$ compound has the orthorhombic structure and Tc is low at 274 K and spin flopping transition is near to 140 K. While the bulk $Mn_3Ge_2$ exhibited tetragonal structure ($a=5.745{\AA}$;$c=13.89{\AA}$) with the FM near to 300K and AFM below 150K. However, amorphous $Mn_3Ge_2$ ($a-Mn_3Ge_2$) was reported to show spin glass behavior with spin-glass transition temperature (Tg) of 53 K. In addition, the transition of crystalline $Mn_3Ge_2$ shifts under high pressure. At the atmospheric pressure, $Mn_3Ge_2$ undergoes the magnetic phase transition from AFM to FM at 158 K. The pressure dependence of the phase transition in $Mn_3Ge_2$ has been determined up to 1 GPa. The transition was found to occur at 1 GPa and 155 K with dT/dP=-0.3K/0.1 GPa. Here report that Ferromagnetic $Mn_3Ge_2$ thin films were successfully grown on GaAs(001) and GaSb(001) substrates using molecular beam epitaxy. Our result revealed that the substrate facilitates to modify magnetic and electrical properties due to tensile/compressive strain effect. The spin-flopping transition around 145 K remained for samples grown on GaSb(001) while it completely disappeared for samples grown on GaAs(001). The antiferromagnetism below 145K changed to ferromagnetism and remained upto 327K. The saturation magnetization was found to be 1.32 and $0.23\;{\mu}B/Mn$ at 5 K for samples grown on GaAs(001) and GaSb(001), respectively.

• Korean Journal of Materials Research
• /
• v.9 no.3
• /
• pp.288-294
• /
• 1999

In the flip chip interconnection using solder bump, the Under Bump Metallurgy (UBM) is required to perform multiple functions in its conversion of an aluminum bond pad to a solderable surface. In this study, various UBM systems such as $Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 5\mu\textrm{m}, Al 1\mu\textrm{m} / Ti 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}, al 1\mu\textrm{m}/Ni 0.2\mu\textrm{m} / Cu 1\mu\textrm{m} and Al 1\mu\textrm{m}/Pd 0.2\mu\textrm{m} / Cu 1\mu\textrm{m}$ for flip chip interconnection using the low melting point eutectic 63Sn-37Pb solder were investigated and compared to their metallurgical properties. $100\mu\textrm{m}$ size bumps were prepared for using an electroplating process. The effects of the number of reflows and aging time on the growth of intermetallic compounds(IMC) were investigated. $Cu_6Sn_5$ and $Cu_3Sn$ IMC were abserved after aging treatment in the UBM system with thick coper $(Al 1\mu\textrm{m}/Ti 0.2\mu\textrm{m}/Cu 5\mu\textrm{m})$. However only the $Cu_6Sn_5$ was detected in the UBM system with $1\mu\textrm{m}$ thick copper even after 2 reflow and 7 day aging at $150^{\circ}C$. Complete Cu consumption by Cu-Sn IMC growth gives rise to a direct contact between solder inner layer such as Ti, Ni and Pd, and hence to possibly cause reactions between two of them. In this study, however, only for the Pd case, IMC of PdSn. was observed by Cu consumption. UBM interfacial reactions with s이der affected the adhesion strength ot s이der balls after s이der reflow and annealing treatment.

• Journal of the Microelectronics and Packaging Society
• /
• v.26 no.3
• /
• pp.43-49
• /
• 2019

In this study, a new approach using graphene oxide (GO) powder-composited Sn-3.0Ag-0.5Cu(in wt.%) solder paste for improving the bending reliability of solder joints between a flexible substrate and small outline package (SOP) was suggested. The GO addition slightly affected the melting temperature, however, the change in the melting temperature was not significant. Meanwhile, we observed the addition of GO could suppress IMC growth and IMC thickness of solder joint during the reflow process. Moreover, the cyclic bending test was also performed for evaluation of reliability in solder joint and we could improve the cyclic bending reliability of solder joint by adding GO powders. For 0.2 wt.% of GO added to the solder joint, the bending lifetime was increased to 20% greater than that without GO. Pull strength and ductility of the solder joint with GO were also higher than those of the joint without GO and it was assumed that this effect by adding GO could contribute to improve cyclic bending reliability of solder joint.

• Journal of the Korean Magnetics Society
• /
• v.4 no.1
• /
• pp.7-11
• /
• 1994

Ferromagnetic resonance experiment was performed to study the variations of micromagnetic structure with heat treatment of melt spun $Fe_{76}Cu_{1}Nb_{3}Si_{14}B_{6}$ alloy for 1h at every $50^{\circ}C$ in the temperature range of $400^{\circ}C-700^{\circ}C$. The variations of micromagnetic structure was discussed qualitatively in terms of the variations of line width ${\Delta}H_{p-p}$ and resonance magnetic field $H_{res}$. With increasing armealing temperature to $400^{\circ}C$, ${\Delta}H_{p-p}$ decreases and $H_{res}$ increases due to the decrease in magnetic anisotropy resulting from structural relaxation during heat treatment. With increasing annealing temperature from 400 to $500^{\circ}C$, ${\Delta}H_{p-p}$ increases and $H_{res}$ decreases due to the increase in magnetic anisotropy resulting from the formation of nanocrystalline particles embedded in an amorphous matrix. With increasing armealing temperature from 500 to $550^{\circ}C$, ${\Delta}H_{p-p}$ decreases and $H_{res}$ increases due to the decrease in magnetic anisotropy resulting from the formation of homogeneous nanocrystalline structure with a minor amorphous phase. Further increase in armealing temperature above $550^{\circ}C$ C causes ${\Delta}H_{p-p}$ to increase and $H_{res}$ to decrease due to the increase in magnetic anisotropy due to the formation of inhomogeneous grain structure and intermetallic compounds.

• Journal of Korea Foundry Society
• /
• v.39 no.2
• /
• pp.26-31
• /
• 2019

In this study, the mechanical characteristics and microstructure of hypereutectic Al-17Si-5Fe extruded alloys prepared by a rapid solidification process (RSP) were investigated. The hypereutectic Al alloy was fabricated by means of RSP and permanent casting. For RSP, the Al alloy melted at $920^{\circ}C$, cooling the specimens at a rate of $10^6^{\circ}C/s$ when the RSP was used, thus allowing the refining of primary Si particles more than when using permanent casting, at a rate of about 91%. We tested an extrusion RSP billet and a permanent-cast billet. Before the hot-extrusion process, heating to $450^{\circ}C$ took place for one hour. The samples were then hotextruded with a condition of extrusion ratio of 27 and a ram speed of 0.5 mm/s. Microstructural analyses of the extruded RSP method and the permanent casting method were carried out with OM and SEM-EDS mapping. The mechanical properties in both cases were evaluated by Vickers micro-hardness, wear resistance and tensile tests. It was found that when hypereutectic Al-17Si-5Fe alloys were fabricated by a rapid solidification method, it becomes possible to refine Si and intermetallic compounds. During the preparation of the hypereutectic Al-17Si-5Fe alloy by the rapid solidification method, the pressure of the melting crucible was low, and at faster drum speeds, smaller grain alloy flakes could be produced. Hot extrusion of the hypereutectic Al-17Si-5Fe alloy during the rapid solidification method required higher pressure levels than hot extrusion of the permanent mold-casted alloy. However, it was possible to produce an extruded material with a better surface than that of the hot extruded material processed by permanent mold casting.

• Journal of Korea Foundry Society
• /
• v.41 no.3
• /
• pp.235-240
• /
• 2021

We present the effect of the critical cooling rate during rapid solidification on the nucleation of precipitates in an Fe₇₅B₁₃P₅Nb₂Hf₁C₄ (at.%) alloy. The thermophysical properties of the rapidly solidified Fe₇₅B₁₃P₅Nb₂Hf₁C₄ liquids, which were obtained at various cooling rates with various sizes of gas-atomized powder during a high-pressure inert gas-atomization process, were evaluated. The cooling rate of the small-particle powder (≤20 ㎛) was 8.4×10⁵ K/s, which was 13.5 times faster than that of the large-particle powder (20 to 45 mm; 6.2×10⁴ K/s) under an atomized temperature. A thermodynamic calculation model used to predict the nucleation of the precipitates was confirmed by the microstructural observation of MC-type carbide in the Fe₇₅B₁₃P₅Nb₂Hf₁C₄ alloy. The primary carbide phase was only formed in the large-particle gas-atomized powder obtained during solidification at a slow cooling rate compared to that of the small-particle powder.

• Korean Journal of Metals and Materials
• /
• v.47 no.3
• /
• pp.147-154
• /
• 2009

The effect of carbon addition on the microstructures and mechanical properties of $Ni_3Al$ and TiAl intermetallic alloys have been characterized. It is shown that carbon is not only an efficient solid solution strengthener in $Ni_3Al$ and TiAl, it is also an efficient precipitation strengthener by fine dispersion of carbide. Transmission electron microscope investigation has been performed on the particle-dislocation interactions in $Ni_3Al$ and TiAl intermetallics containing various types of fine precipitates. In an $L1_2$-ordered $Ni_3Al$ alloy with 4 mol.% of chromium and 0.2~3.0 mol.% of carbon, fine octahedral precipitates of $M_{23}C_6$ type carbide, which has the cube-cube orientation relationship with the matrix, appear during aging. Typical Orowan loops are formed in $Ni_3Al$ containing fine dispersions of $M_{23}C_6$ particles. In the L10-ordered TiAl containing 0.1~2.0 mol.% carbon, TEM observations revealed that needle-like precipitates, which lie only in one direction parallel to the [001] axis of the $L1_0$ matrix, appear in the matrix and preferentially at dislocations. Selected area electron diffraction (SAED) patterns analyses have shown that the needle-shaped precipitate is $Ti_3AlC$ of perovskite type. The orientation relationship between the $Ti_3AlC$ and the $L1_0$ matrix is found to be $(001)_{Ti3AlC}//(001)_{L10\;matrix}$ and $[010]_{Ti3AlC}//[010]_{L10\;matrix}$. By aging at higher temperatures or for longer period at 1073 K, plate-like precipitates of $Ti_2AlC$ with a hexagonal structure are formed on the {111} planes of the $L1_0$ matrix. The orientation relationship between the $(0001)_{Ti2AlC}//(111)_{L10\;matrix}$ is and $[1120]_{Ti2AlC}//[101]_{L10\;matrix}$. High temperature strength of TiAl increases appreciably by the precipitation of fine carbide. Dislocations bypass the carbide needles at further higher temperatures.